ES32H747XIH6U - Dual-Core ARM Cortex-M7/M4 MCU 480MHz | STMicroelectronics
Teilenummer: ES32H747XIH6U ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.9 | $289,00 |
| 100 | $25.4 | $2.540,00 |
| 500 | $22.1 | $11.050,00 |
| 1.000 | $19.75 | $19.750,00 |
ES32H747XIH6U Übersicht
An MCU (microcontroller unit) is a single-chip computer that combines a CPU core, non-volatile program memory, working RAM, and a rich set of on-chip peripherals. The STM32H7 family sits at the top of the Cortex-M performance hierarchy: Cortex-M7 -> 32-bit MCU -> microcontroller -> embedded computing platform. Within that family the dual-core STM32H747 series adds heterogeneous processing, where code can run concurrently on both cores with deterministic inter-core messaging.
Key features include 2 MB dual-bank Flash with ECC, 1 MB SRAM (including 192 KB DTCM + 64 KB ITCM for the M7 and 256 KB system SRAM shared between the cores), Chrom-ART graphics accelerator, JPEG codec, a built-in SMPS for direct 2.7 V–3.6 V single-rail operation, MIPI-DSI host interface, and a parallel 16-bit RGB LCD-TFT controller. Peripherals include up to 35 communication interfaces (USART, UART, SPI, I2C, SAI, FDCAN, USB 2.0 FS+HS, SDMMC), three 12-bit ADCs (3.6 MSPS), two 12-bit DACs, and crypto/hash accelerators.
Typical applications include industrial HMI panels with TFT/DSI displays, motor-control and inverter platforms, medical patient monitors, audio DSP front-ends, and IoT edge gateways. The TFBGA-240+25 package exposes the parallel camera interface, DSI lanes, Ethernet MAC, and SDMMC, enabling direct connection of high-bandwidth peripherals without external bridge ICs.
When designing with this part, ensure the PCB has at least 4 copper layers to fan out the 240-ball grid with proper ground stitching, and follow ST's reference manual for SMPS inductor selection. Decoupling must include 100 nF capacitors within 1 mm of every supply pin plus bulk 4.7 µF on each supply rail.
Drop-in-Alternativen für ES32H747XIH6U – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ES32H747XIH6U (gleiche Bauform und Footprint) – abweichend in Package, SRAM, Communication Interfaces, Flash Memory, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
STM32H747XIH6
✅ Drop-In✓ Auf Lager
$16.2 / Stück
Datenblatt ansehen →STM32H747XIH6U3
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
STM32H757XIH6
✅ Drop-In✓ Auf Lager
$12.18 / Stück
Datenblatt ansehen →STM32H747IIT6
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
STM32H745XIH6
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
ES32H747XIH6U Grenzwerte & elektrische Eigenschaften
| Core Architecture | Dual-core ARM Cortex-M7 + Cortex-M4 |
| M7 Core Frequency | up to 480 MHz |
| M4 Core Frequency | up to 240 MHz |
| Program Memory (Flash) | 2 MB (2M x 8), dual-bank with ECC |
| SRAM | 1 MB total (192 KB DTCM + 64 KB ITCM + 256 KB system + AXI SRAM) |
| Gehäuse | 240+25-ball TFBGA (14x14 mm) |
| Versorgungsspannung | 1.62 V to 3.6 V (with internal SMPS) |
| Betriebstemperatur | -40 C to +85 C (industrial grade 6) |
| Display Interface | MIPI-DSI host + 16-bit RGB LCD-TFT controller |
| Graphics Acceleration | Chrom-ART Accelerator (DMA2D), JPEG codec |
| ADC | 3x 12-bit, up to 3.6 MSPS |
| DAC | 2x 12-bit |
| Communication Interfaces | Up to 35 (USART/UART/SPI/I2C/SAI/FDCAN/USB FS+HS/SDMMC) |
| Ethernet | 10/100 Mbps MAC (external PHY required) |
| Crypto / Hash | AES, Hash (SHA-256), True Random Number Generator |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
ES32H747XIH6U 240+25-ball tfbga (14x14 mm) Pinbelegungsleitfaden
Pinbelegung für ES32H747XIH6U (240+25-ball tfbga (14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für ES32H747XIH6U.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ES32H747XIH6U ist geeignet für 7 Anwendungs: Industrial HMI with DSI Display, Medical Patient Monitor, Audio DSP and Effects Processor, Motor Control and Inverter Platform, IoT Edge Gateway with TLS Security, Automotive Infotainment / Cluster, Smart Appliance / Home Appliance Control.
Industrial HMI with DSI Display
The ES32H747XIH6U drives industrial HMI panels through its integrated MIPI-DSI 2-lane host controller, supporting up to WUXGA (1920x1200) resolution at 60 fps. The 480 MHz Cortex-M7 runs the LVGL graphics stack while the 240 MHz Cortex-M4 handles Modbus, CAN, and EtherCAT fieldbus traffic in parallel. Its 2 MB Flash and 1 MB SRAM accommodate full framebuffers without external memory, and the Chrom-ART DMA2D accelerator offloads block-copy/composition from the CPU. Designers should reserve 4-layer PCB with 50-ohm DSI lanes and place the SMPS inductor within 5 mm of the VCAP pins.
Empfohlen
Medical Patient Monitor
In medical patient monitors the ES32H747XIH6U's dual-core architecture isolates safety-critical signal acquisition on the Cortex-M4 from the M7-driven display and DSP processing of ECG/SpO2 waveforms. The three 12-bit 3.6 MSPS ADCs simultaneously sample multiple biosignal channels with hardware oversampling for noise reduction. The hardware AES/SHA (via STM32H757 upgrade) secures patient data on TLS 1.3 connections. Operating temperature of -40 C to +85 C supports clinical and laboratory environments.
Empfohlen
Audio DSP and Effects Processor
The 480 MHz Cortex-M7 with single-precision FPU and DSP extensions makes the ES32H747XIH6U well-suited for multi-channel audio processing - parametric EQ, reverb, dynamics, and beamforming - at 96 kHz / 24-bit sample rates. The SAI (Serial Audio Interface) ports connect directly to professional audio DACs and ADCs. The dual-core split places effects processing on the M7 and user-interface/MIDI control on the M4, avoiding audio glitches during UI updates. The internal SMPS provides a clean 1.0 V core rail without external switching noise coupling into the analog path.
Empfohlen
Motor Control and Inverter Platform
The ES32H747XIH6U drives 3-phase FOC motor control loops with deterministic timing on the Cortex-M4 while the M7 handles higher-level communications (EtherCAT, CAN FD) and user-facing diagnostics. The advanced timer peripherals (TIM1/TIM8/TIM15/TIM16/TIM17 with complementary PWM and deadband insertion) and three 3.6 MSPS ADCs provide simultaneous current/voltage sampling at 20 kHz PWM. The SMPS and low-dropout regulators on-chip simplify the auxiliary supply chain in compact inverter modules.
Empfohlen
IoT Edge Gateway with TLS Security
As an IoT edge gateway, the ES32H747XIH6U runs an HTTPS/MQTT client on the Cortex-M7 with the M4 dedicated to local sensor aggregation over UART/RS-485 and BLE. Up to 35 communication interfaces including two USB 2.0 (FS+HS), two SDMMC, FDCAN, and multiple SPI/I2C/UART allow direct connection to cellular modems, Wi-Fi modules, and secure-element companions. Designers preferring hardware crypto should upgrade to the pin-compatible STM32H757XIH6 for AES-256, SHA-256, and TRNG on-chip, accelerating TLS handshakes by 3-5x versus software crypto.
Empfohlen
Automotive Infotainment / Cluster
For automotive digital instrument clusters and infotainment head units, the ES32H747XIH6U drives two displays simultaneously via the MIPI-DSI host and the parallel 16-bit RGB LCD-TFT controller, supporting 1080p cluster plus 720p center-stack. The dual-core split allows cluster graphics on M7 while the M4 handles CAN-FD body-network and vehicle-signaling tasks. For AEC-Q100 qualified deployments, designers should consider the drop-in STM32H747XIH6U3 automotive variant. The 14x14 mm TFBGA footprint fits within the tight thermal envelope behind the dashboard.
Empfohlen
Smart Appliance / Home Appliance Control
In high-end home appliances such as robotic vacuum cleaners, washing machines, and induction cooktops, the ES32H747XIH6U's dual-core architecture handles motor FOC algorithms on the M4 while the M7 runs the touch-screen UI and Wi-Fi cloud connectivity. The integrated JPEG codec accelerates QR-code scanning and camera-based navigation. Hardware cryptographic support (via STM32H757 migration path) secures OTA firmware updates against tampering. The wide operating temperature range of -40 C to +85 C covers both kitchen and laundry environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ES32H747XIH6U – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | STM32H747XIH6 | STM32H747XIH6U3 | STM32H757XIH6 | STM32H745XIH6 | STM32H747IIT6 |
|---|---|---|---|---|---|---|
| Package | TFBGA-240+25 (14x14 mm) | TFBGA-240+25 (14x14 mm) - same | TFBGA-240+25 (14x14 mm) - same | TFBGA-240+25 (14x14 mm) - same | TFBGA-240+25 (14x14 mm) - same | TFBGA-176 (10x10 mm) - different footprint |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Cores | Cortex-M7 480 MHz + Cortex-M4 240 MHz | Cortex-M7 480 MHz + Cortex-M4 240 MHz | Cortex-M7 480 MHz + Cortex-M4 240 MHz | Cortex-M7 480 MHz + Cortex-M4 240 MHz + crypto | Cortex-M7 480 MHz + Cortex-M4 240 MHz (lower flash) | Cortex-M7 480 MHz + Cortex-M4 240 MHz (TFBGA-176) |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB | 2 MB |
| SRAM | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| MIPI-DSI Host | Yes (2-lane, up to WUXGA) | Yes | Yes | Yes | Yes | Yes |
| Hardware Crypto | No (AES via software library) | No | No | Yes (AES, SHA, TRNG) | No | No |
| Automotive Grade | Industrial (-40 to +85 C) | Industrial | AEC-Q100 Grade 3 | Industrial | Industrial | Industrial |
| Approx. Unit Price (1 pc, USD) | 32.50 | 32.50 | 36.00 (est.) | 38.00 (est.) | 27.50 (est.) | 28.00 (est.) |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible upgrade path to AEC-Q100 automotive grade (vs. STM32H747XIH6U3)
- Drop-in upgrade to hardware crypto accelerator (vs. STM32H757XIH6)
- 2 MB Flash vs 1 MB Flash drop-in downgrade (vs. STM32H745XIH6)
Designhinweise
The TFBGA-240+25 package has a 0.8 mm ball pitch and requires at least a 4-layer PCB with 0.5 oz copper on outer layers and 1 oz on inner planes. Use via-in-pad with filled-and-plated-over vias under each thermal/ground ball to maximize heat extraction. Per IPC-2222 design rules, fan-out should reserve at least a 6-mil trace-and-space for signal escape. ST's STM32H747 reference layouts (Altium and Cadence Allegro) are available on st.com.
Estimated: at full M7+M4 dual-core load (480 MHz + 240 MHz with all peripherals enabled) the core current draw is approximately 290 mA at 1.0 V internal rail. Add a 4.7 µF X7R ceramic plus 100 nF decoupling within 1 mm of every VCAP pin. The internal SMPS requires a 4.7 µH to 10 µH shielded inductor with saturation current >= 700 mA on the SMPS_V1/L1 pins; refer to STM32H747 hardware design guide section 5.
Do not route DSI clock and data lanes over a discontinuous reference plane - DSI is a current-mode differential interface sensitive to impedance breaks. Place the DSI connector within 50 mm of the BGA and use 100-ohm differential impedance with length matching within 150 µm. Also note that the SDMMC and DSI share some internal bus bandwidth; concurrent use may require DMA bandwidth budgeting. Boot pins (BOOT0) must be left floating or pulled low for normal Flash boot.
Estimated: at maximum dual-core load with peripherals enabled, package dissipation is approximately 0.8 W. The 14x14 mm TFBGA with 25 thermal balls reaches a junction-to-ambient thermal resistance (theta_JA) of approximately 28 C/W on a 4-layer JEDEC EIA/JESD51 test board. Sustained 85 C ambient operation requires verifying with a thermal-coup test in your actual enclosure - consider the -40 C to +85 C industrial limit as the worst-case envelope.
Compliance-Informationen
Industrial grade -40C to +85C. RoHS/REACH compliant per STMicroelectronics product page. AEC-Q100 Grade 3 qualified variant available as STM32H747XIH6U3.
