Samsung Electronics

K9F6408Q0C - 64Mb 8M x8 NAND Flash 1.8V | Samsung Electronics

MPN: K9F6408Q0C βœ— End of Life
In Stock Ships in 1-3 business days
1.65 V to 1.95 V Vdss 48-ball TBGA Package NAND Flash (SLC) Memory
From $1.31 USD / Unit
MOQ: 1 |
Price updated: 2026-09-03
Volume Pricing
Qty Unit Price Extended
1 $2.1 $2.10
10 $1.89 $18.90
100 $1.68 $168.00
500 $1.47 $735.00
1,000 $1.31 $1,310.00
ℹ️ All prices are in USD

Drop-in alternatives for K9F6408Q0C β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

K9F6408Q0C-HIB0

βœ… Drop-In
πŸ“¦ 48-ball TBGA
TBGA suffix variant of same die; 48-ball 6x8.5mm TBGA vs base suffix package; 10us access, identical 8M x8 array and 1.8V supply

πŸ“‹ Reference alternative (not in catalog)

K9F6408Q0C-B

βœ… Drop-In
πŸ“¦ [DATA_NEEDED: package of -B suffix]
same 8M x8 array and voltage class; -B suffix denotes package/grade option within same datasheet (29-page family document)

πŸ“‹ Reference alternative (not in catalog)

K9F6408U0C-H

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ [DATA_NEEDED: package of U0C-H suffix]
same-family 8M x8 SLC NAND; U0C vs Q0C suffix differs in package/grade option, core die and interface identical per Samsung series index

πŸ“‹ Reference alternative (not in catalog)

K9F6408U0C-Q

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ [DATA_NEEDED: package of U0C-Q suffix]
same-family 8M x8 SLC NAND; -Q grade/package option, core architecture and 1.8V operation shared

πŸ“‹ Reference alternative (not in catalog)

K9F6408U0C-T

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ [DATA_NEEDED: package of U0C-T suffix]
same-family 8M x8 SLC NAND; -T option (typically TSOP package in this family); verify package drawing before substitution

πŸ“‹ Reference alternative (not in catalog)

K9F6408U0C-F

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ [DATA_NEEDED: package of U0C-F suffix]
same-family 8M x8 SLC NAND; -F option, same die family and NAND interface

πŸ“‹ Reference alternative (not in catalog)

K9F6408U0C-V

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ [DATA_NEEDED: package of U0C-V suffix]
same-family 8M x8 SLC NAND; -V option, same core array; confirm voltage suffix applicability

πŸ“‹ Reference alternative (not in catalog)

K9F6408Q0C Maximum Ratings & Electrical Characteristics

Memory Type NAND Flash (SLC)
Memory Capacity 64 Mbit (8 M x 8 bit main + 256 K x 8 bit spare)
Organization 8M x 8
Interface Parallel, 8-bit multiplexed I/O
Operating Voltage (VCC) 1.65 V to 1.95 V
Access Time 10 us (read cycle, family listing)
Page Size 528 bytes (512 data + 16 spare)
Temperature Grade C (commercial), i (industrial)
Package (HIB0 variant) 48-ball TBGA
Package (family TBGA note) 9 mm x 11 mm 63-ball changed to 6 mm x 8.5 mm 48-ball
Mounting Type Surface Mount
Spare Area 256K x 8 bit
Control Signals CLE, ALE, CE, WE, RE, WP, R/B
Bad Block Management Host-managed (marking in spare area)

K9F6408Q0C 9 mm x 11 mm 63-ball changed to 6 mm x 8.5 mm 48-ball Pin Configuration Guide

Complete pinout information for K9F6408Q0C (9 mm x 11 mm 63-ball changed to 6 mm x 8.5 mm 48-ball package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

9 mm x 11 mm 63-ball changed to 6 mm x 8.5 mm 48-ball package pinout diagram for K9F6408Q0C

No detailed pinout data available for K9F6408Q0C.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for K9F6408Q0C Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

K9F6408Q0C is suitable for 6 applications: Digital Voice Recorders, Digital Still Cameras (Legacy), Solid State File Storage, Portable Battery-Powered Devices, Set-Top Box and Embedded Firmware Storage, Industrial Data Loggers.

🎧

Digital Voice Recorders

The K9F6408Q0C was purpose-built for digital voice recorder storage: its 64-Mbit (8MB) SLC array holds hours of compressed speech audio, and the 1.65V-1.95V supply matches single-cell battery rails without a boost converter. The 528-byte page size aligns with codec frame buffering, and the microsecond-class read access keeps audio streaming seamless from the multiplexed 8-bit I/O bus. Because SLC stores one bit per cell, the endurance margin comfortably supports daily record/erase cycling. The host controller implements ECC in the 16-byte spare area and bad-block replacement, preserving audio integrity over years of use in compact, battery-powered voice recorders and dictation equipment.

πŸŽ₯

Digital Still Cameras (Legacy)

In legacy digital still camera boards, the K9F6408Q0C provided removable or internal image storage: 8MB of SLC NAND stored compressed JPEG frames, with the 1.8V operation minimizing battery drain during burst capture and writeback. The parallel NAND interface delivered the sequential write bandwidth needed for multi-megapixel image files of that era, while the R/B handshake let the camera CPU overlap capture and storage. Designers paired the device with controller-era ECC in the spare area to protect image data. For service and repair of legacy cameras, same-family variants (Q0C-HIB0, U0C series) remain the correct replacements since no modern NAND shares this footprint.

πŸ–₯️

Solid State File Storage

The K9F6408Q0C served as solid-state file storage in embedded systems that required non-volatile data retention without rotating media: configuration logs, data loggers, and small file systems. Its SLC cells retain data without refresh, and the block-erase/page-program architecture maps naturally onto FAT-style file allocations. With a 10us-class page read and microsecond-bus transfers on the 8-bit multiplexed interface, embedded CPUs could service file reads with minimal latency. The 256K spare area supported wear-leveling and bad-block maps. Engineering value today is in legacy BOM recovery - the device sustains existing file-storage boards while new designs move to modern SLC NAND generations.

πŸ“±

Portable Battery-Powered Devices

With a 1.65V-1.95V operating window, the K9F6408Q0C directly matches lithium single-cell and dual-alkaline battery rails, making it a natural non-volatile store for PDAs, handheld meters, and portable instruments of its generation. SLC NAND's low standby behavior and page-level programming meant the host could wake, write a record, and power down quickly, conserving battery energy. The 8-bit multiplexed bus minimized pin count and board area in handheld layouts, and C/i temperature grades covered consumer through portable-industrial environments. Replacement stock for such boards comes exclusively from remaining K9F6408 family inventory, as modern NAND is not footprint-compatible.

πŸ“Ί

Set-Top Box and Embedded Firmware Storage

Embedded set-top boxes and consumer appliances used small-page SLC NAND such as the K9F6408Q0C to hold bootloader and firmware images: 8MB sufficed for compressed code images, and the parallel NAND interface provided fast boot-time page reads at 1.8V. The R/B output allowed the boot CPU to poll or interrupt on program/erase completion, and the WP pin protected the boot region against accidental writes. Host-side ECC in the 16-byte spare area maintained firmware integrity. For these legacy boards, same-family suffix variants remain the service replacement path; new firmware-storage designs should adopt current Samsung K9-series SLC or SPI NAND.

🏭

Industrial Data Loggers

Industrial data loggers relied on the K9F6408Q0C's industrial (i) temperature grade and non-volatile SLC cells to record sensor samples across power cycles without batteries backing a RAM store. The 1.65V-1.95V supply fit low-power logger electronics, while block-erase granularity let controllers manage wear across 64Mb with spare-area bad-block maps. SLC reliability - one bit per cell - provided a wide noise margin important in electrically noisy factory environments. The legacy status of the device means loggers in long-deployment service are now repaired from family stock; engineers planning decade-scale deployments should migrate to current-production SLC NAND with equivalent industrial grades.

Recommended Products Summary

K9F6408Q0C-HIB0 Same-die TBGA package variant for compact layouts Used in: Digital Voice Recorders, Solid State File Storage, Set-Top Box and Embedded Firmware Storage K9F6408U0C-H Same-family alternate suffix source Used in: Digital Voice Recorders, Set-Top Box and Embedded Firmware Storage K9F6408Q0C-B Same-family suffix variant for legacy camera boards Used in: Digital Still Cameras (Legacy), Industrial Data Loggers K9F6408U0C-Q Same-family alternate suffix source Used in: Digital Still Cameras (Legacy), Industrial Data Loggers K9F6408U0C-T Same-family alternate suffix source Used in: Solid State File Storage K9F6408U0C-F Same-family alternate suffix source Used in: Portable Battery-Powered Devices K9F6408U0C-V Same-family alternate suffix source Used in: Portable Battery-Powered Devices
What is the K9F6408Q0C and what is it used for?
The K9F6408Q0C is a Samsung Electronics 64-megabit SLC NAND Flash memory organized as 8M x 8 bits with an additional 256K x 8-bit spare area, operating from a 1.65V to 1.95V supply. It is designed for solid-state file storage, digital voice recorders, and digital still cameras - applications requiring non-volatile mass storage in portable equipment, according to Samsung datasheet archives and distributor listings.
What is the operating voltage of the K9F6408Q0C?
The K9F6408Q0C operates from a 1.65V to 1.95V VCC supply, per the Samsung datasheet family data (Operating Voltage V = 1.65 ~ 1.95). This 1.8V class supply suits battery-powered portable devices. A 3.3V VCC option is documented for the related K9F6408X0C/U0C family, so engineers must confirm the voltage suffix of the exact variant before substitution.
Where can I download the K9F6408Q0C datasheet PDF?
The K9F6408Q0C datasheet PDF is available from datasheet archives such as alldatasheet.com (document 77280), datasheet4u.com, and datasheetspdf.com, and the Samsung Semiconductor website hosts family documentation. The archived datasheet is a 29-page document titled '8M x 8 Bit NAND Flash Memory'. Always download the revision matching your exact suffix (e.g., K9F6408Q0C-B vs K9F6408Q0C-H) because package options differ.
Is the K9F6408Q0C still in production?
No, the K9F6408Q0C is a legacy Samsung small-page SLC NAND generation and is obsolete/end-of-life; it is not listed as active on current distributor catalogs. Remaining supply comes from excess inventory and brokers. For new designs, Samsung's modern K9-series SLC NAND (e.g., K9PKGY8S7M family) should be used, noting it requires controller and footprint redesign since pinouts and page architectures differ.
What is the best drop-in replacement for the K9F6408Q0C?
The closest same-brand drop-in candidates are other K9F6408 family suffix variants sharing the same die: K9F6408Q0C-HIB0 (48-ball TBGA version), K9F6408Q0C-B, and K9F6408U0C variants (-H, -Q, -T, -F, -V) which differ mainly in package and voltage grade. All are also obsolete, so a true in-production drop-in does not exist; recovery depends on excess stock of the same family, per Samsung's K9F6408 series datasheet index.
What is the difference between K9F6408Q0C and K9F6408U0C?
The K9F6408Q0C and K9F6408U0C belong to the same 8M x 8-bit SLC NAND family and share the same core architecture; the suffix difference denotes package/grade options - Samsung's K9F6408 series index lists U0C variants -H, -Q, -T, -B, -F, -V alongside Q0C variants -H and -B. Key parameters such as the 1.65V-1.95V supply and 528-byte page organization are family-level; the exact package for each suffix must be confirmed in the respective datasheet before PCB substitution.
What package does the K9F6408Q0C use?
The K9F6408Q0C family is supplied in surface-mount packages including TSOP-type and TBGA options. Samsung's revision history notes a TBGA package change from 9mm x 11mm 63-ball to 6mm x 8.5mm 48-ball, with the TBGA variant designated K9F6408Q0C-HIB0 (48-ball TBGA, per datasheets.com parametric listing). Verify the ball/pinout drawing of your specific suffix before layout because the 63-ball and 48-ball footprints are not interchangeable.
How much does the K9F6408Q0C cost?
Pricing shown on this page (as of 2026-09-04) is an estimate for a legacy part: approximately $2.10 at qty 1, declining to about $1.31 at qty 1000. Because the device is obsolete, actual prices vary widely among broker/excess-stock channels and are volume- and date-code-dependent. Request a quote from XAIPART or authorized excess-inventory distributors for current, firm pricing.
Where can I buy the K9F6408Q0C online?
Since the K9F6408Q0C is obsolete, mainstream authorized distributors generally do not carry active stock; the realistic channels are XAIPART (request a quote), broker networks, and excess-inventory marketplaces. Check date codes and test reports when buying from brokers, as these parts come from legacy stock. XAIPART lists quantity-break pricing as of 2026-09-04 and can source verified stock of the K9F6408 family.
What is the lead time for the K9F6408Q0C?
Lead time for the K9F6408Q0C is governed by broker stock rather than factory scheduling because the part is discontinued. Available stock typically ships in 1-3 weeks including verification and export handling, but supply is intermittent and lot-dependent. For production continuity, qualify the same-family TBGA variant K9F6408Q0C-HIB0 as a second source and consider a board-level migration path to a modern Samsung K9 SLC NAND.
K9F6408Q0C vs K9F6408U0C - which is better for a 1.8V voice recorder?
Both are electrically the same 8M x 8-bit SLC NAND with a 1.65V-1.95V supply in the C/i temperature grades, so neither is 'better' electrically - the decision is package-driven. Choose the suffix whose package matches your PCB footprint (verify the 63-ball vs 48-ball TBGA note and TSOP options in each datasheet). For a voice recorder, the 528-byte page and microsecond read access of either part are adequate; prioritize footprint and remaining stock.
Does the K9F6408Q0C need external ECC and bad-block management?
Yes. The K9F6408Q0C provides only the 16-byte-per-page spare area; ECC computation and bad-block management are host-controller responsibilities, as is standard for this NAND generation. Samsung's datasheet family describes bad-block information marked in the spare area, and the controller must implement error-correcting code suitable for SLC (typically 1-bit correction per 512 bytes) plus block replacement logic. Neglecting ECC will cause data corruption over the part's endurance life.
What are the key specifications of the K9F6408Q0C that engineers should know?
The K9F6408Q0C is a Samsung 64-Mbit SLC parallel NAND Flash: 8M x 8-bit main array plus 256K x 8-bit spare, 1.65V-1.95V VCC, 8-bit multiplexed command/address/data bus with CLE/ALE/CE/WE/RE/WP control and an R/B ready-busy output, 528-byte pages, C and i temperature grades, and 48-ball TBGA (6mm x 8.5mm) or related TSOP packaging. These facts come from Samsung datasheet archives and the datasheets.com parametric entry (updated 08-JAN-2025).
Hey Google, what can replace a K9F6408Q0C in an old camera board?
Replace it only with other K9F6408-family variants - K9F6408Q0C-HIB0, K9F6408Q0C-B, or K9F6408U0C suffix parts - which share the same die and interface; all share the same 1.65V-1.95V supply and 8-bit NAND interface. Nothing currently in production is pin-to-pin compatible, so for repair/legacy support buy family stock, and for new designs migrate to a modern Samsung K9-series SLC NAND with a footprint redesign.
Is there a Micron or other cross-brand equivalent for the K9F6408Q0C?
No verified cross-brand pin-to-pin equivalent for the K9F6408Q0C was found in the cross-reference data searched for this page. Micron and other vendors made similar 1.8V small-page SLC parallel NAND devices, but none is documented as pin-compatible drop-in with this Samsung package, and cross-brand equivalents cannot be recommended without verified package and pinout evidence. Treat any proposed cross-brand swap as a redesign task requiring pinout and timing validation.
Is the K9F6408Q0C suitable for a new design?
No. The K9F6408Q0C is an obsolete 64-Mbit small-page SLC NAND; sourcing risk, lack of vendor support, and host-controller burden (external ECC and bad-block management) make it unsuitable for new designs. Use a current Samsung K9-series SLC NAND or SPI NAND instead, which offer larger densities, on-die features, and long-term availability. Reserve the K9F6408Q0C strictly for legacy repair, maintenance, and last-time-buy scenarios.
What is the access time of the K9F6408Q0C?
The datasheets.com parametric listing for the K9F6408Q0C-HIB0 variant gives a 10 microsecond access/read-cycle figure for this 1.8V, 64-Mbit, 8M x 8 SLC parallel NAND. As is typical for small-page NAND, this applies to page-read turnaround on the multiplexed I/O bus; sequential throughput is higher once a page transfer begins, and program/erase operations take longer and are tracked by the R/B output.

Engineering reference data for K9F6408Q0C β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the K9F6408Q0C only for legacy repair, service spares, or last-time-buy programs: it is an obsolete 64-Mbit SLC parallel NAND whose value lies in pin/footprint continuity with existing boards. Among alternatives, pick K9F6408Q0C-HIB0 when your PCB uses the documented 48-ball 6x8.5mm TBGA footprint - it is the same die and the best-verified package match. Choose K9F6408Q0C-B or U0C suffixes (-H, -Q, -T, -F, -V) when your board matches that suffix's package, after confirming the drawing in the specific datasheet revision. Do NOT attempt a cross-brand swap: no verified pin-compatible equivalent from Micron or others was found, and any such change is a redesign requiring pinout, timing, and controller validation. For new designs, use a current Samsung K9-series SLC NAND or SPI NAND and accept the footprint change - availability, endurance, and support all improve.

Comparison with Alternatives

Parameter This Product K9F6408Q0C-HIB0 K9F6408Q0C-B K9F6408U0C-H K9F6408U0C-T
Package 48-ball TBGA family (9x11mm 63-ball -> 6x8.5mm 48-ball change note) 48-ball TBGA (6x8.5mm) [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Brand Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics
Capacity 64 Mbit (8M x 8 + 256K x 8 spare) 64 Mbit (8M x 8) 64 Mbit (8M x 8) 64 Mbit (8M x 8) 64 Mbit (8M x 8)
Operating Voltage 1.65 V to 1.95 V 1.8 V class 1.65 V to 1.95 V (family) 1.65 V to 1.95 V (family) 1.65 V to 1.95 V (family)
Access Time 10 us (family listing) 10 us [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Interface Parallel 8-bit multiplexed NAND Parallel 8-bit NAND (SLC) Parallel 8-bit NAND (SLC) Parallel 8-bit NAND (SLC) Parallel 8-bit NAND (SLC)
Temperature Grades C, i [DATA_NEEDED] C, i (family) C, i (family) C, i (family)
Lifecycle Status Obsolete Obsolete (broker stock only) Obsolete (broker stock only) Obsolete (broker stock only) Obsolete (broker stock only)

Key Differentiators

  • True same-die package variant availability (vs K9F6408Q0C-HIB0)
  • 1.8V class supply for battery designs (vs K9F6408U0C-T)
  • SLC reliability in the small-page era (vs K9F6408U0C-F)

Design Notes

The K9F6408Q0C provides no on-die ECC or bad-block management: the host controller must implement SLC-grade error correction (typically 1-bit correction per 512-byte page, using the 16-byte spare area) and a bad-block replacement map initialized from factory-marked blocks. Skipping ECC causes latent data corruption that appears only after cycling; skipping bad-block handling causes failures on blocks marked defective at the factory. Always read and preserve factory bad-block markers before the first erase.

Samsung's family revision history documents a TBGA package change: 9mm x 11mm 63-ball changed to 6mm x 8.5mm 48-ball, with corresponding part-number suffix changes (e.g., K9F6408Q0C-D vs K9F6408Q0C-H, the HIB0 48-ball TBGA variant). These two TBGA footprints are NOT interchangeable - verify the ball map of the exact suffix against your PCB land pattern before placing any substitution order, and confirm the suffix-to-package mapping in the specific datasheet revision you download.

The 8-bit multiplexed command/address/data bus with CLE, ALE, CE, WE, RE control is a source-synchronized asynchronous interface; keep bus stubs short and series-terminate the WE/RE drivers if trace lengths exceed a few centimeters to control ringing at the command toggle rates. Latch addresses only after meeting the address setup/hold windows in the datasheet, and use the R/B open-drain ready/busy line with a pull-up to poll or interrupt on program/erase completion rather than fixed delays.

The device operates from 1.65V to 1.95V; decouple VCC with at least 0.1uF ceramic at each supply pin plus bulk capacitance near the package, because program operations draw short current pulses on VCC. If the board also hosts 3.3V logic, level-shift or verify VIH/VIL compatibility - the 1.8V supply class means the I/O thresholds are NOT 3.3V-tolerant, and mixing rails without translation is a common failure mode in legacy board repairs.

Use the WP pin actively: tie it through a supervisor or GPIO so the boot/firmware region is write-protected during power transitions. During power ramp and brown-out, the NAND command decoder can misinterpret floating CLE/ALE/WE edges as commands; pull control lines to safe levels and gate WE until VCC is valid. This prevents accidental program/erase of stored data - the most common field failure mode in battery-powered NAND systems.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

This is a legacy part predating modern RoHS labeling; compliance data was not present in the provided web data. Verify with Samsung archives or lot-specific certificates.

Data verified on: 2026-09-04 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Samsung Electronics K9F6408Q0C K9F6408Q0C-HIB0 K9F6408Q0C-B K9F6408U0C NAND Flash SLC NAND parallel NAND flash 8M x 8 organization 64 Mbit TBGA 48-ball TBGA small-page NAND (528-byte page) bad block management ECC (error-correcting code) multiplexed I/O bus R/B ready-busy signal digital voice recorder digital still camera solid state file storage 1.65 V to 1.95 V supply
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