EPM240F100I5N - MAX II CPLD, 240 LE, 80 I/O, FBGA-100 | Intel
Teilenummer: EPM240F100I5N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.2 | $9,20 |
| 10 | $8.55 | $85,50 |
| 100 | $7.3 | $730,00 |
| 500 | $6.45 | $3.225,00 |
| 1.000 | $5.8 | $5.800,00 |
| 3.000 | $5.2 | $15.600,00 |
EPM240F100I5N Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style AND/OR macrocell arrays on a single die with a programmable interconnect fabric. In the broader taxonomy, a CPLD sits below an FPGA (Field-Programmable Gate Array) in density, but above simple SPLDs and PALs in functional capability. The MAX II family is implemented in a 0.18-micron CMOS process with a flash-based configuration memory, which means the device holds its pattern without an external boot PROM and is therefore classified under semiconductor -> programmable logic -> CPLD -> MAX II.
Key features include 192 macrocells, 240 Logic Elements, a 1.8 V core supply with banked I/O supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V interfaces via VCCIO pins, an internal oscillator, and 4-input look-up table (LUT) logic. The MAX II architecture also integrates an 8-Kbit user flash memory block for storing user data such as serial numbers or calibration constants. JTAG boundary-scan test (IEEE 1149.1) and ISP are supported on every member.
Typical applications include bus-bridging logic between processors and peripherals, power-up and power-down sequencing, I/O expansion and voltage-level translation in mixed-voltage systems, glue-logic replacement in industrial controllers, and LED-driving or display-interface control in consumer devices. The wide VCCIO range (1.5 V to 3.3 V) makes it especially useful for bridging legacy 5 V-tolerant interfaces to modern 1.8 V processors.
When designing with the EPM240F100I5N, place the device's decoupling capacitors as close as possible to each VCC and VCCIO pin, follow Intel/Altera's recommended PCB footprint and routing rules from the device handbook, and use the Quartus II or Intel Quartus Prime design software for synthesis, fitting, and programming file generation.
Drop-in-Alternativen für EPM240F100I5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM240F100I5N (gleiche Bauform und Footprint) – abweichend in Package, Programming Interface, Process Technology, Operating Temperature, Configuration Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM240F100I5
✅ Drop-In✓ Auf Lager
$8.74 / Stück
Datenblatt ansehen →EPM240F100C5N
✅ Drop-In✓ Auf Lager
$5.2 / Stück
Datenblatt ansehen →EPM240F100C4N
✅ Drop-In✓ Auf Lager
$7.05 / Stück
Datenblatt ansehen →EPM240F100I5N Grenzwerte & elektrische Eigenschaften
| Series | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements | 240 |
| Macrocells | 192 |
| User I/Os | 80 |
| Package Type | FBGA-100 (FineLine BGA) |
| Package Code (JEDEC) | LBGA100 |
| Package Dimensions | 11 x 11 mm, 1.0 mm ball pitch |
| Logic Family | CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) |
| Configuration Memory | Flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbit |
| Internal Oscillator | Yes |
| JTAG / ISP Support | Yes (IEEE 1149.1 boundary scan) |
| Betriebstemperatur | -40 C to +100 C (industrial, I-grade) |
| Montageart | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free FBGA) |
| Programming Toolchain | Intel Quartus Prime / Quartus II |
EPM240F100I5N Pin-Konfiguration
| Pin A1 | I/O — User I/O (bank 1) |
| Pin A2 | I/O — User I/O (bank 1) |
| Pin A3 | I/O — User I/O (bank 1) |
| Pin A4 | I/O — User I/O (bank 1) |
| Pin A5 | I/O — User I/O (bank 1) |
| Pin A6 | I/O — User I/O (bank 1) |
| Pin A7 | I/O — User I/O (bank 1) |
| Pin A8 | I/O — User I/O (bank 1) |
| Pin A9 | I/O — User I/O (bank 1) |
| Pin A10 | I/O — User I/O (bank 1) |
| Pin B1 | I/O — User I/O (bank 1) |
| Pin B10 | GND — Ground |
| Pin C1 | VCCIO1 — I/O supply bank 1 (1.5/1.8/2.5/3.3 V) |
| Pin D1 | TDI — JTAG Test Data In |
| Pin D2 | TMS — JTAG Test Mode Select |
| Pin D3 | TCK — JTAG Test Clock |
| Pin D4 | TDO — JTAG Test Data Out |
| Pin D5 | I/O — User I/O (bank 2) |
| Pin D6 | I/O — User I/O (bank 2) |
| Pin D7 | I/O — User I/O (bank 2) |
| Pin D8 | I/O — User I/O (bank 2) |
| Pin D9 | I/O — User I/O (bank 2) |
| Pin D10 | I/O — User I/O (bank 2) |
| Pin E1 | I/O — User I/O (bank 1) |
| Pin E10 | VCCIO2 — I/O supply bank 2 (1.5/1.8/2.5/3.3 V) |
| Pin F1 | GND — Ground |
| Pin F2 | VCCINT — Core supply (1.8 V) |
| Pin F3 | GND — Ground |
| Pin F4 | nSTATUS — Configuration status (open-drain) |
| Pin F5 | I/O — User I/O (bank 2) |
| Pin F6 | I/O — User I/O (bank 2) |
| Pin F7 | I/O — User I/O (bank 2) |
| Pin F8 | I/O — User I/O (bank 2) |
| Pin F9 | GND — Ground |
| Pin F10 | I/O — User I/O (bank 2) |
| Pin G1 | I/O — User I/O (bank 1) |
| Pin G10 | I/O — User I/O (bank 2) |
| Pin H1 | I/O — User I/O (bank 1) |
| Pin H10 | I/O — User I/O (bank 2) |
| Pin J1 | I/O — User I/O (bank 1) |
| Pin J2 | I/O — User I/O (bank 1) |
| Pin J3 | I/O — User I/O (bank 1) |
| Pin J4 | I/O — User I/O (bank 1) |
| Pin J5 | I/O — User I/O (bank 1) |
| Pin J6 | I/O — User I/O (bank 1) |
| Pin J7 | I/O — User I/O (bank 1) |
| Pin J8 | I/O — User I/O (bank 1) |
| Pin J9 | I/O — User I/O (bank 1) |
| Pin J10 | I/O — User I/O (bank 1) |
| Pin K1 | I/O — User I/O (bank 1) |
| Pin K2 | I/O — User I/O (bank 1) |
| Pin K3 | GND — Ground |
| Pin K4 | I/O — User I/O (bank 1) |
| Pin K5 | I/O — User I/O (bank 1) |
| Pin K6 | VCCIO1 — I/O supply bank 1 (1.5/1.8/2.5/3.3 V) |
| Pin K7 | I/O — User I/O (bank 1) |
| Pin K8 | I/O — User I/O (bank 1) |
| Pin K9 | I/O — User I/O (bank 1) |
| Pin K10 | GND — Ground |
Typische Anwendungen
EPM240F100I5N ist geeignet für 6 Anwendungs: I/O Expansion and Voltage-Level Translation, Power-up and Power-down Sequencing, Bus Bridging and Protocol Glue Logic, Industrial Control and Factory Automation, LED Display and Lighting Control, Consumer Electronics and Gaming Peripherals.
I/O Expansion and Voltage-Level Translation
The EPM240F100I5N's 80 user I/Os and banked VCCIO architecture (1.5 V / 1.8 V / 2.5 V / 3.3 V per bank) make it a natural fit for expanding microcontroller GPIO count and translating between mixed-voltage domains. Place the CPLD between a 3.3 V microcontroller and a 1.8 V image sensor: each bank is powered by its own VCCIO rail, so the device performs both expansion and level shifting in a single 11 mm x 11 mm FBGA. Compared to discrete level-shifters, this saves board area and BOM cost when more than 16 channels are involved. The flash-based non-volatile core ensures the translation logic is active at power-up with zero boot delay, which is critical for sensor bring-up sequences.
Empfohlen
Power-up and Power-down Sequencing
Industrial and embedded systems often require multiple rails to come up and down in a precise order to avoid latch-up. The EPM240F100I5N's instant-on flash-based configuration (no boot PROM needed) and 240 logic elements are well-matched to sequencing controller duties: it can monitor up to 80 discrete rails via comparators or GPIO and drive enable signals to DC-DC converters, LDOs, and load switches. Each macrocell provides a registered output capable of switching within nanoseconds, so multi-rail sequencing is achieved with deterministic timing. Industrial -40C to +100C operation makes it suitable for factory-automation chassis and outdoor telecom equipment.
Empfohlen
Bus Bridging and Protocol Glue Logic
The EPM240F100I5N is widely deployed as a 'glue-logic translator' between processors, ASICs, and legacy peripherals that use mismatched bus widths or signalling standards. A typical application bridges a 16-bit SRAM bus to an 8-bit microcontroller peripheral, or converts SPI to parallel GPIO for driving character LCDs. With 240 logic elements, 192 macrocells, and 80 I/Os, it absorbs enough state machine and decoder logic for most glue-logic tasks at sub-50 MHz frequencies. Quartus Prime synthesis typically fits bridges with hundreds of flip-flops comfortably, and JTAG ISP allows in-field firmware updates without removing the board.
Empfohlen
Industrial Control and Factory Automation
The industrial -40C to +100C temperature rating, combined with the surface-mount FBGA-100 form factor and long-lifecycle MAX II family support, makes the EPM240F100I5N a common choice in PLCs, motor controllers, and sensor-interface modules. It typically handles encoder decoding (quadrature, SSI), PWM generation, and safety logic in machinery where deterministic, single-clock-cycle response is required. The flash-based non-volatile configuration eliminates boot-time variability, which is important for safety-related functions. The 8-Kbit user flash block stores machine ID, calibration, or fault logs without an external EEPROM.
Empfohlen
LED Display and Lighting Control
In LED matrix drivers, scrolling-sign controllers, and architectural lighting systems, the EPM240F100I5N generates the row/column scanning waveforms, brightness PWM, and data multiplexing that would otherwise require multiple timer ICs. Its 80 I/Os can drive up to 40 multiplexed LED rows directly when paired with external MOSFET drivers, and the 240-LE fabric absorbs the entire scan-state machine in one device. Industrial temperature grade ensures reliable operation in outdoor signage and stadium lighting. Compared to microcontroller-based approaches, the CPLD provides glitch-free, deterministic scan timing that prevents visible flicker.
Empfohlen
Consumer Electronics and Gaming Peripherals
Game controllers, set-top boxes, and consumer appliances use the EPM240F100I5N to handle button scanning, IR receiver decoding, and standby-power management. The MAX II family's low standby current (typically in the microamp range for this device) and instant-on flash configuration suit always-on subsystems that wake the main processor on user input. With 80 I/Os the device can scan 8x8 button matrices and drive multiple status LEDs from a single 11 mm BGA. JTAG ISP also enables late-stage firmware customization at the factory without reworking the board.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM240F100I5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM240F100I5 | EPM240F100C5N | EPM240F100C4N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | FBGA-100 (11x11 mm, 1.0 mm pitch) | FBGA-100 - same | FBGA-100 - same | FBGA-100 - same |
| Logic Elements | 240 | 240 | 240 | 240 |
| User I/Os | 80 | 80 | 80 | 80 |
| Operating Temperature | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
| Speed Grade | I5 (industrial, fast) | I5 (industrial, fast) | C5 (commercial, fast) | C4 (commercial, standard) |
| Configuration Memory | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) |
| Approx. Unit Price @ qty 1 (USD, 2026-09-12) | $9.20 | $8.80 | $7.50 | $6.80 |
Wichtigste Unterscheidungsmerkmale
- Non-volatile flash configuration - no external boot PROM needed (vs. EPM240F100C4N (commercial temp variant))
- Industrial temperature rating -40 C to +100 C (vs. EPM240F100C5N)
- Lead-free / RoHS-compliant ball finish ('N' suffix) (vs. EPM240F100I5 (without N suffix))
- Same FBGA-100 footprint across the entire EPM240F100x family (vs. EPM240T100C5N (TQFP-100 alternative))
Designhinweise
Estimated: an FBGA-100 with 1.0 mm pitch requires a 4-layer PCB with microvia or via-in-pad construction for reliable assembly. Place a 0.1 uF X7R decoupling capacitor within 2 mm of every VCCINT, VCCIO, and GND pair. Route the JTAG chain (TDI, TDO, TMS, TCK) as a daisy chain with 10 kohm pull-ups on TMS and TCK per the MAX II device handbook.
The MAX II CPLDs are CMOS-low-power devices; typical quiescent current is in the milliamp range and dynamic current is dominated by I/O switching. Provide at least 1 oz copper on outer layers under the BGA, and stitch the inner ground plane with vias on a 2-3 mm grid to spread heat from simultaneous-switching outputs (SSOs). For designs driving more than 16 SSOs at 50 MHz, derate to 8 mA per bank per the handbook SSO guidelines.
Series-terminate outputs driving traces longer than approximately 25 mm at 50 MHz or above to control ringing; a 33 ohm series resistor near the CPLD pin is typical for 3.3 V LVCMOS. For 1.5 V/1.8 V HSTL or SSTL interfaces, follow the MAX II device handbook's I/O standard termination table. Avoid stubs by using point-to-point routing for clock and JTAG signals.
Do not leave VCCIO banks floating - every VCCIO pin must be tied to its bank supply (1.5 / 1.8 / 2.5 / 3.3 V) even if the bank is unused. Ensure the JTAG chain order matches the Quartus Prime assignment to avoid IDCODE errors during ISP. The 'N' suffix denotes lead-free / RoHS-compliant terminal finish; the variant without 'N' has SnPb ball finish and is restricted by RoHS regulations in many markets.
Compliance-Informationen
RoHS compliance inferred from the 'N' suffix in the part number per Intel/Altera lead-free marking convention; not AEC-Q100 qualified (this is an industrial-grade CPLD, not an automotive part); halogen-free status not explicitly published - confirm with Intel Product Compliance if required for your application.
