EPM240F100I5N - MAX II CPLD, 240 LE, 80 I/O, FBGA-100 | Intel
Référence : EPM240F100I5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.2 | $9,20 |
| 10 | $8.55 | $85,50 |
| 100 | $7.3 | $730,00 |
| 500 | $6.45 | $3 225,00 |
| 1 000 | $5.8 | $5 800,00 |
| 3 000 | $5.2 | $15 600,00 |
EPM240F100I5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style AND/OR macrocell arrays on a single die with a programmable interconnect fabric. In the broader taxonomy, a CPLD sits below an FPGA (Field-Programmable Gate Array) in density, but above simple SPLDs and PALs in functional capability. The MAX II family is implemented in a 0.18-micron CMOS process with a flash-based configuration memory, which means the device holds its pattern without an external boot PROM and is therefore classified under semiconductor -> programmable logic -> CPLD -> MAX II.
Key features include 192 macrocells, 240 Logic Elements, a 1.8 V core supply with banked I/O supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V interfaces via VCCIO pins, an internal oscillator, and 4-input look-up table (LUT) logic. The MAX II architecture also integrates an 8-Kbit user flash memory block for storing user data such as serial numbers or calibration constants. JTAG boundary-scan test (IEEE 1149.1) and ISP are supported on every member.
Typical applications include bus-bridging logic between processors and peripherals, power-up and power-down sequencing, I/O expansion and voltage-level translation in mixed-voltage systems, glue-logic replacement in industrial controllers, and LED-driving or display-interface control in consumer devices. The wide VCCIO range (1.5 V to 3.3 V) makes it especially useful for bridging legacy 5 V-tolerant interfaces to modern 1.8 V processors.
When designing with the EPM240F100I5N, place the device's decoupling capacitors as close as possible to each VCC and VCCIO pin, follow Intel/Altera's recommended PCB footprint and routing rules from the device handbook, and use the Quartus II or Intel Quartus Prime design software for synthesis, fitting, and programming file generation.
Alternatives de remplacement direct pour EPM240F100I5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM240F100I5N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Process Technology, Operating Temperature, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM240F100I5
✅ Remplacement direct✓ En stock
$8.74 / unité
Voir la fiche technique →EPM240F100C5N
✅ Remplacement direct✓ En stock
$5.2 / unité
Voir la fiche technique →EPM240F100C4N
✅ Remplacement direct✓ En stock
$7.05 / unité
Voir la fiche technique →EPM240F100I5N Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements | 240 |
| Macrocells | 192 |
| User I/Os | 80 |
| Package Type | FBGA-100 (FineLine BGA) |
| Package Code (JEDEC) | LBGA100 |
| Package Dimensions | 11 x 11 mm, 1.0 mm ball pitch |
| Logic Family | CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) |
| Configuration Memory | Flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbit |
| Internal Oscillator | Yes |
| JTAG / ISP Support | Yes (IEEE 1149.1 boundary scan) |
| Température de fonctionnement | -40 C to +100 C (industrial, I-grade) |
| Type de montage | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free FBGA) |
| Programming Toolchain | Intel Quartus Prime / Quartus II |
Configuration des broches de EPM240F100I5N
| Broche A1 | I/O — User I/O (bank 1) |
| Broche A2 | I/O — User I/O (bank 1) |
| Broche A3 | I/O — User I/O (bank 1) |
| Broche A4 | I/O — User I/O (bank 1) |
| Broche A5 | I/O — User I/O (bank 1) |
| Broche A6 | I/O — User I/O (bank 1) |
| Broche A7 | I/O — User I/O (bank 1) |
| Broche A8 | I/O — User I/O (bank 1) |
| Broche A9 | I/O — User I/O (bank 1) |
| Broche A10 | I/O — User I/O (bank 1) |
| Broche B1 | I/O — User I/O (bank 1) |
| Broche B10 | GND — Ground |
| Broche C1 | VCCIO1 — I/O supply bank 1 (1.5/1.8/2.5/3.3 V) |
| Broche D1 | TDI — JTAG Test Data In |
| Broche D2 | TMS — JTAG Test Mode Select |
| Broche D3 | TCK — JTAG Test Clock |
| Broche D4 | TDO — JTAG Test Data Out |
| Broche D5 | I/O — User I/O (bank 2) |
| Broche D6 | I/O — User I/O (bank 2) |
| Broche D7 | I/O — User I/O (bank 2) |
| Broche D8 | I/O — User I/O (bank 2) |
| Broche D9 | I/O — User I/O (bank 2) |
| Broche D10 | I/O — User I/O (bank 2) |
| Broche E1 | I/O — User I/O (bank 1) |
| Broche E10 | VCCIO2 — I/O supply bank 2 (1.5/1.8/2.5/3.3 V) |
| Broche F1 | GND — Ground |
| Broche F2 | VCCINT — Core supply (1.8 V) |
| Broche F3 | GND — Ground |
| Broche F4 | nSTATUS — Configuration status (open-drain) |
| Broche F5 | I/O — User I/O (bank 2) |
| Broche F6 | I/O — User I/O (bank 2) |
| Broche F7 | I/O — User I/O (bank 2) |
| Broche F8 | I/O — User I/O (bank 2) |
| Broche F9 | GND — Ground |
| Broche F10 | I/O — User I/O (bank 2) |
| Broche G1 | I/O — User I/O (bank 1) |
| Broche G10 | I/O — User I/O (bank 2) |
| Broche H1 | I/O — User I/O (bank 1) |
| Broche H10 | I/O — User I/O (bank 2) |
| Broche J1 | I/O — User I/O (bank 1) |
| Broche J2 | I/O — User I/O (bank 1) |
| Broche J3 | I/O — User I/O (bank 1) |
| Broche J4 | I/O — User I/O (bank 1) |
| Broche J5 | I/O — User I/O (bank 1) |
| Broche J6 | I/O — User I/O (bank 1) |
| Broche J7 | I/O — User I/O (bank 1) |
| Broche J8 | I/O — User I/O (bank 1) |
| Broche J9 | I/O — User I/O (bank 1) |
| Broche J10 | I/O — User I/O (bank 1) |
| Broche K1 | I/O — User I/O (bank 1) |
| Broche K2 | I/O — User I/O (bank 1) |
| Broche K3 | GND — Ground |
| Broche K4 | I/O — User I/O (bank 1) |
| Broche K5 | I/O — User I/O (bank 1) |
| Broche K6 | VCCIO1 — I/O supply bank 1 (1.5/1.8/2.5/3.3 V) |
| Broche K7 | I/O — User I/O (bank 1) |
| Broche K8 | I/O — User I/O (bank 1) |
| Broche K9 | I/O — User I/O (bank 1) |
| Broche K10 | GND — Ground |
Applications typiques
EPM240F100I5N convient pour 6 applications: I/O Expansion and Voltage-Level Translation, Power-up and Power-down Sequencing, Bus Bridging and Protocol Glue Logic, Industrial Control and Factory Automation, LED Display and Lighting Control, Consumer Electronics and Gaming Peripherals.
I/O Expansion and Voltage-Level Translation
The EPM240F100I5N's 80 user I/Os and banked VCCIO architecture (1.5 V / 1.8 V / 2.5 V / 3.3 V per bank) make it a natural fit for expanding microcontroller GPIO count and translating between mixed-voltage domains. Place the CPLD between a 3.3 V microcontroller and a 1.8 V image sensor: each bank is powered by its own VCCIO rail, so the device performs both expansion and level shifting in a single 11 mm x 11 mm FBGA. Compared to discrete level-shifters, this saves board area and BOM cost when more than 16 channels are involved. The flash-based non-volatile core ensures the translation logic is active at power-up with zero boot delay, which is critical for sensor bring-up sequences.
Recommandé
Power-up and Power-down Sequencing
Industrial and embedded systems often require multiple rails to come up and down in a precise order to avoid latch-up. The EPM240F100I5N's instant-on flash-based configuration (no boot PROM needed) and 240 logic elements are well-matched to sequencing controller duties: it can monitor up to 80 discrete rails via comparators or GPIO and drive enable signals to DC-DC converters, LDOs, and load switches. Each macrocell provides a registered output capable of switching within nanoseconds, so multi-rail sequencing is achieved with deterministic timing. Industrial -40C to +100C operation makes it suitable for factory-automation chassis and outdoor telecom equipment.
Recommandé
Bus Bridging and Protocol Glue Logic
The EPM240F100I5N is widely deployed as a 'glue-logic translator' between processors, ASICs, and legacy peripherals that use mismatched bus widths or signalling standards. A typical application bridges a 16-bit SRAM bus to an 8-bit microcontroller peripheral, or converts SPI to parallel GPIO for driving character LCDs. With 240 logic elements, 192 macrocells, and 80 I/Os, it absorbs enough state machine and decoder logic for most glue-logic tasks at sub-50 MHz frequencies. Quartus Prime synthesis typically fits bridges with hundreds of flip-flops comfortably, and JTAG ISP allows in-field firmware updates without removing the board.
Recommandé
Industrial Control and Factory Automation
The industrial -40C to +100C temperature rating, combined with the surface-mount FBGA-100 form factor and long-lifecycle MAX II family support, makes the EPM240F100I5N a common choice in PLCs, motor controllers, and sensor-interface modules. It typically handles encoder decoding (quadrature, SSI), PWM generation, and safety logic in machinery where deterministic, single-clock-cycle response is required. The flash-based non-volatile configuration eliminates boot-time variability, which is important for safety-related functions. The 8-Kbit user flash block stores machine ID, calibration, or fault logs without an external EEPROM.
Recommandé
LED Display and Lighting Control
In LED matrix drivers, scrolling-sign controllers, and architectural lighting systems, the EPM240F100I5N generates the row/column scanning waveforms, brightness PWM, and data multiplexing that would otherwise require multiple timer ICs. Its 80 I/Os can drive up to 40 multiplexed LED rows directly when paired with external MOSFET drivers, and the 240-LE fabric absorbs the entire scan-state machine in one device. Industrial temperature grade ensures reliable operation in outdoor signage and stadium lighting. Compared to microcontroller-based approaches, the CPLD provides glitch-free, deterministic scan timing that prevents visible flicker.
Recommandé
Consumer Electronics and Gaming Peripherals
Game controllers, set-top boxes, and consumer appliances use the EPM240F100I5N to handle button scanning, IR receiver decoding, and standby-power management. The MAX II family's low standby current (typically in the microamp range for this device) and instant-on flash configuration suit always-on subsystems that wake the main processor on user input. With 80 I/Os the device can scan 8x8 button matrices and drive multiple status LEDs from a single 11 mm BGA. JTAG ISP also enables late-stage firmware customization at the factory without reworking the board.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM240F100I5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM240F100I5 | EPM240F100C5N | EPM240F100C4N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | FBGA-100 (11x11 mm, 1.0 mm pitch) | FBGA-100 - same | FBGA-100 - same | FBGA-100 - same |
| Logic Elements | 240 | 240 | 240 | 240 |
| User I/Os | 80 | 80 | 80 | 80 |
| Operating Temperature | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
| Speed Grade | I5 (industrial, fast) | I5 (industrial, fast) | C5 (commercial, fast) | C4 (commercial, standard) |
| Configuration Memory | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) |
| Approx. Unit Price @ qty 1 (USD, 2026-09-12) | $9.20 | $8.80 | $7.50 | $6.80 |
Principaux différenciateurs
- Non-volatile flash configuration - no external boot PROM needed (vs EPM240F100C4N (commercial temp variant))
- Industrial temperature rating -40 C to +100 C (vs EPM240F100C5N)
- Lead-free / RoHS-compliant ball finish ('N' suffix) (vs EPM240F100I5 (without N suffix))
- Same FBGA-100 footprint across the entire EPM240F100x family (vs EPM240T100C5N (TQFP-100 alternative))
Notes de conception
Estimated: an FBGA-100 with 1.0 mm pitch requires a 4-layer PCB with microvia or via-in-pad construction for reliable assembly. Place a 0.1 uF X7R decoupling capacitor within 2 mm of every VCCINT, VCCIO, and GND pair. Route the JTAG chain (TDI, TDO, TMS, TCK) as a daisy chain with 10 kohm pull-ups on TMS and TCK per the MAX II device handbook.
The MAX II CPLDs are CMOS-low-power devices; typical quiescent current is in the milliamp range and dynamic current is dominated by I/O switching. Provide at least 1 oz copper on outer layers under the BGA, and stitch the inner ground plane with vias on a 2-3 mm grid to spread heat from simultaneous-switching outputs (SSOs). For designs driving more than 16 SSOs at 50 MHz, derate to 8 mA per bank per the handbook SSO guidelines.
Series-terminate outputs driving traces longer than approximately 25 mm at 50 MHz or above to control ringing; a 33 ohm series resistor near the CPLD pin is typical for 3.3 V LVCMOS. For 1.5 V/1.8 V HSTL or SSTL interfaces, follow the MAX II device handbook's I/O standard termination table. Avoid stubs by using point-to-point routing for clock and JTAG signals.
Do not leave VCCIO banks floating - every VCCIO pin must be tied to its bank supply (1.5 / 1.8 / 2.5 / 3.3 V) even if the bank is unused. Ensure the JTAG chain order matches the Quartus Prime assignment to avoid IDCODE errors during ISP. The 'N' suffix denotes lead-free / RoHS-compliant terminal finish; the variant without 'N' has SnPb ball finish and is restricted by RoHS regulations in many markets.
Informations de conformité
RoHS compliance inferred from the 'N' suffix in the part number per Intel/Altera lead-free marking convention; not AEC-Q100 qualified (this is an industrial-grade CPLD, not an automotive part); halogen-free status not explicitly published - confirm with Intel Product Compliance if required for your application.
