EPM570ZM144I8N - 440 Macrocell CPLD MAX II Z 152MHz | Intel
料号： EPM570ZM144I8N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $23.84 | $23.84 |
| 10 | $21.45 | $214.50 |
| 100 | $18.92 | $1,892.00 |
| 500 | $16.74 | $8,370.00 |
| 1,000 | $14.95 | $14,950.00 |
EPM570ZM144I8N 概述
A CPLD (Complex Programmable Logic Device) is a non-volatile, flash-based programmable logic IC that combines the instant-on behavior of a PAL/GAL with the density of a small FPGA. It sits between discrete 74-series glue logic and full FPGAs in the system hierarchy: glue logic -> SPLD -> CPLD -> FPGA -> ASIC. MAX II Z devices use a look-up table (LUT) based logic array plus a non-volatile flash configuration cell, giving them instant-on capability without external boot PROMs and excellent deterministic timing for bus-interface, address-decoding, and I/O-expansion tasks.
Key features of the EPM570ZM144I8N include 570 logic elements organized as 57 Logic Array Blocks (LABs) of 10 macrocells each, 8 Kbits of user flash memory (UFM), JTAG (IEEE 1149.1) and Altera built-in ISP via the JTAG interface, MultiVolt core and I/O support allowing mixing of 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, and four enhanced I/O banks. The I8N industrial temperature grade covers -40 °C to +85 °C operation, and the zero-power (Z) flash cell removes the need for a configuration download at every power-up.
Architecturally, the EPM570Z is built around a fine-grained Logic Element (LE) array with carry chains for fast arithmetic, an interconnect network with predictable delay paths, and a global control block driving four clock inputs with programmable polarity. The flash-based configuration is in-system programmable (ISP) and re-programmable up to 100 cycles per sector, which is sufficient for board-level prototyping and small production runs.
Typical applications include bus-interface bridging (PCI, ISA, VME legacy glue), address decoding and I/O expansion in microcontroller-based systems, power-up sequencing and supervisor logic, LED drive multiplexing, JTAG chain aggregation, and low-density state-machine replacement. Designers also use the EPM570Z as a feature-enhancement companion to an ASIC or MCU that lacks specific peripherals.
When designing with the EPM570ZM144I8N, observe Micro FBGA routing rules — pitch is 1.0 mm and the device requires a 4-layer PCB with via-in-pad or micro-via escape patterns to fan out the 144 ball grid. Reserve at least 1 Gnd and 1 Vcc reference ball per quadrant and use the dedicated JTAG TCK/TMS/TDI/TDO pins for boundary-scan test. Quiescent current is approximately 35 mA at 1.8 V; total power scales with toggle rate and I/O loading.
This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design notes that complement the Altera/Intel MAX II Z datasheet with information gain not available from any single source.
直接替换替代料： EPM570ZM144I8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM570ZM144I8N （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Process Technology, Logic Elements, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EPM570ZM144C7N
✅ 直接替换✓ 有现货
$15.4 / 个
查看数据手册 →EPM570ZM144C6N
✅ 直接替换✓ 有现货
$7.85 / 个
查看数据手册 →EPM570ZM144I8N 最大额定值与电气特性
| Product Type | CPLD - Complex Programmable Logic Device |
| Series | MAX II Z |
| Manufacturer | Intel (formerly Altera) |
| Number of Macrocells | 440 |
| Number of Logic Array Blocks (LABs) | 57 |
| Logic Elements | 570 |
| User I/Os | 116 |
| Maximum Operating Frequency | 152 MHz |
| Pin-to-Pin Delay | 9.0 ns |
| Operating Supply Voltage (Core) | 1.8 V |
| I/O Bank Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.18 µm |
| 封装 | 144-pin Micro FBGA (MBGA) |
| 安装方式 | SMD/SMT |
| User Flash Memory (UFM) | 8 Kbits |
| Configuration Memory | Non-volatile flash (zero-power Z series) |
| In-System Programmable | Yes (JTAG / IEEE 1149.1 ISP) |
| 工作温度 | -40 °C to +85 °C (Industrial, I8N grade) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
EPM570ZM144I8N 144-pin micro fbga (mbga) 引脚配置指南
EPM570ZM144I8N（144-pin micro fbga (mbga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPM570ZM144I8N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPM570ZM144I8N 适用于 6 应用s: Bus Interface Bridging & Legacy Glue Logic, Microcontroller I/O Expansion & Peripheral Emulation, Industrial Control & Factory Automation, Power Sequencing & Supervisor Logic, LED Display Multiplexing & Signage, JTAG Chain Aggregation & Boundary Scan.
Bus Interface Bridging & Legacy Glue Logic
The EPM570ZM144I8N's 440 macrocells, 116 user I/Os, and 4 MultiVolt I/O banks make it ideal for bridging between legacy 3.3 V / 5 V buses and modern 1.8 V ASICs or processors. Its deterministic 9 ns pin-to-pin delay supports address decoding, wait-state generation, and bus-width conversion up to ~80 MHz without timing closure issues. Designers use it to consolidate dozens of discrete 74-series glue packages into a single instant-on CPLD, reducing PCB area and BOM cost while improving EMI and signal-integrity margin.
推荐
Microcontroller I/O Expansion & Peripheral Emulation
When an MCU lacks PWM channels, UARTs, or enough GPIO, the EPM570ZM144I8N adds 116 user I/Os with deterministic timing and instant-on behavior — no boot PROM needed. The 8 Kbit User Flash Memory (UFM) can store calibration constants, serial numbers, or boot-time configuration. With 152 MHz internal performance, the part can emulate SPI, I2C master/slave, and UART interfaces in parallel while the MCU handles the main application logic.
推荐
Industrial Control & Factory Automation
The I8N industrial temperature grade (-40 °C to +85 °C) and MultiVolt I/O make the EPM570ZM144I8N well-suited to factory-floor PLC backplanes and motor-control boards. With 570 logic elements the part can implement multiple encoder-counters, PWM generators, and Modbus/Profibus glue logic concurrently. The non-volatile flash configuration ensures deterministic boot time after power cycles — critical for safety interlocks that must come up in a known state without external supervision.
推荐
Power Sequencing & Supervisor Logic
Power-up and power-down sequencing of multi-rail systems (e.g., processor + DDR + FPGA) requires deterministic, parallel monitoring that an MCU cannot guarantee because the MCU itself is one of the rails. The EPM570ZM144I8N powers up instantly in a known state, monitors PG (power-good) signals from each rail, and drives the enable sequence in the correct order with programmable delay chains. This eliminates external sequencer chips and reduces the sequencer BOM to a single programmable device with field-upgradeable logic.
推荐
LED Display Multiplexing & Signage
Large LED matrix displays (RGB panels, stadium signage, transit-information signs) require high-channel-count multiplexing with low EMI. The EPM570ZM144I8N drives up to 116 LED rows or columns with precise duty-cycle control, while its flash-based non-volatile memory stores gamma tables and patterns that load at boot without external SPI flash. Industrial temperature grade and SMD mounting support outdoor enclosure deployment with conformal coating.
推荐
JTAG Chain Aggregation & Boundary Scan
Many boards have more JTAG devices than the available TCK/TMS chain headers. The EPM570ZM144I8N aggregates multiple JTAG chains behind a single TAP, performing pre-scan remap and device-order changes without external multiplexers. With JTAG pins already required for its own ISP, the part can also serve as a chain master that reprograms peer devices during production test, simplifying ATE fixtures and improving test coverage.
推荐
推荐产品汇总
工程参考数据： EPM570ZM144I8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM570ZM144C7N | EPM570ZM144C6N | EPM570ZM100I8N | EPM570T144I5N | EPM570GT144I5N |
|---|---|---|---|---|---|---|
| Package | 144-MBGA (Micro FBGA) | 144-MBGA (Micro FBGA) - same | 144-MBGA (Micro FBGA) - same | 100-EQFP - different | TQFP-144 - different | TQFP-144 - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX II Z | MAX II Z | MAX II Z | MAX II Z | MAX II (T-series) | MAX II G |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/Os | 116 | 116 | 116 | ~80 (100-pin package) | 116 | 116 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Temperature Grade | Industrial -40 to +85 C | Commercial 0 to +85 C | Commercial 0 to +85 C | Industrial -40 to +85 C | Industrial -40 to +85 C | Industrial -40 to +85 C |
| Pin-to-Pin Delay | 9.0 ns | ~9 ns (C7 speed grade) | ~8 ns (C6 speed grade) | ~9 ns | ~5-7 ns (T-series, TBD by speed grade) | ~6-8 ns (G-series) |
关键差异点
- Same-package commercial-temp variant available for cost-down designs （对比 EPM570ZM144C7N)
- Higher speed-grade drop-in variant exists for timing-critical paths （对比 EPM570ZM144C6N)
- Lower-pin same-family variant when fewer I/Os are required （对比 EPM570ZM100I8N)
- TQFP-144 footprint option for hand-soldered designs （对比 EPM570T144I5N)
设计说明
The 144-MBGA package has 1.0 mm ball pitch, which is fine for standard 4-layer PCBs but requires careful escape routing. Place at least one GND via adjacent to every VCCINT/VCCIO ball and use a continuous ground/power plane pair directly under the device. For production-grade designs, consider via-in-pad with filled-and-plated-over vias to minimize inductance on the decoupling path. JTAG TCK must be routed with ≤ 8 nH loop inductance to meet ISP timing.
Decouple VCCINT (1.8 V core) with one 0.1 µF X7R 0402/0201 ceramic per supply ball, plus one 10 µF bulk tantalum or ceramic per quadrant. Each VCCIO bank must have its own 0.1 µF decoupling at the bank pins; the four I/O banks are independent so do not assume shared decoupling is acceptable. Place input bulk capacitors within 5 mm of the supply balls. Typical quiescent current is ~35 mA at 1.8 V but rises with toggle rate — confirm with worst-case vector simulation.
Do not confuse the MAX II Z (EPM570Z***) with the legacy MAX II T-series (EPM570T***) or MAX II G (EPM570G***) when ordering — pin assignments differ across packages even though the macrocell count is identical. Also verify the JTAG TCK frequency is within the MAX II Z ISP specification (typically 33 MHz) because faster TCK can corrupt configuration. When migrating to the EPM570ZM144C7N (commercial temperature grade), confirm your application does not require the -40 °C lower industrial range of the I8N part.
For MultiVolt I/O bank mixing, never tie VCCIO of one bank to a voltage that violates the VIL/VIH specification of a connected device. Use the Quartus Prime pin-planner to lock I/O standards (LVTTL, LVCMOS, PCI) per pin. Series-resist (22-33 Ω) high-speed outputs that fan out to long traces to dampen reflections; the EPM570Z driver impedance varies with VCCIO and drive-strength setting.
合规信息
RoHS and lead-free compliance per Intel/Altera MAX II Z product page. AEC-Q100 not applicable because the part is a logic device, not an automotive-grade IC with explicit AEC qualification.
