EPF10K100EQC208-1 - 100K Gate FLEX-10KE FPGA, 147 I/O | Altera
Teilenummer: EPF10K100EQC208-1 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $293.32 | $293,32 |
| 10 | $280 | $2.800,00 |
| 100 | $260 | $26.000,00 |
| 500 | $240 | $120.000,00 |
| 1.000 | $220 | $220.000,00 |
EPF10K100EQC208-1 Übersicht
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose logic blocks, interconnect, and I/O cells are configured by the designer after manufacture via a configuration bitstream. The FLEX 10KE family belongs to the broader taxonomy of programmable logic -> CPLD/FPGA -> SRAM-based FPGA -> embedded-array FPGA -> power management/communications glue logic. The "-1" speed grade indicates the slowest commercial speed bin, trading timing margin for lower cost, while "QC208" denotes the quad flat-pack 208-pin pinout (208-BFQFP) and "E" denotes the FLEX 10KE sub-series.
Key features include 49,152 RAM bits distributed across embedded array blocks (EABs), 147 user I/O pins, a 2.5 V core supply (per the Altera-micro attribute block) with 3.3 V multi-voltage I/O support, and in-system programmability through the serial configuration interface. The 208-BFQFP footprint is one of the largest Altera offered in the FLEX 10KE generation and is frequently preferred over BGA alternatives when board-level rework is required. The part is built on a 5 V-tolerant CMOS process and supports JTAG (IEEE 1149.1) boundary-scan testing.
The FLEX 10KE architecture combines a logic array for fine-grained glue logic with an embedded array for wide datapath functions, enabling a single chip to replace dozens of TTL/CMOS glue parts alongside small microcontrollers. Designers can implement UART, FIFO, PCI soft cores, and Altera MegaCore functions such as Nios processors. The 0.35 µm SRAM process provides a propagation delay around 0.6 ns and an internal global clock network for synchronous designs up to roughly 80-100 MHz system clock.
Typical applications include telecom line cards, industrial control backplanes, PCI bridge designs, and legacy digital signal processing pre-processing. The wide I/O count (147 pins) accommodates 32-bit datapaths plus address/control, making the part a common choice for protocol-bridge ASIC prototypes and aerospace ground-test equipment.
When designing, observe the 2.5 V core / 3.3 V I/O supply split - a single 3.3 V rail does NOT power the core. Series-termination resistors are recommended on clock and high-speed I/O when driving backplane traces beyond 50 mm.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für EPF10K100EQC208-1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF10K100EQC208-1 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, RoHS Status, Process Technology, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF10K100EQC208-2
✅ Drop-In✓ Auf Lager
$155.85 / Stück
Datenblatt ansehen →EPF10K100EQC208-1N
✅ Drop-In✓ Auf Lager
$54.9 / Stück
Datenblatt ansehen →EPF10K100EQC208-1X
✅ Drop-In✓ Auf Lager
$96.5 / Stück
Datenblatt ansehen →EPF10K100EQC208-3
✅ Drop-In✓ Auf Lager
$19.8 / Stück
Datenblatt ansehen →EPF10K100BQC208-1
✅ Drop-In✓ Auf Lager
$21.2 / Stück
Datenblatt ansehen →EPF10K100EQC208-1N
✅ Drop-In✓ Auf Lager
$54.9 / Stück
Datenblatt ansehen →EPF10K100EQC208-1 Grenzwerte & elektrische Eigenschaften
| Series | FLEX 10KE |
| Logic Elements | 4,992 |
| Typical Gates | 100,000 |
| Total RAM Bits | 49,152 |
| Number of LABs/CLBs | 624 |
| Number of I/O | 147 |
| Gehäuse | 208-BFQFP (PQFP 28x28 mm) |
| Package Pin Count | 208 |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) |
| I/O Supply Voltage | 3.3 V (multi-voltage I/O) |
| Betriebstemperatur | 0 C to 70 C (commercial) |
| Montageart | Surface Mount |
| Logic Family | CMOS (SRAM-based) |
| Propagation Delay | 0.6 ns |
| Configuration | SRAM (volatile, in-system programmable) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
EPF10K100EQC208-1 208 Pinbelegungsleitfaden
Pinbelegung für EPF10K100EQC208-1 (208-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF10K100EQC208-1.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF10K100EQC208-1 ist geeignet für 7 Anwendungs: Telecom Line Card Glue Logic, Industrial Control Backplane, PCI Bridge and Protocol Converter, Legacy DSP Pre-Processing, Aerospace Ground-Test Equipment, ASIC Prototype Validation, Medical Imaging Pre-Processing.
Telecom Line Card Glue Logic
The EPF10K100EQC208-1 is well-suited to telecom line-card glue logic where it bridges parallel backplane buses, performs channel-encoding pre-processing, and consolidates dozens of 74-series TTL parts onto one device. Its 147 user I/O pins accommodate 32-bit datapaths plus address, control, and JTAG signals; the 49,152-bit embedded RAM array (EAB) hosts FIFOs and lookup tables for protocol conversion. The 208-PQFP package simplifies rework on legacy FR-4 backplanes compared to BGA alternatives. Designers typically instantiate UART, HDLC, and Altera MegaCore functions, achieving board area reductions of 60-70% versus discrete logic implementations.
Empfohlen
Industrial Control Backplane
In industrial control backplanes the EPF10K100EQC208-1 acts as the central programmable interface between PLC scan engines, sensor I/O racks, and HMI panels. Its 624 LABs and 4,992 logic elements support deterministic state machines for conveyor sequencing and motor-control interlocks, while the 49,152 embedded RAM bits hold calibration tables and lookup-based PWM waveforms. The 0 to 70 C commercial temperature range suits enclosure-mounted control cabinets; for harsher environments, designers should specify the EPF10K100EQI208-1 industrial variant. The JTAG boundary-scan simplifies in-system verification across dense backplane connectors.
Empfohlen
PCI Bridge and Protocol Converter
The EPF10K100EQC208-1 was a workhorse for PCI-bus bridge designs in the late 1990s and early 2000s, hosting Altera's PCI MegaCore functions to bridge PCI to local-bus, VME, or proprietary backplane fabrics. The 147 I/O pins accommodate the 32-bit PCI bus (AD[31:0], C/BE[3:0], FRAME, IRDY, TRDY, etc.) plus parity and arbitration signals. Designers also implement scatter-gather DMA engines and FIFO buffers in the embedded array blocks. While the part predates PCIe, legacy PCI-X and cPCI systems continue to use it in aerospace, defense, and industrial upgrades where redesign is impractical.
Empfohlen
Legacy DSP Pre-Processing
For legacy digital signal processing pre-processing, the EPF10K100EQC208-1 implements FIR filters, correlators, and FFT pre-processing stages in its embedded array blocks, offloading these tasks from a downstream DSP or ASIC. Each EAB can be configured as a 256x16, 512x8, 1024x4, or 2048x2 memory block - ideal for coefficient storage in FIR/IIR filter designs. The 49,152-bit total accommodates up to 192 FIR taps at 16-bit resolution. While modern FPGAs offer dedicated DSP blocks, FLEX 10KE remains a cost-effective solution for legacy audio-processing, sonar beam-forming, and instrumentation front-ends.
Empfohlen
Aerospace Ground-Test Equipment
In aerospace ground-test equipment the EPF10K100EQC208-1 implements MIL-STD-1553, ARINC 429, and proprietary avionics bus monitors, exercising flight hardware on the bench. Its 147 user I/O pins interface to multiple bus transceivers, while the embedded array blocks store known-good bit patterns for protocol regression tests. The 208-PQFP package is rework-friendly in low-volume test systems - a key consideration when refurbishing decade-old test rigs. The JTAG chain supports in-system test pattern injection and fault isolation without breaking the bench setup.
Empfohlen
ASIC Prototype Validation
Designers use the EPF10K100EQC208-1 as an ASIC prototype platform to validate control logic, glue interfaces, and IP blocks before committing to a multi-million-gate ASIC tape-out. The 100K-gate capacity accommodates an entire SoC control plane including CPU soft cores (Nios, ARM Cortex-M1 equivalents), memory controllers, and peripheral bridges. Fast iteration cycles via Quartus II bitstream downloads let teams debug hardware/software co-design issues weeks before silicon returns. The FLEX 10KE embedded array supports megafunctions such as PCI, DDR, and FFT cores directly via Altera MegaCore IP library.
Empfohlen
Medical Imaging Pre-Processing
In medical imaging systems (ultrasound front-ends, legacy MRI signal conditioning), the EPF10K100EQC208-1 performs pre-beamforming, gain control, and ADC data buffering before the data stream is passed to a DSP or host processor. The embedded array blocks serve as dual-port RAM line buffers between the ADC and the scan converter, while the logic array implements decimation filters and time-gain compensation curves. The 0.6 ns propagation delay supports ADC clock rates up to roughly 80-100 MHz, sufficient for legacy 12-bit ultrasound digitizers. FDA-compliant designs favor the part's deterministic behavior and well-documented design chain.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF10K100EQC208-1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF10K100EQC208-2 | EPF10K100EQC208-1N | EPF10K100EQC208-1X | EPF10K100EQC208-3 | EPF10K100BQC208-1 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 208-BFQFP (PQFP 28x28 mm) | 208-BFQFP (PQFP 28x28 mm) - same | 208-BFQFP (PQFP 28x28 mm) - same | 208-BFQFP (PQFP 28x28 mm) - same | 208-BFQFP (PQFP 28x28 mm) - same | 208-BFQFP (PQFP 28x28 mm) - same |
| Speed Grade | -1 (slowest) | -2 (mid) | -1 (same, Pb-free) | -1 (same, screened) | -3 (fastest) | -1 (FLEX 10K base series) |
| Logic Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10K (base) |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Number of I/O | 147 | 147 | 147 | 147 | 147 | 147 |
| Lifecycle Status | Obsolete (as of 2026-09-11) | Obsolete | Obsolete (last-time-buy stock) | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- FLEX 10KE enhanced embedded array block (EAB) with 49,152 RAM bits (vs. EPF10K100BQC208-1 (FLEX 10K base))
- Pb-free / RoHS-compliant terminal finish available as -1N variant (vs. EPF10K100EQC208-1 (standard))
- Speed-grade upgrade path via -2 and -3 bin substitutions (vs. EPF10K100EQC208-2 / -3)
Designhinweise
The EPF10K100EQC208-1 requires separate 2.5 V core and 3.3 V I/O supplies; failure to provide both rails simultaneously will prevent configuration and may damage the part. Per the Altera FLEX 10KE datasheet, the VCCINT (core) pin must reach 2.5 V within 100 ms of the VCCIO supply, otherwise the I/O cells enter an undefined state. Decouple each VCCINT/VCCIO pin pair with a 0.1 uF X7R ceramic capacitor placed within 5 mm of the package, plus a bulk 33 uF tantalum capacitor on each rail. Estimated: at 100% utilization with 50% toggle rate, the part draws approximately 300-500 mA from VCCINT.
The 208-BFQFP package has a 0.5 mm pitch and a 28x28 mm body with the exposed die pad replaced by a plastic thermal spreader - solder paste stencil apertures of 0.45 mm width with 0.10 mm thickness achieve reliable joints. Ground the thermal spreader to the board ground plane via at least 8 vias (0.3 mm drill, 0.6 mm pad) to dissipate the typical 1-3 W operating power. Maintain at least 5 mm clearance between the PQFP leads and any high-speed trace to avoid solder-bridging during reflow.
The FLEX 10KE SRAM configuration is volatile - on every power-up, the bitstream must be reloaded from an external EPC configuration PROM (EPC1, EPC2, EPC4, EPC8) or a microcontroller. Forgetting the configuration PROM leaves the part with all I/O in tri-state and logic cells in default configuration. Ensure the nCONFIG and nSTATUS pins are properly pulled up to VCCIO via 10 kohm resistors; floating these pins during power-up causes intermittent configuration failures that mimic silicon defects.
The 208-PQFP package introduces approximately 25-40 nH of lead inductance per pin, which can cause ringing on clocks and high-speed I/O exceeding 33 MHz. Place 33 ohm series-termination resistors within 10 mm of the FPGAs driving pins when trace lengths exceed 50 mm or when driving backplane connectors. For multi-clock designs, route each clock trace over a continuous ground plane and avoid layer changes within 25 mm of the FPGA clock pins to maintain impedance continuity.
Compliance-Informationen
RoHS and lead-free status is not stated in the verified web data for the standard -1 suffix; the -1N variant is explicitly Pb-free per Altera naming convention. No AEC-Q100 automotive qualification - FLEX 10KE is commercial/industrial only. Verify RoHS label on received parts before placing into RoHS-assembled boards.
