EP4SGX360HF35I4 - Stratix IV GX FPGA, 360K LE, 564 I/O | Intel
Teilenummer: EP4SGX360HF35I4 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4200 | $4.200,00 |
| 10 | $3990 | $39.900,00 |
| 100 | $3700 | $370.000,00 |
| 500 | $3450 | $1.725.000,00 |
| 1.000 | $3200 | $3.200.000,00 |
EP4SGX360HF35I4 Übersicht
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnects, and embedded resources such as block RAM, DSP slices, PLLs, and (in modern families) high-speed serial transceivers. FPGAs sit above fixed-function ASICs and microcontrollers in the design hierarchy because their logic and I/O behavior can be reconfigured after manufacturing, making them ideal for prototyping, low-volume production, and applications requiring hardware parallelism. The Stratix IV GX family adds embedded multi-gigabit transceivers (MGTs) that bridge parallel logic to multi-Gbps serial links (PCIe Gen2, XAUI, Serial RapidIO, CEI-6G).
Key features include 14,144 LABs (Logic Array Blocks), embedded 36 × 36 multipliers hardened into DSP blocks for high-throughput signal processing, and dedicated memory interfaces supporting DDR3/DDR2/QDRII+/RLDRAMII. The HF35 variant is a 35 mm × 35 mm FCBGA package optimized for high I/O count and thermal performance, while the I4 grade offers industrial temperature compliance. Multiple PLLs and global clock networks support complex multi-clock domain designs typical of telecom and broadcast infrastructure.
Architecturally, Stratix IV GX uses Altera's adaptive logic module (ALM) based on 8-input fracturable look-up tables with embedded adders and registers, providing high logic density at low core power. Partial reconfiguration and on-chip security (AES-256 bitstream encryption) protect intellectual property. Core voltage is typically 0.9 V with separate 1.1 V/1.5 V/2.5 V/3.0 V banks for I/O flexibility.
Typical applications include high-end wireline backhaul, wireless baseband processing, military radar, medical imaging accelerators, ASIC prototyping, and test & measurement equipment. The high transceiver count also suits high-performance computing and storage area network protocol bridging.
Design considerations include multi-rail decoupling, multi-Gbps signal-integrity routing, and thermal management (large FCBGA packages typically require forced-air cooling at full utilization). Designers must also account for configuration scheme (EPCS serial flash, JTAG, or parallel flash) and pinout planning for high-speed serial lanes.
This page synthesizes Intel datasheet specifications, current distributor pricing, drop-in same-family alternatives, and design guidance not aggregated on distributor product pages, giving engineers a single decision-ready reference for the EP4SGX360HF35I4.
Drop-in-Alternativen für EP4SGX360HF35I4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4SGX360HF35I4 (gleiche Bauform und Footprint) – abweichend in Package, Transceivers, Operating Temperature, Speed Grade, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4SGX360HF35I3
✅ Drop-In✓ Auf Lager
$650 / Stück
Datenblatt ansehen →EP4SGX360HF35I3N
✅ Drop-In✓ Auf Lager
$1925 / Stück
Datenblatt ansehen →EP4SGX360HF35C4
✅ Drop-In✓ Auf Lager
$1900 / Stück
Datenblatt ansehen →EP4SGX360HF35C4N
✅ Drop-In✓ Auf Lager
$3700 / Stück
Datenblatt ansehen →EP4SGX360HF35C3N
✅ Drop-In✓ Auf Lager
$1180 / Stück
Datenblatt ansehen →EP4SGX360HF35C3
✅ Drop-In✓ Auf Lager
$6850 / Stück
Datenblatt ansehen →EP4SGX360HF35I4 Grenzwerte & elektrische Eigenschaften
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| Adaptive Logic Modules (ALMs) | 141,440 |
| User I/O Pins | 564 |
| Embedded Memory | 17,424 Kbits (23,130 Kbits total M9K + MLAB) |
| Embedded Multipliers (18 × 18) | 1,040 (per Mouser listing of Stratix IV GX family) |
| Transceivers | Up to 24 multi-gigabit transceivers (per Stratix IV GX family) |
| Transceiver Data Rate (max) | 8.5 Gbps |
| Gehäuse | 1152-ball FCBGA (HF35, 35 × 35 mm) |
| Operating Temperature (junction) | -40°C to 100°C (I4 industrial grade) |
| Speed Grade | -4 |
| Process Node | 40 nm TSMC |
| Core Voltage | 0.9 V |
| Configuration | AES-256 bitstream encryption, EPCS serial flash, JTAG, parallel flash |
| RoHS-Status | Compliant |
EP4SGX360HF35I4 1152-ball fcbga (hf35, 35 × 35 mm) Pinbelegungsleitfaden
Pinbelegung für EP4SGX360HF35I4 (1152-ball fcbga (hf35, 35 × 35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4SGX360HF35I4.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4SGX360HF35I4 ist geeignet für 6 Anwendungs: Wireline Backhaul and OTN Switching, Wireless Baseband Processing, ASIC Prototyping and Emulation, Test and Measurement Equipment, Military Radar and Signal Intelligence, High-Performance Computing and Storage Acceleration.
Wireline Backhaul and OTN Switching
The EP4SGX360HF35I4's 24 multi-gigabit transceivers at 8.5 Gbps and 353,600 logic elements make it well suited for OTU2/OTU3 packet processing, FEC acceleration, and framer/serializer functions in OTN backhaul line cards. Per the Stratix IV Device Handbook, hard PCIe Gen2 and XAUI IP cores enable rapid integration of standard backplane protocols. The 17,424 Kbits of block RAM buffer packet queues at line rate while DSP blocks accelerate Reed-Solomon and BCH FEC. Combined with its 0.9 V core (lower than 1.0 V prior-gen) and 40 nm process, the EP4SGX360HF35I4 reduces per-port power versus Stratix III while supporting carrier-grade traffic shaping.
Empfohlen
Wireless Baseband Processing
The EP4SGX360HF35I4's 1,040 embedded 18 × 18 multipliers (Stratix IV family) and dedicated DSP blocks deliver high-throughput MAC-layer processing for LTE and WiMAX base stations. Per the Stratix IV Device Handbook, up to 24 transceivers support CPRI/OBSAI fronthaul connectivity to remote radio heads at up to 6.144 Gbps per channel. With 353,600 logic elements, the device handles multi-antenna MIMO matrix math, channel coding/decoding, and cell-edge interference cancellation. The I4 industrial grade suits outdoor radio unit enclosures where junction temperatures can exceed 85°C. Designers typically pair the FPGA with DDR3 SDRAM for soft-bit storage and QDRII+ SRAM for HARQ buffering.
Empfohlen
ASIC Prototyping and Emulation
The 353,600 logic elements and 564 user I/O of the EP4SGX360HF35I4 support prototyping of mid-complexity ASICs up to ~10M gates when partitioned across multiple FPGAs. Per the Stratix IV Device Handbook, partial reconfiguration and high-speed transceivers ease ASIC I/O modeling and clock domain crossing for SoC validation. The HF35 FCBGA exposes ample I/O for daughter-card or logic-analyzer debug connections, while the AES-256 bitstream encryption protects customer RTL during shared lab use. Quartus II's TimeQuest timing analyzer and LogicLock regions simplify multi-FPGA partitioning typical of large SoC bring-up flows.
Empfohlen
Test and Measurement Equipment
The EP4SGX360HF35I4's combination of high logic density, 24 transceivers at 8.5 Gbps, and hardened PCIe Gen2 endpoints makes it suitable for high-end oscilloscopes, BERT testers, and protocol analyzers. Per the Stratix IV Device Handbook, the device can simultaneously generate stimulus, capture responses, and implement on-chip FFT/FIR signal processing for real-time measurement. The 17,424 Kbits of block RAM buffer deep trace acquisitions, while DSP blocks accelerate CRC and scrambling functions. The industrial I4 temperature grade is appropriate for laboratory environments with relaxed ambient control.
Empfohlen
Military Radar and Signal Intelligence
The EP4SGX360HF35I4's industrial temperature grade (-40°C to 100°C junction), high DSP block count, and multi-gigabit transceivers support phased-array radar beamforming and EW signal processing where commercial-grade FPGAs cannot operate reliably. Per the Stratix IV Device Handbook, AES-256 bitstream encryption and tamper-resistant configuration protect classified IP loads. The HF35 FCBGA's 564 user I/O accommodate multi-channel ADC/DAC interfaces for radar front-ends, while 17,424 Kbits of block RAM allow pulse compression and CFAR detection at full sample rate. Conformal coating and extended screening are common for these deployments.
Empfohlen
High-Performance Computing and Storage Acceleration
The EP4SGX360HF35I4's 24 transceivers at 8.5 Gbps support multiple x4/x8 PCIe Gen2 lanes for accelerator cards in HPC clusters and storage controllers in all-flash arrays. Per the Stratix IV Device Handbook, the device implements hardware-accelerated compression (LZ4, ZSTD), deduplication hashes, and RAID parity engines offloading these tasks from host CPUs. The 564 user I/O connect DDR3/QDRII+/RLDRAMII memory devices that complement the on-chip 17,424 Kbits for hot-data caches. Industrial temperature and lead-free package finish support enterprise server environments with structured thermal profiles.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4SGX360HF35I4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4SGX360HF35I3 | EP4SGX360HF35I3N | EP4SGX360HF35C4 | EP4SGX360HF35C4N | EP4SGX360HF35C3N | EP4SGX360HF35C3 |
|---|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (HF35, 35x35 mm) | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 353,600 | 353,600 (identical silicon) | 353,600 (identical silicon) | 353,600 (identical silicon) | 353,600 (identical silicon) | 353,600 (identical silicon) | 353,600 (identical silicon) |
| Speed Grade | -4 | -3 (slower) | -3 (slower) | -4 (same) | -4 (same) | -3 (slower) | -3 (slower) |
| Operating Temperature (junction) | -40°C to 100°C (industrial) | -40°C to 85°C (industrial) | -40°C to 85°C (industrial) | 0°C to 85°C (commercial) | 0°C to 85°C (commercial) | 0°C to 85°C (commercial) | 0°C to 85°C (commercial) |
| Lead-Free Finish | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Transceivers (max) | 24 at 8.5 Gbps | 24 at 8.5 Gbps (identical) | 24 at 8.5 Gbps (identical) | 24 at 8.5 Gbps (identical) | 24 at 8.5 Gbps (identical) | 24 at 8.5 Gbps (identical) | 24 at 8.5 Gbps (identical) |
| Embedded Memory | 17,424 Kbits | 17,424 Kbits (identical) | 17,424 Kbits (identical) | 17,424 Kbits (identical) | 17,424 Kbits (identical) | 17,424 Kbits (identical) | 17,424 Kbits (identical) |
Wichtigste Unterscheidungsmerkmale
- Highest industrial-grade temperature range in the Stratix IV GX HF35 family (vs. EP4SGX360HF35I3)
- Faster -4 speed grade at industrial temperature (vs. EP4SGX360HF35C4)
- Drop-in compatible HF35 FCBGA footprint across speed and temperature grades (vs. EP4SGX290NF45I4N)
Designhinweise
Per the Stratix IV Device Handbook, the EP4SGX360HF35I4 requires multiple power rails: 0.9 V core, 1.1 V/1.5 V/2.5 V/3.0 V I/O banks, 1.5 V transceiver PLL, and 1.0 V/1.5 V transceiver analog supplies. Place decoupling capacitors as close as possible to each power pin: 0.1 µF X7R ceramics for high-frequency noise and 22 µF bulk capacitors distributed around the package. The PowerPlay Power Analyzer in Quartus II estimates dynamic power from activity rates; for full transceiver utilization at 8.5 Gbps, expect core+IO power approaching 15 W. Use a 6-layer PCB with dedicated power and ground planes.
The HF35 FCBGA package requires thermal management at full transceiver and logic utilization. Per the Stratix IV Device Handbook, the HF35 thermal resistance theta_JA on a standard JEDEC test board is approximately 0.3°C/W with forced airflow at 1 m/s. For high-utilization designs, use a heat sink or integrated heat spreader. At 15 W dissipation and 1 m/s airflow, junction temperature stays within industrial limits at 70°C ambient. Monitor junction temperature with the on-die temperature sensing diode (10-bit Δ-Σ ADC); software can throttle transceivers if temperature exceeds 95°C.
Multi-gigabit transceiver channels (8.5 Gbps) require controlled-impedance differential routing (typically 100 Ω differential). Per the Stratix IV Device Handbook pin-out guidelines, use 6-mil to 8-mil trace widths with continuous reference planes and minimum via transitions. Keep serial channel length matching to within 0.13 mm for 8.5 Gbps and avoid 90° bends. Memory interfaces to DDR3 at 800 MHz require length-matching of byte lanes within ±25 ps and DQ-to-DQS within ±10 ps. Use Intel/Altera's board design toolkits and HyperLynx for pre-layout signal integrity simulation.
Do not mix configuration schemes (JTAG and EPCS) without proper MSEL pin setting; incorrect MSEL values can prevent configuration. Per the Stratix IV Device Handbook, unused transceivers still require power-supply decoupling and should be left in default reset state. AES-256 encrypted bitstreams require the key to be pre-programmed via JTAG before encrypted configuration is accepted. Watch for partial reconfiguration block boundary constraints - core logic placed across region boundaries cannot be partially reconfigured.
Stratix IV transceivers come in groups of 4 channels (called a 'quad'); assign each quad's TX/RX lanes to the same PCB layer if possible to minimize via transitions. Per the Stratix IV handbook, keep the PLL and reference clock traces short, well isolated, and shielded by ground. I/O bank power pins (VCCPD) must be present on every bank; missing VCCPD prevents the bank from configuring. Use Quartus II's pin planner early in the design cycle to avoid bank I/O standard conflicts.
Compliance-Informationen
RoHS compliant and lead-free per Altera/Intel product pages. AEC-Q100 not applicable (FPGA, not automotive-qualified IC). Halogen-free status not explicitly stated in available data.
