K9F6408Q0C - 64Mb 8M x8 NAND Flash 1.8V | Samsung Electronics
Teilenummer: K9F6408Q0C ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.1 | $2,10 |
| 10 | $1.89 | $18,90 |
| 100 | $1.68 | $168,00 |
| 500 | $1.47 | $735,00 |
| 1.000 | $1.31 | $1.310,00 |
K9F6408Q0C Übersicht
NAND Flash is a non-volatile solid-state mass storage technology that stores data in floating-gate cells wired in series, trading random-access convenience for very high density, low bit cost, and fast sequential throughput. In the memory hierarchy, NAND Flash sits below DRAM and above serial EEPROM/NOR Flash in density, and the K9F6408 family was one of the earliest small-page (528-byte page) SLC NAND generations targeted at embedded and portable storage.
Key features of the K9F6408Q0C include an 8M x 8-bit main array with a 256K x 8-bit spare area for ECC and bad-block management, a 1.8V (1.65V to 1.95V) operating supply for battery-powered portable equipment, and a standard asynchronous NAND command/data/address interface multiplexed on an 8-bit I/O bus controlled by CLE, ALE, CE, WE, RE and a ready/busy (R/B) handshake.
Architecturally, the device is organized into blocks and 528-byte pages; program and erase operations are commanded via the multiplexed I/O bus, with page read times on the order of microseconds and erase/program cycles managed by the R/B output. Per datasheet family information, the part is offered in commercial and industrial temperature grades (C, i). Samsung datasheet archives list multiple suffix variants (K9F6408U0C/Q0C -B, -H, -Q, -T, -F, -V) covering package and grade options.
Typical applications cited by distributors include solid-state file storage, digital voice recorders, digital still cameras, and other portable, non-volatile mass storage designs.
Design consideration: this is an EOL/legacy small-page SLC NAND generation - designers must implement bad-block management and ECC in the host controller, and should verify package change notices (the TBGA option changed from 63-ball 9x11mm to 48-ball 6x8.5mm within the family).
This page adds value beyond the manufacturer datasheet by consolidating drop-in family alternatives, package change information, and application guidance for legacy BOM recovery.
Drop-in-Alternativen für K9F6408Q0C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit K9F6408Q0C (gleiche Bauform und Footprint) – abweichend in Interface, Memory Type, Operating Voltage (VCC), Organization, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
K9F6408Q0C-HIB0
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
K9F6408Q0C-B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
K9F6408U0C-H
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
K9F6408U0C-Q
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
K9F6408U0C-T
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
K9F6408U0C-F
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
K9F6408U0C-V
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
K9F6408Q0C Grenzwerte & elektrische Eigenschaften
| Speichertyp | NAND Flash (SLC) |
| Memory Capacity | 64 Mbit (8 M x 8 bit main + 256 K x 8 bit spare) |
| Speicherorganisation | 8M x 8 |
| Schnittstelle | Parallel, 8-bit multiplexed I/O |
| Operating Voltage (VCC) | 1.65 V to 1.95 V |
| Access Time | 10 us (read cycle, family listing) |
| Page Size | 528 bytes (512 data + 16 spare) |
| Temperature Grade | C (commercial), i (industrial) |
| Package (HIB0 variant) | 48-ball TBGA |
| Package (family TBGA note) | 9 mm x 11 mm 63-ball changed to 6 mm x 8.5 mm 48-ball |
| Montageart | Surface Mount |
| Spare Area | 256K x 8 bit |
| Control Signals | CLE, ALE, CE, WE, RE, WP, R/B |
| Bad Block Management | Host-managed (marking in spare area) |
K9F6408Q0C 9 mm x 11 mm 63-ball changed to 6 mm x 8.5 mm 48-ball Pinbelegungsleitfaden
Pinbelegung für K9F6408Q0C (9 mm x 11 mm 63-ball changed to 6 mm x 8.5 mm 48-ball-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für K9F6408Q0C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
K9F6408Q0C ist geeignet für 6 Anwendungs: Digital Voice Recorders, Digital Still Cameras (Legacy), Solid State File Storage, Portable Battery-Powered Devices, Set-Top Box and Embedded Firmware Storage, Industrial Data Loggers.
Digital Voice Recorders
The K9F6408Q0C was purpose-built for digital voice recorder storage: its 64-Mbit (8MB) SLC array holds hours of compressed speech audio, and the 1.65V-1.95V supply matches single-cell battery rails without a boost converter. The 528-byte page size aligns with codec frame buffering, and the microsecond-class read access keeps audio streaming seamless from the multiplexed 8-bit I/O bus. Because SLC stores one bit per cell, the endurance margin comfortably supports daily record/erase cycling. The host controller implements ECC in the 16-byte spare area and bad-block replacement, preserving audio integrity over years of use in compact, battery-powered voice recorders and dictation equipment.
Empfohlen
Digital Still Cameras (Legacy)
In legacy digital still camera boards, the K9F6408Q0C provided removable or internal image storage: 8MB of SLC NAND stored compressed JPEG frames, with the 1.8V operation minimizing battery drain during burst capture and writeback. The parallel NAND interface delivered the sequential write bandwidth needed for multi-megapixel image files of that era, while the R/B handshake let the camera CPU overlap capture and storage. Designers paired the device with controller-era ECC in the spare area to protect image data. For service and repair of legacy cameras, same-family variants (Q0C-HIB0, U0C series) remain the correct replacements since no modern NAND shares this footprint.
Empfohlen
Solid State File Storage
The K9F6408Q0C served as solid-state file storage in embedded systems that required non-volatile data retention without rotating media: configuration logs, data loggers, and small file systems. Its SLC cells retain data without refresh, and the block-erase/page-program architecture maps naturally onto FAT-style file allocations. With a 10us-class page read and microsecond-bus transfers on the 8-bit multiplexed interface, embedded CPUs could service file reads with minimal latency. The 256K spare area supported wear-leveling and bad-block maps. Engineering value today is in legacy BOM recovery - the device sustains existing file-storage boards while new designs move to modern SLC NAND generations.
Empfohlen
Portable Battery-Powered Devices
With a 1.65V-1.95V operating window, the K9F6408Q0C directly matches lithium single-cell and dual-alkaline battery rails, making it a natural non-volatile store for PDAs, handheld meters, and portable instruments of its generation. SLC NAND's low standby behavior and page-level programming meant the host could wake, write a record, and power down quickly, conserving battery energy. The 8-bit multiplexed bus minimized pin count and board area in handheld layouts, and C/i temperature grades covered consumer through portable-industrial environments. Replacement stock for such boards comes exclusively from remaining K9F6408 family inventory, as modern NAND is not footprint-compatible.
Empfohlen
Set-Top Box and Embedded Firmware Storage
Embedded set-top boxes and consumer appliances used small-page SLC NAND such as the K9F6408Q0C to hold bootloader and firmware images: 8MB sufficed for compressed code images, and the parallel NAND interface provided fast boot-time page reads at 1.8V. The R/B output allowed the boot CPU to poll or interrupt on program/erase completion, and the WP pin protected the boot region against accidental writes. Host-side ECC in the 16-byte spare area maintained firmware integrity. For these legacy boards, same-family suffix variants remain the service replacement path; new firmware-storage designs should adopt current Samsung K9-series SLC or SPI NAND.
Empfohlen
Industrial Data Loggers
Industrial data loggers relied on the K9F6408Q0C's industrial (i) temperature grade and non-volatile SLC cells to record sensor samples across power cycles without batteries backing a RAM store. The 1.65V-1.95V supply fit low-power logger electronics, while block-erase granularity let controllers manage wear across 64Mb with spare-area bad-block maps. SLC reliability - one bit per cell - provided a wide noise margin important in electrically noisy factory environments. The legacy status of the device means loggers in long-deployment service are now repaired from family stock; engineers planning decade-scale deployments should migrate to current-production SLC NAND with equivalent industrial grades.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für K9F6408Q0C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | K9F6408Q0C-HIB0 | K9F6408Q0C-B | K9F6408U0C-H | K9F6408U0C-T |
|---|---|---|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Capacity | 64 Mbit (8M x 8 + 256K x 8 spare) | 64 Mbit (8M x 8) | 64 Mbit (8M x 8) | 64 Mbit (8M x 8) | 64 Mbit (8M x 8) |
| Operating Voltage | 1.65 V to 1.95 V | 1.8 V class | 1.65 V to 1.95 V (family) | 1.65 V to 1.95 V (family) | 1.65 V to 1.95 V (family) |
| Interface | Parallel 8-bit multiplexed NAND | Parallel 8-bit NAND (SLC) | Parallel 8-bit NAND (SLC) | Parallel 8-bit NAND (SLC) | Parallel 8-bit NAND (SLC) |
| Lifecycle Status | Obsolete | Obsolete (broker stock only) | Obsolete (broker stock only) | Obsolete (broker stock only) | Obsolete (broker stock only) |
Wichtigste Unterscheidungsmerkmale
- True same-die package variant availability (vs. K9F6408Q0C-HIB0)
- 1.8V class supply for battery designs (vs. K9F6408U0C-T)
- SLC reliability in the small-page era (vs. K9F6408U0C-F)
Designhinweise
The K9F6408Q0C provides no on-die ECC or bad-block management: the host controller must implement SLC-grade error correction (typically 1-bit correction per 512-byte page, using the 16-byte spare area) and a bad-block replacement map initialized from factory-marked blocks. Skipping ECC causes latent data corruption that appears only after cycling; skipping bad-block handling causes failures on blocks marked defective at the factory. Always read and preserve factory bad-block markers before the first erase.
Samsung's family revision history documents a TBGA package change: 9mm x 11mm 63-ball changed to 6mm x 8.5mm 48-ball, with corresponding part-number suffix changes (e.g., K9F6408Q0C-D vs K9F6408Q0C-H, the HIB0 48-ball TBGA variant). These two TBGA footprints are NOT interchangeable - verify the ball map of the exact suffix against your PCB land pattern before placing any substitution order, and confirm the suffix-to-package mapping in the specific datasheet revision you download.
The 8-bit multiplexed command/address/data bus with CLE, ALE, CE, WE, RE control is a source-synchronized asynchronous interface; keep bus stubs short and series-terminate the WE/RE drivers if trace lengths exceed a few centimeters to control ringing at the command toggle rates. Latch addresses only after meeting the address setup/hold windows in the datasheet, and use the R/B open-drain ready/busy line with a pull-up to poll or interrupt on program/erase completion rather than fixed delays.
The device operates from 1.65V to 1.95V; decouple VCC with at least 0.1uF ceramic at each supply pin plus bulk capacitance near the package, because program operations draw short current pulses on VCC. If the board also hosts 3.3V logic, level-shift or verify VIH/VIL compatibility - the 1.8V supply class means the I/O thresholds are NOT 3.3V-tolerant, and mixing rails without translation is a common failure mode in legacy board repairs.
Use the WP pin actively: tie it through a supervisor or GPIO so the boot/firmware region is write-protected during power transitions. During power ramp and brown-out, the NAND command decoder can misinterpret floating CLE/ALE/WE edges as commands; pull control lines to safe levels and gate WE until VCC is valid. This prevents accidental program/erase of stored data - the most common field failure mode in battery-powered NAND systems.
Compliance-Informationen
This is a legacy part predating modern RoHS labeling; compliance data was not present in the provided web data. Verify with Samsung archives or lot-specific certificates.
