LCMXO3D-9400HC-5BG256C - 9400 LUT MachXO3D FPGA, 256-CABGA | Lattice Semiconductor
Teilenummer: LCMXO3D-9400HC-5BG256C ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.85 | $38,85 |
| 10 | $35.2 | $352,00 |
| 100 | $30.45 | $3.045,00 |
| 500 | $26.8 | $13.400,00 |
| 1.000 | $23.95 | $23.950,00 |
| 3.000 | $21.5 | $64.500,00 |
LCMXO3D-9400HC-5BG256C Übersicht
A Field Programmable Gate Array (FPGA) is a programmable logic device that contains an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. The MachXO3D family is built around the LUT4-based logic cell architecture found in mainstream FPGAs, with on-chip flash configuration memory so the bitstream is loaded at power-on without an external boot PROM. Within the broader taxonomy, the MachXO3D sits under: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The 'D' suffix denotes the security-enhanced derivative of the original MachXO3 platform with hardware cryptographic accelerators and a dedicated secure configuration engine.
Key features include 9400 LUTs (logic density tier per IP), up to 206 user I/O with multiple I/O bank signaling standards (LVCMOS, LVTTL, LVDS, SSTL, and differential pairs), 442 Kbits of distributed block RAM, on-chip flash for instant-on configuration, hardware-accelerated AES/SHA/Elliptic-Curve cryptography, secure bitstream encryption, dual-boot with multi-image support, and integrated PLLs for clock management. The device supports JTAG (IEEE 1149.1), I2C, and SPI configuration interfaces for in-system programming.
The MachXO3D architecture combines a flash-based configuration cell with SRAM-based user logic, providing instant-on operation (typically under 1 ms) while preserving unlimited re-programmability. Built-in security features include bitstream authentication, hardware Root-of-Trust, secure key storage, and pre-verified cryptographic IP cores that allow system designers to implement secure boot, firmware update, and identity management without external secure elements.
Typical applications include platform root-of-trust and secure boot controllers, industrial control and I/O expansion bridges, IoT edge nodes requiring secure firmware update, automotive body and chassis control modules, communications infrastructure glue logic, and consumer electronics secure-boot companion chips. The wide I/O count and multi-bank support also suit motor control, sensor aggregation, and human-machine interface bridging.
When designing with this device, ensure the 256-ball BGA land pattern is matched to the Lattice reference PCB footprint, provide clean low-VDDR core supplies, and place decoupling within the manufacturer-recommended guidelines. The MachXO3D requires Lattice Diamond or Radiant design software for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in alternative parts, application-specific design notes, and selection guidance that complement - but do not duplicate - the manufacturer datasheet and reference manuals.
Drop-in-Alternativen für LCMXO3D-9400HC-5BG256C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LCMXO3D-9400HC-5BG256C (gleiche Bauform und Footprint) – abweichend in Package, Mounting Type, Speed Grade, Configuration Memory, Embedded Block RAM (EBR).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LCMXO3-9400HC-5BG256C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO3D-9400HC-6BG256C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO3D-9400HC-5BG256I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO3D-9400HC-5BG400C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO2-7000HC-6BG256C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO3LF-6900C-5BG256C
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →LCMXO3D-9400HC-5BG256C Grenzwerte & elektrische Eigenschaften
| Family | MachXO3D |
| Logic Cells / LUTs | 9400 LUTs |
| Embedded Block RAM (EBR) | 442 Kbits (442368 bits) |
| User I/O Count | 206 |
| Gehäuse | 256-ball CABGA / csfBGA (BG-256) |
| Versorgungsspannung | 2.5 V / 3.3 V |
| Speed Grade | -5 |
| Temperature Grade | Commercial (C) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| I/O Standards | LVCMOS, LVTTL, LVDS, SSTL, differential pairs |
| Configuration Interfaces | JTAG (IEEE 1149.1), SPI, I2C |
| Security Features | Hardware Root-of-Trust, AES/SHA/ECC acceleration, secure bitstream |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
LCMXO3D-9400HC-5BG256C 256-ball cabga / csfbga (bg-256) Pinbelegungsleitfaden
Pinbelegung für LCMXO3D-9400HC-5BG256C (256-ball cabga / csfbga (bg-256)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LCMXO3D-9400HC-5BG256C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LCMXO3D-9400HC-5BG256C ist geeignet für 6 Anwendungs: Secure Boot and Platform Root-of-Trust, Industrial Control and I/O Expansion Bridge, IoT Edge Node Secure Firmware Update, Automotive Body and Chassis Control, Communications Infrastructure Glue Logic, Consumer Electronics Secure-Boot Companion.
Secure Boot and Platform Root-of-Trust
The LCMXO3D-9400HC-5BG256C's integrated hardware Root-of-Trust and AES/SHA/ECC accelerators make it purpose-built for secure boot controller applications. The device authenticates firmware images at power-on using hardware-stored keys, prevents rollback attacks via monotonic counters, and isolates trusted/non-trusted code domains. With 9400 LUTs and 442 Kbits EBR, designers can implement the full secure-boot state machine plus auxiliary glue logic in a single chip, eliminating the need for an external secure element. Placed between the application processor and boot flash, the LCMXO3D intercepts SPI read transactions, validates the bitstream, and only releases the firmware after cryptographic verification. The on-chip flash configuration memory enables instant-on operation (typically <1 ms) so security checks do not delay system startup.
Empfohlen
Industrial Control and I/O Expansion Bridge
The LCMXO3D-9400HC-5BG256C delivers 206 user I/O across multiple banks, making it ideal for industrial I/O expansion and protocol bridging. It can interface simultaneously to LVCMOS 3.3V GPIO, LVDS high-speed links, and SSTL memory buses, eliminating external level-shifter ICs. With 9400 LUTs the device handles UART, SPI, I2C, Modbus, or CAN-to-Ethernet bridging in PLC and SCADA platforms. The on-chip flash configuration ensures deterministic startup in industrial environments where hot-plug events and brown-out conditions are common. Hardware crypto acceleration also enables secure field firmware update over industrial Ethernet protocols such as PROFINET or EtherCAT, critical for Industry 4.0 deployments.
Empfohlen
IoT Edge Node Secure Firmware Update
IoT edge gateways and sensor hubs require secure firmware update over OTA channels, and the LCMXO3D-9400HC-5BG256C provides the hardware foundation for this function. The integrated AES/SHA/ECC engines offload cryptographic verification from resource-constrained microcontrollers, while 442 Kbits of block RAM buffers the new firmware image during dual-bank swap. The device's instant-on capability (under 1 ms from on-chip flash) means the secure-boot sequence completes before the application MCU finishes its own reset, allowing authenticated handoff. With 9400 LUTs available, designers can also implement a small real-time OS scheduler or multi-protocol gateway inside the same FPGA, reducing bill-of-materials count.
Empfohlen
Automotive Body and Chassis Control
In automotive body control modules (BCMs) and chassis domain controllers, the LCMXO3D-9400HC-5BG256C's high I/O count and instant-on capability address the multi-bus, multi-load switching requirements of modern vehicles. The device can directly drive LIN, CAN, and low-speed CAN-FD transceivers while simultaneously aggregating switch and sensor inputs. Hardware Root-of-Trust prevents unauthorized modification of body controller firmware, increasingly required by UN-ECE WP.29 cybersecurity regulations. The 256-ball CABGA package is suited to automated optical inspection and high-volume automotive PCB assembly lines. Engineers should select the industrial temperature (-I suffix) variant for under-hood and chassis-mounted ECUs.
Empfohlen
Communications Infrastructure Glue Logic
Communications equipment such as routers, switches, and base-station RF front-end controllers often requires glue logic that bridges between different PHY chips, clock domains, and management interfaces. The LCMXO3D-9400HC-5BG256C handles multi-bank I/O bridging between 1.8V, 2.5V, and 3.3V domains with up to 206 I/O. The device's on-chip PLLs provide flexible clock synthesis for converting recovered line clocks to backplane reference frequencies. With 9400 LUTs and 442 Kbits EBR, the FPGA can also implement small packet buffers, MDIO/SMI bus controllers, or hardware watchdogs. The secure boot feature is increasingly demanded by telecom operators to comply with network security standards.
Empfohlen
Consumer Electronics Secure-Boot Companion
Modern consumer devices such as smart speakers, set-top boxes, and AR/VR headsets use a dedicated secure-boot companion chip to authenticate the application processor firmware. The LCMXO3D-9400HC-5BG256C provides hardware key storage and AES/SHA verification in a small 14x14 mm CABGA package, fitting within space-constrained consumer product enclosures. The instant-on flash-based configuration (under 1 ms) does not delay product boot-up, a key UX requirement for consumer electronics. With 9400 LUTs, the device can also implement custom display control, LED matrix driving, or touch-sensor processing, sharing PCB real estate with the application processor and reducing overall BOM cost.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LCMXO3D-9400HC-5BG256C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LCMXO3-9400HC-5BG256C | LCMXO3D-9400HC-6BG256C | LCMXO3D-9400HC-5BG256I | LCMXO2-7000HC-6BG256C | LCMXO3LF-6900C-5BG256C |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-ball CABGA (BG-256) | 256-ball CABGA (BG-256) - same | 256-ball CABGA (BG-256) - same | 256-ball CABGA (BG-256) - same | 256-ball CABGA (BG-256) - same | 256-ball CABGA (BG-256) - same |
| LUTs | 9400 | 9400 | 9400 | 9400 | 7000 (-26%) | 6900 (-27%) |
| User I/O | 206 | 206 | 206 | 206 | 207 (+1) | 221 (+15) |
| EBR (Kbits) | 442 | 442 | 442 | 442 | 264 (-40%) | 320 (-27%) |
| Security Engine | Yes (Root-of-Trust + AES/SHA/ECC) | No | Yes (Root-of-Trust + AES/SHA/ECC) | Yes (Root-of-Trust + AES/SHA/ECC) | No | No |
| Speed Grade | -5 | -5 | -6 | -5 | -6 | -5 |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C) | Commercial (C) |
| Configuration Memory | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) |
Wichtigste Unterscheidungsmerkmale
- Integrated hardware Root-of-Trust and cryptographic accelerators (vs. LCMXO3-9400HC-5BG256C)
- Largest logic density in MachXO3D family (vs. LCMXO3D-4300HC-5BG256C)
- On-chip flash for instant-on configuration (vs. LCMXO2-7000HC-6BG256C)
Designhinweise
Estimated: The 256-ball CABGA package requires a 0.8 mm pitch BGA land pattern with vias-in-pad recommended for the inner balls. Place at least 6 ground balls directly under the die thermal pad region and stitch ground vias around the perimeter for low-impedance return paths. Follow the Lattice reference PCB footprint for the BG-256 package to avoid signal-integrity issues on high-speed LVDS pairs.
The LCMXO3D-9400HC-5BG256C requires multiple supply rails (VCC core, VCCIO banks, VCCAUX) typically at 2.5V or 3.3V. Decouple each rail with a 100 nF ceramic capacitor placed within 3 mm of each supply pin, plus a 10 uF bulk capacitor per rail. Power sequencing per Lattice datasheet must respect VCC core before VCCIO to avoid I/O bus contention during ramp-up.
When routing LVDS pairs in the 256-CABGA, maintain 100 ohm differential impedance with matched trace lengths (within 150 mil typical) and continuous reference plane. Avoid routing across split power planes. Use the Lattice Diamond or Radiant development tool's I/O advisor to validate SSO (simultaneous switching output) limits on each bank to prevent ground-bounce-induced configuration errors.
Do not confuse the BG-256 package pinout with the BG-400 or BG-484 variants of the same die; the ball map differs even though the device name is similar. Always cross-check the Lattice product selection table against the specific MachXO3D device marking before PCB assembly. When migrating from LCMXO3 (non-D) to LCMXO3D, recompile the bitstream with the security-enabled project settings to instantiate the Root-of-Trust block.
Compliance-Informationen
RoHS and REACH compliance per Lattice product declaration. AEC-Q100 not qualified - automotive designs should evaluate the industrial temperature variant and contact Lattice for AEC-Q100 support options.
