EPM570ZM144I8N - 440 Macrocell CPLD MAX II Z 152MHz | Intel
Teilenummer: EPM570ZM144I8N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $23.84 | $23,84 |
| 10 | $21.45 | $214,50 |
| 100 | $18.92 | $1.892,00 |
| 500 | $16.74 | $8.370,00 |
| 1.000 | $14.95 | $14.950,00 |
EPM570ZM144I8N Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile, flash-based programmable logic IC that combines the instant-on behavior of a PAL/GAL with the density of a small FPGA. It sits between discrete 74-series glue logic and full FPGAs in the system hierarchy: glue logic -> SPLD -> CPLD -> FPGA -> ASIC. MAX II Z devices use a look-up table (LUT) based logic array plus a non-volatile flash configuration cell, giving them instant-on capability without external boot PROMs and excellent deterministic timing for bus-interface, address-decoding, and I/O-expansion tasks.
Key features of the EPM570ZM144I8N include 570 logic elements organized as 57 Logic Array Blocks (LABs) of 10 macrocells each, 8 Kbits of user flash memory (UFM), JTAG (IEEE 1149.1) and Altera built-in ISP via the JTAG interface, MultiVolt core and I/O support allowing mixing of 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, and four enhanced I/O banks. The I8N industrial temperature grade covers -40 °C to +85 °C operation, and the zero-power (Z) flash cell removes the need for a configuration download at every power-up.
Architecturally, the EPM570Z is built around a fine-grained Logic Element (LE) array with carry chains for fast arithmetic, an interconnect network with predictable delay paths, and a global control block driving four clock inputs with programmable polarity. The flash-based configuration is in-system programmable (ISP) and re-programmable up to 100 cycles per sector, which is sufficient for board-level prototyping and small production runs.
Typical applications include bus-interface bridging (PCI, ISA, VME legacy glue), address decoding and I/O expansion in microcontroller-based systems, power-up sequencing and supervisor logic, LED drive multiplexing, JTAG chain aggregation, and low-density state-machine replacement. Designers also use the EPM570Z as a feature-enhancement companion to an ASIC or MCU that lacks specific peripherals.
When designing with the EPM570ZM144I8N, observe Micro FBGA routing rules — pitch is 1.0 mm and the device requires a 4-layer PCB with via-in-pad or micro-via escape patterns to fan out the 144 ball grid. Reserve at least 1 Gnd and 1 Vcc reference ball per quadrant and use the dedicated JTAG TCK/TMS/TDI/TDO pins for boundary-scan test. Quiescent current is approximately 35 mA at 1.8 V; total power scales with toggle rate and I/O loading.
This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design notes that complement the Altera/Intel MAX II Z datasheet with information gain not available from any single source.
Drop-in-Alternativen für EPM570ZM144I8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM570ZM144I8N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Process Technology, Logic Elements, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM570ZM144C7N
✅ Drop-In✓ Auf Lager
$15.4 / Stück
Datenblatt ansehen →EPM570ZM144C6N
✅ Drop-In✓ Auf Lager
$7.85 / Stück
Datenblatt ansehen →EPM570ZM144I8N Grenzwerte & elektrische Eigenschaften
| Product Type | CPLD - Complex Programmable Logic Device |
| Series | MAX II Z |
| Manufacturer | Intel (formerly Altera) |
| Number of Macrocells | 440 |
| Number of Logic Array Blocks (LABs) | 57 |
| Logic Elements | 570 |
| User I/Os | 116 |
| Maximum Operating Frequency | 152 MHz |
| Pin-to-Pin Delay | 9.0 ns |
| Operating Supply Voltage (Core) | 1.8 V |
| I/O Bank Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.18 µm |
| Gehäuse | 144-pin Micro FBGA (MBGA) |
| Montagestil | SMD/SMT |
| User Flash Memory (UFM) | 8 Kbits |
| Configuration Memory | Non-volatile flash (zero-power Z series) |
| In-System Programmable | Yes (JTAG / IEEE 1149.1 ISP) |
| Betriebstemperatur | -40 °C to +85 °C (Industrial, I8N grade) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
EPM570ZM144I8N 144-pin micro fbga (mbga) Pinbelegungsleitfaden
Pinbelegung für EPM570ZM144I8N (144-pin micro fbga (mbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM570ZM144I8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM570ZM144I8N ist geeignet für 6 Anwendungs: Bus Interface Bridging & Legacy Glue Logic, Microcontroller I/O Expansion & Peripheral Emulation, Industrial Control & Factory Automation, Power Sequencing & Supervisor Logic, LED Display Multiplexing & Signage, JTAG Chain Aggregation & Boundary Scan.
Bus Interface Bridging & Legacy Glue Logic
The EPM570ZM144I8N's 440 macrocells, 116 user I/Os, and 4 MultiVolt I/O banks make it ideal for bridging between legacy 3.3 V / 5 V buses and modern 1.8 V ASICs or processors. Its deterministic 9 ns pin-to-pin delay supports address decoding, wait-state generation, and bus-width conversion up to ~80 MHz without timing closure issues. Designers use it to consolidate dozens of discrete 74-series glue packages into a single instant-on CPLD, reducing PCB area and BOM cost while improving EMI and signal-integrity margin.
Empfohlen
Microcontroller I/O Expansion & Peripheral Emulation
When an MCU lacks PWM channels, UARTs, or enough GPIO, the EPM570ZM144I8N adds 116 user I/Os with deterministic timing and instant-on behavior — no boot PROM needed. The 8 Kbit User Flash Memory (UFM) can store calibration constants, serial numbers, or boot-time configuration. With 152 MHz internal performance, the part can emulate SPI, I2C master/slave, and UART interfaces in parallel while the MCU handles the main application logic.
Empfohlen
Industrial Control & Factory Automation
The I8N industrial temperature grade (-40 °C to +85 °C) and MultiVolt I/O make the EPM570ZM144I8N well-suited to factory-floor PLC backplanes and motor-control boards. With 570 logic elements the part can implement multiple encoder-counters, PWM generators, and Modbus/Profibus glue logic concurrently. The non-volatile flash configuration ensures deterministic boot time after power cycles — critical for safety interlocks that must come up in a known state without external supervision.
Empfohlen
Power Sequencing & Supervisor Logic
Power-up and power-down sequencing of multi-rail systems (e.g., processor + DDR + FPGA) requires deterministic, parallel monitoring that an MCU cannot guarantee because the MCU itself is one of the rails. The EPM570ZM144I8N powers up instantly in a known state, monitors PG (power-good) signals from each rail, and drives the enable sequence in the correct order with programmable delay chains. This eliminates external sequencer chips and reduces the sequencer BOM to a single programmable device with field-upgradeable logic.
Empfohlen
LED Display Multiplexing & Signage
Large LED matrix displays (RGB panels, stadium signage, transit-information signs) require high-channel-count multiplexing with low EMI. The EPM570ZM144I8N drives up to 116 LED rows or columns with precise duty-cycle control, while its flash-based non-volatile memory stores gamma tables and patterns that load at boot without external SPI flash. Industrial temperature grade and SMD mounting support outdoor enclosure deployment with conformal coating.
Empfohlen
JTAG Chain Aggregation & Boundary Scan
Many boards have more JTAG devices than the available TCK/TMS chain headers. The EPM570ZM144I8N aggregates multiple JTAG chains behind a single TAP, performing pre-scan remap and device-order changes without external multiplexers. With JTAG pins already required for its own ISP, the part can also serve as a chain master that reprograms peer devices during production test, simplifying ATE fixtures and improving test coverage.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM570ZM144I8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM570ZM144C7N | EPM570ZM144C6N | EPM570ZM100I8N | EPM570T144I5N | EPM570GT144I5N |
|---|---|---|---|---|---|---|
| Package | 144-MBGA (Micro FBGA) | 144-MBGA (Micro FBGA) - same | 144-MBGA (Micro FBGA) - same | 100-EQFP - different | TQFP-144 - different | TQFP-144 - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX II Z | MAX II Z | MAX II Z | MAX II Z | MAX II (T-series) | MAX II G |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/Os | 116 | 116 | 116 | ~80 (100-pin package) | 116 | 116 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Temperature Grade | Industrial -40 to +85 C | Commercial 0 to +85 C | Commercial 0 to +85 C | Industrial -40 to +85 C | Industrial -40 to +85 C | Industrial -40 to +85 C |
| Pin-to-Pin Delay | 9.0 ns | ~9 ns (C7 speed grade) | ~8 ns (C6 speed grade) | ~9 ns | ~5-7 ns (T-series, TBD by speed grade) | ~6-8 ns (G-series) |
Wichtigste Unterscheidungsmerkmale
- Same-package commercial-temp variant available for cost-down designs (vs. EPM570ZM144C7N)
- Higher speed-grade drop-in variant exists for timing-critical paths (vs. EPM570ZM144C6N)
- Lower-pin same-family variant when fewer I/Os are required (vs. EPM570ZM100I8N)
- TQFP-144 footprint option for hand-soldered designs (vs. EPM570T144I5N)
Designhinweise
The 144-MBGA package has 1.0 mm ball pitch, which is fine for standard 4-layer PCBs but requires careful escape routing. Place at least one GND via adjacent to every VCCINT/VCCIO ball and use a continuous ground/power plane pair directly under the device. For production-grade designs, consider via-in-pad with filled-and-plated-over vias to minimize inductance on the decoupling path. JTAG TCK must be routed with ≤ 8 nH loop inductance to meet ISP timing.
Decouple VCCINT (1.8 V core) with one 0.1 µF X7R 0402/0201 ceramic per supply ball, plus one 10 µF bulk tantalum or ceramic per quadrant. Each VCCIO bank must have its own 0.1 µF decoupling at the bank pins; the four I/O banks are independent so do not assume shared decoupling is acceptable. Place input bulk capacitors within 5 mm of the supply balls. Typical quiescent current is ~35 mA at 1.8 V but rises with toggle rate — confirm with worst-case vector simulation.
Do not confuse the MAX II Z (EPM570Z***) with the legacy MAX II T-series (EPM570T***) or MAX II G (EPM570G***) when ordering — pin assignments differ across packages even though the macrocell count is identical. Also verify the JTAG TCK frequency is within the MAX II Z ISP specification (typically 33 MHz) because faster TCK can corrupt configuration. When migrating to the EPM570ZM144C7N (commercial temperature grade), confirm your application does not require the -40 °C lower industrial range of the I8N part.
For MultiVolt I/O bank mixing, never tie VCCIO of one bank to a voltage that violates the VIL/VIH specification of a connected device. Use the Quartus Prime pin-planner to lock I/O standards (LVTTL, LVCMOS, PCI) per pin. Series-resist (22-33 Ω) high-speed outputs that fan out to long traces to dampen reflections; the EPM570Z driver impedance varies with VCCIO and drive-strength setting.
Compliance-Informationen
RoHS and lead-free compliance per Intel/Altera MAX II Z product page. AEC-Q100 not applicable because the part is a logic device, not an automotive-grade IC with explicit AEC qualification.
