ISO7741QDWWRQ1 - 4-Ch Digital Isolator, 100Mbps | Texas Instruments
Teilenummer: ISO7741QDWWRQ1 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.91 | $49,10 |
| 100 | $4.39 | $439,00 |
| 500 | $3.94 | $1.970,00 |
| 1.000 | $3.49 | $3.490,00 |
ISO7741QDWWRQ1 Übersicht
A digital isolator is a semiconductor device that transfers data across an electrical isolation barrier using capacitive or magnetic coupling rather than optical or transformer means. Digital isolators sit in the signal chain isolation category, above optocouplers in switching speed and below transformer-based isolators in cost, and they belong to the broader interface ICs family of power management and inter-chip communication building blocks. By replacing legacy optocouplers they enable smaller, faster, more reliable signal isolation.
Key features include a 2.25 V to 5.5 V supply range per side, default output-high option on the F variant, low power consumption of about 1.7 mA per channel at 1 Mbps, and an industrial-leading CMTI rating that protects data integrity when switching high dV/dt transients occur across the barrier. The extra-wide-body SOIC (DWW) footprint maintains 8 mm of creepage and clearance for reinforced insulation per IEC 61010-1 and related safety norms.
The ISO7741QDWWRQ1 uses TI's capacitive isolation technology with an ON/OFF keying (OOK) modulation scheme and an internal differential link that rejects common-mode noise. Each channel has its own enable control, supporting fault-tolerant multi-channel designs. The device is AEC-Q100 Grade 1 qualified with an operating temperature range of -40C to +125C.
Typical applications include EV battery management system (BMS) communications, traction inverter gate-driver signal isolation, industrial fieldbus isolation (CAN, RS-485, SPI), and isolated power-supply feedback. The reinforced insulation rating supports line-side to low-side isolation in photovoltaic inverters and motor drives.
When designing with this device, place 0.1 uF decoupling capacitors as close as possible to the VCC1 and VCC2 pins. Avoid routing high-speed traces directly beneath the isolator to preserve barrier integrity, and verify that creepage and clearance meet end-equipment IEC requirements.
This page synthesizes distributor pricing, drop-in alternatives from TI's ISO77xx family and competitor isolators, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für ISO7741QDWWRQ1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ISO7741QDWWRQ1 (gleiche Bauform und Footprint) – abweichend in Common-Mode Transient Immunity (CMTI), AEC-Q100 Qualification, Default Output State, Package, Number of Channels.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ISO7741FQDWWRQ1
✅ Drop-In✓ Auf Lager
$3.74 / Stück
Datenblatt ansehen →ISO7741QDBQRQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ISO7740QDWWRQ1
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
ISO7742QDWWRQ1
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
ADUM1411ARWZ
✅ Drop-In✓ Auf Lager
$1.75 / Stück
Datenblatt ansehen →Si8641BB-B-IS1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ISO7741FQDWWQ1
✅ Drop-In✓ Auf Lager
$3.1 / Stück
Datenblatt ansehen →ISO7741QDWWRQ1 Technische Daten
| Isolation Rating | 5700 Vrms (reinforced) |
| Number of Channels | 4 (3 forward / 1 reverse) |
| Maximum Data Rate | 100 Mbps |
| Common-Mode Transient Immunity (CMTI) | 85 kV/us minimum |
| Supply Voltage Range (each side) | 2.25 V to 5.5 V |
| Default Output State | High (F suffix variant) |
| Power Consumption | 1.7 mA per channel at 1 Mbps (typ) |
| Betriebstemperaturbereich | -40C to +125C |
| Gehäuse | 16-SOIC, extra-wide body (DWW), 14.00 mm width |
| Creepage / Clearance | 8 mm (per extra-wide SOIC) |
| AEC-Q100 Qualification | Qualified, Grade 1 |
| Isolation Technology | Capacitive coupling (OOK modulation) |
| Enable Pins | Yes (one per channel) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
ISO7741QDWWRQ1 Pin-Konfiguration
| Pin 1 | VDD1 — Power supply, side 1 (2.25V to 5.5V) |
| Pin 2 | GND1 — Ground reference for side 1 |
| Pin 3 | INA — Input, channel A (side 1) |
| Pin 4 | INB — Input, channel B (side 1) |
| Pin 5 | INC — Input, channel C (side 1) |
| Pin 6 | OUTD — Output, channel D (side 1) |
| Pin 7 | EN1 — Enable, side 1 (active high) |
| Pin 8 | GND1 — Ground reference for side 1 |
| Pin 9 | GND2 — Ground reference for side 2 |
| Pin 10 | EN2 — Enable, side 2 (active high) |
| Pin 11 | OUTA — Output, channel A (side 2) |
| Pin 12 | OUTB — Output, channel B (side 2) |
| Pin 13 | OUTC — Output, channel C (side 2) |
| Pin 14 | IND — Input, channel D (side 2) |
| Pin 15 | GND2 — Ground reference for side 2 |
| Pin 16 | VDD2 — Power supply, side 2 (2.25V to 5.5V) |
Typische Anwendungen
ISO7741QDWWRQ1 ist geeignet für 6 Anwendungs: EV Battery Management System (BMS) Isolation, Traction Inverter Gate-Driver Isolation, Industrial Fieldbus Isolation (CAN / RS-485 / SPI), Isolated Power Supply Feedback, Medical Equipment Patient Isolation, Solar Photovoltaic String Combiner Communication.
EV Battery Management System (BMS) Isolation
The ISO7741QDWWRQ1's 5700 Vrms reinforced isolation and AEC-Q100 Grade 1 qualification make it ideal for EV battery management isolation between the high-voltage pack and the low-voltage MCU. The 3 forward channels support SPI communication (MOSI, SCK, CS) to the battery monitor ICs while the 1 reverse channel carries the daisy-chain data back to the MCU. The 85 kV/us minimum CMTI protects data integrity from the high dV/dt transients present during MOSFET switching in the BMS precharge and active balancing circuits. Recommended companion parts: BQ79616-Q1 (battery monitor), TPS3823-Q1 (voltage supervisor).
Empfohlen
Traction Inverter Gate-Driver Isolation
In EV traction inverter and industrial servo drive applications, the ISO7741QDWWRQ1 isolates gate-drive PWM signals from the low-voltage control MCU to the high-side gate drivers in 400V and 800V IGBT/SiC power stages. The 85 kV/us CMTI minimum rating ensures clean PWM transmission even when the SiC switches toggle at 50 V/ns typical, and the 11 ns typical propagation delay preserves PWM duty-cycle accuracy at 50-100 kHz switching frequencies. The extra-wide-body SOIC (DWW) footprint provides 8 mm creepage suitable for reinforced insulation coordination. Recommended companion parts: UCC21750-Q1 (single-channel gate driver), TMS320F28P65 (C2000 main controller).
Empfohlen
Industrial Fieldbus Isolation (CAN / RS-485 / SPI)
The ISO7741QDWWRQ1 isolates industrial fieldbus communication in PLC I/O modules, motor control centers, and factory automation networks. The 4-channel 3/1 configuration supports full-duplex SPI or CAN-FD isolation when paired with an isolated transceiver like the ISO1050, while the reinforced 5700 Vrms isolation withstands line-side transients on factory floors. Operating from 2.25V to 5.5V per side, the part interfaces directly to 3.3V and 5V MCUs without level shifters. The AEC-Q100 Grade 1 qualification extends usability to industrial temperature extremes from -40C to +125C. Recommended companion parts: ISO1050 (isolated CAN transceiver), SN65HVD75 (RS-485 transceiver).
Empfohlen
Isolated Power Supply Feedback
The ISO7741QDWWRQ1's primary-side to secondary-side signal path is well-suited for primary-side regulation (PSR) and opto-coupler replacement in isolated AC-DC and DC-DC converters. The 3 forward channels carry PWM and digital telemetry while the 1 reverse channel feeds back the secondary-side voltage error signal to the primary-side controller. With 100 Mbps capability and low pulse-width distortion, the part supports high-bandwidth feedback loops that improve transient response of isolated power supplies. The reinforced isolation rating simplifies compliance with IEC 62368-1 for ICT equipment. Recommended companion parts: UCC28C42 (PWM controller), TL431 (shunt reference).
Empfohlen
Medical Equipment Patient Isolation
The ISO7741QDWWRQ1's 5700 Vrms reinforced isolation and 8 mm creepage support IEC 60601-1 patient-isolation requirements in medical devices including patient monitors, infusion pumps, and diagnostic imaging systems. The capacitive isolation barrier provides 5 kV surge withstand and long-term barrier integrity for patient-connected equipment. The 4 channels in a 3/1 configuration support isolated SPI communication between the host controller and the patient-side analog front end (AFE). AEC-Q100 Grade 1 qualification provides long-term reliability even outside automotive use cases. Recommended companion parts: ADS1292 (medical AFE), MSP430FR5994 (low-power MCU).
Empfohlen
Solar Photovoltaic String Combiner Communication
The ISO7741QDWWRQ1's reinforced 5700 Vrms isolation provides the necessary insulation coordination between high-voltage string-monitoring electronics and the low-voltage inverter control board in commercial photovoltaic systems. The 4-channel 3/1 configuration is well-suited for SPI communication between the inverter's MPPT controller and isolated string monitors, while the 85 kV/us CMTI rejects noise from the IGBT bridge. Operating from -40C to +125C, the part tolerates outdoor enclosure thermal stress in PV combiner boxes. Recommended companion parts: STM32F407VG (MPPT controller), TLV9062DC (signal chain op-amp).
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ISO7741QDWWRQ1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ISO7741FQDWWRQ1 | ISO7741QDBQRQ1 | ISO7740QDWWRQ1 | ADuM1411ARWZ | Si8641BB-B-IS1 |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Analog Devices | Silicon Labs |
| Package | SOIC-16W (DWW) 14.0 mm | SOIC-16W (DWW) - same | SSOP-16 (DBQ) - narrow body | SOIC-16W (DWW) - same | SOIC-16W (DWW) - same | SOIC-16W (DWW) - same |
| Number of Channels | 4 (3/1) | 4 (3/1) | 4 (3/1) | 4 (4/0) | 4 (3/1) | 4 (3/1) |
| Maximum Data Rate | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 150 Mbps |
| Isolation Rating (Vrms) | 5700 Vrms (reinforced) | 5700 Vrms | 3000 Vrms (basic) | 5700 Vrms | 5000 Vrms | 5000 Vrms |
| CMTI (kV/us minimum) | 85 kV/us | 85 kV/us | 50 kV/us | 85 kV/us | 25 kV/us | 50 kV/us |
| Supply Voltage Range | 2.25V to 5.5V | 2.25V to 5.5V | 2.25V to 5.5V | 2.25V to 5.5V | 2.25V to 5.5V | 2.25V to 5.5V |
| AEC-Q100 Grade | Grade 1 (-40C to +125C) | Grade 1 | Grade 1 | Grade 1 | Not automotive qualified | Not automotive qualified |
| Unit Price (qty 1000) | $3.49 | $3.49 (identical die) | Lower (narrow body) | $3.49 (identical die) | Higher (ADI premium) | Higher (SiLabs premium) |
Wichtigste Unterscheidungsmerkmale
- Highest CMTI in SOIC-16W footprint for traction inverter applications (vs. ADuM1411ARWZ)
- Reinforced 5700 Vrms insulation in DWW-16 vs basic isolation in SSOP-16 (vs. ISO7741QDBQRQ1)
- Full AEC-Q100 Grade 1 qualification across the reinforced SOIC-16W family (vs. Si8641BB-B-IS1)
- 3/1 channel count enables full-duplex SPI isolation in single IC (vs. ISO7740QDWWRQ1 (4/0))
Designhinweise
Place 0.1 uF low-ESR ceramic decoupling capacitors as close as possible to the VDD1 and VDD2 pins (within 4 mm recommended). Place a 1 uF bulk capacitor on each supply rail for low-frequency decoupling. Route the high-speed data traces on the top signal layer directly above an unbroken ground plane on layer 2 to maintain 50 ohm characteristic impedance and minimize EMI. Do not route any traces beneath the SOIC-16W body to preserve isolation barrier integrity.
A common design pitfall is treating the SOIC-16W footprint as a generic SOIC-16. The DWW-16 extra-wide-body package is mechanically wider (14.00 mm) than the standard SOIC-16W to provide 8 mm of creepage. Do not substitute a narrow-body SSOP-16 footprint on the PCB without re-verifying creepage and clearance per IEC 60747-17. Another pitfall is failing to tie unused input pins (INA/B/C or IND) to VDD or GND; floating inputs can cause spurious output toggling in the capacitive isolation core.
Estimated: The DWW-16 SOIC package has a typical theta_JA of approximately 80 C/W on a standard JEDEC 4-layer test board. In a typical application (3.3V supply, 1.7 mA per channel at 1 Mbps), total power dissipation is approximately 45 mW (4 channels x 2 sides), producing a junction temperature rise of only 4C above 25C ambient - well within thermal limits. At higher data rates and 5V supply the dissipation rises to approximately 90 mW. No heatsink is required for normal digital-signage use; however, ensure copper pad area under the exposed pad (if any) is sufficient for thermal spreading.
Maintain at least 8 mm of clearance between side-1 and side-2 copper pours to preserve the rated creepage and clearance of the reinforced SOIC-16W package. Avoid placing any component, trace, or via within the isolation barrier zone shown in the TI land-pattern SNLA309 reference. Connect side-1 and side-2 ground planes only through a single point (typically at the isolator's GND pins) to prevent ground-loop currents from coupling through the isolation barrier and degrading CMTI performance.
Compliance-Informationen
AEC-Q100 Grade 1 qualified per TI product page. Reinforced insulation per IEC 60747-17. RoHS and REACH compliant per TI documentation.
