LFE5UM5G-85F8BG554I - 84K LUT, 5G SERDES ECP5 FPGA | Lattice
Teilenummer: LFE5UM5G-85F8BG554I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $135.8 | $1.358,00 |
| 100 | $118.2 | $11.820,00 |
| 250 | $109.4 | $27.350,00 |
| 500 | $99.6 | $49.800,00 |
LFE5UM5G-85F8BG554I Übersicht
What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic IC that lets designers implement arbitrary digital functions in silicon after PCB fabrication. Within the broader taxonomy, the ECP5-5G sits in the FPGA & CPLD category, below the hierarchy programmable logic device -> logic IC -> integrated circuit -> semiconductor. FPGAs are the modern descendants of CPLDs and PALs, offering millions of gates, dedicated DSP blocks, hard memory, and high-speed transceivers for protocol bridging, video processing, and parallel compute acceleration.
Key features of this device include up to 84,000 LUT4-equivalent logic elements, 3,744 Kbit of distributed EBR plus large RAM, 156 (18x18) hardware multiplier/DSP blocks, 4 SERDES channels supporting CPRI, PCIe Gen1/Gen2, SGMII, and 5 Gbps multi-protocol links, plus hardened I/O supporting DDR3 memory interfaces up to 800 Mbps. The part is offered in the industrial temperature range and supports TransFR transparent field reconfiguration plus dual-boot/multi-boot image fallback for robust remote upgrades.
Architecturally the ECP5-5G fabric uses Lattice's LUT4-based logic with carry chains, distributed and block RAM, and DSP slices arranged in rows for high-utilization designs. The 5G SERDES hard IP and 1.2 V core deliver strong mW-per-MIPS efficiency, making the family the standard for small-cell, industrial vision, and protocol-bridge applications where 7-series FPGAs would be oversized and over-powered.
Typical applications include 5G small-cell fronthaul using CPRI/JESD204B, machine-vision and industrial camera bridging, LED video wall scan-driver control, multi-protocol interface bridging (PCIe, SGMII, GigE, SLVS-EC), and low-power IoT aggregation. The combination of low static power, abundant DSP, and 5G SERDES in a sub-1 W envelope is the part's central value proposition.
When designing with this device, plan thermal strategy around the 554-FBGA substrate: although each SERDES is power-efficient, a fully loaded 5G configuration can push total power to 1.5-2 W, so a 4-layer PCB with a 2x2 ball-grid thermal via array under the package is recommended. Use Lattice Diamond or Lattice Radiant design software and the ECP5-5G sysCONFIG port to enable dual-boot, TransFR, and in-field updates without external boot memory.
This page synthesizes distributor pricing, drop-in alternative FPGAs, application pairing, and practical PCB/thermal design notes that complement the Lattice datasheet, giving engineers a single source for sourcing and BOM decisions.
Drop-in-Alternativen für LFE5UM5G-85F8BG554I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LFE5UM5G-85F8BG554I (gleiche Bauform und Footprint) – abweichend in Design Software, Operating Temperature, Package, Peak Reflow Temperature, Terminal Finish.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LFE5UM5G-85F-8BG554C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFE5UM5G-85F-8BG554I
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →LFE5U-85F-8BG554I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFE5UM5G-85F8BG554I Grenzwerte & elektrische Eigenschaften
| Product Family | ECP5-5G |
| Product Type | Field Programmable Gate Array (FPGA) |
| Logic Elements / LUT4 | 83,600 (84,000 nominal) |
| Embedded Block RAM (EBR) | 3,744 Kbit (3,833,856 bits) |
| DSP / 18x18 Multipliers | 156 |
| SERDES Channels | 4 (5 Gbps multi-protocol) |
| SERDES Protocols | PCIe Gen1/Gen2, SGMII, CPRI, JESD204B, 5G multi-protocol |
| User I/O Count (this package) | 259 |
| Core Voltage | 1.2 V |
| Gehäuse | 554-FBGA (caBGA) |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Montageart | Surface Mount |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 |
| Peak Reflow Temperature | 260C (30 s max, JESD-609 e1) |
| Terminal Finish | Tin Silver Copper (SnAgCu) |
| Configuration | SPI, JTAG, sysCONFIG, dual-boot, multi-boot, TransFR |
| Boundary Scan | IEEE 1149.1 compliant |
| Design Software | Lattice Diamond / Lattice Radiant |
| RoHS-Status | Compliant (per Lattice product page) |
LFE5UM5G-85F8BG554I 554-fbga (cabga) Pinbelegungsleitfaden
Pinbelegung für LFE5UM5G-85F8BG554I (554-fbga (cabga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LFE5UM5G-85F8BG554I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LFE5UM5G-85F8BG554I ist geeignet für 6 Anwendungs: 5G Small-Cell Fronthaul, Industrial Machine Vision Aggregation, PCIe Gen2 Endpoint Bridge, LED Video Wall Scan-Driver Controller, Industrial IoT Gateway Aggregation, Multi-Protocol Industrial Interface Bridge.
5G Small-Cell Fronthaul
The LFE5UM5G-85F8BG554I fits 5G small-cell fronthaul because it integrates 4 hardened 5 Gbps SERDES channels supporting CPRI up to 4.915 Gbps and JESD204B up to 4 Gbps, alongside 156 (18x18) DSP slices and 3,744 Kbit EBR for sample-rate conversion. The fabric runs CPRI I/Q data, distributed FFT pre-processing, and ORAN fronthaul split option 7-2x in a single sub-1 W envelope. Engineers choose this part over a Xilinx Artix-7 for 70-80% lower static power at the same 5G SERDES data rate, and over a Xilinx Spartan-7 for hard SERDES that Spartan-7 lacks. Pair it with an LCMXO3LF-6900E-5MG256I for board-management housekeeping and a KSZ9031RNXIA for 1G SGMII backhaul.
Empfohlen
Industrial Machine Vision Aggregation
For multi-camera machine-vision aggregation the LFE5UM5G-85F8BG554I provides 259 user I/O, sufficient to land 4-6 SLVS-EC or sub-LVds camera links, plus 4 SERDES channels for 5 Gbps upstream to a host processor. The 3,744 Kbit EBR serves as line buffer for 2K-4K image data at 60 fps without external SDRAM, and 156 DSP slices accelerate Bayer-to-RGB and edge-detection pre-processing. Designers prefer this part over a Xilinx Zynq-7010 when no ARM hard-core is needed - lower BOM cost, lower power, simpler PCB. The 554-FBGA footprint is footprint-compatible with the LFE5UM5G-25F-8BG554I when designs scale down to 25K LUTs. Pair with a DS90UH949TRGCTQ1 serializer for the camera-side link.
Empfohlen
PCIe Gen2 Endpoint Bridge
The LFE5UM5G-85F8BG554I is a strong fit for PCIe Gen2 x1/x2 endpoint bridging because the 4 SERDES channels natively support PCIe Gen1 (2.5 Gbps) and Gen2 (5 Gbps) with hardened PCS/PMA. The fabric implements the PCIe transaction layer, custom DMA engines, and application logic, with 259 I/O available for local bus expansion. Designers pick this part over an ASSP PCIe switch when custom protocol logic and proprietary features are needed. A heatsink or 4-layer thermal via array is recommended at full PCIe Gen2 x2 link, where total power reaches approximately 1.5 W. Pair with a 100 MHz LVDS reference clock and a FT2233HPQ-TRAY for JTAG/USB debug access.
Empfohlen
LED Video Wall Scan-Driver Controller
The LFE5UM5G-85F8BG554I drives LED video walls by aggregating multiple HDMI/DisplayPort inputs and re-driving hundreds of scan-driver lines at low latency. 259 user I/O support up to 16 parallel scan-driver connectors; 3,744 Kbit EBR holds 1-2 frames of color-mapped data; 156 DSP blocks run chroma up-scaling and color space conversion in real time. Compared to a Xilinx Spartan-6, the ECP5-5G delivers comparable logic at half the power and adds the optional 5G SERDES for a future 8K tile-to-tile link. The 1.2 V core simplifies power-tree design vs older 2.5 V/3.3 V FPGA cores. Pair with a FPF2895UCX for power-rail management and a HD3SS3212IRKSR for HDMI input MUX.
Empfohlen
Industrial IoT Gateway Aggregation
The LFE5UM5G-85F8BG554I sits at the heart of an industrial IoT gateway by aggregating multiple field-bus protocols (Modbus, EtherCAT, CAN-FD) and forwarding them through a single SGMII/Ethernet uplink. The 4 SERDES channels support an SGMII backhaul to a host SoC, while 259 I/O support 8-12 isolated field-bus segments. Industrial -40C to +100C temperature range suits outdoor cabinet installations. ECP5-5G mW-per-MIPS advantage over a Xilinx Artix-7 makes it the right choice for fan-less gateways. The dual-boot and TransFR features allow remote firmware update without field-technician visits. Pair with a LAN8742A-CZ-TR for the backhaul PHY and a TPS3823-33DBVR for supervisory reset.
Empfohlen
Multi-Protocol Industrial Interface Bridge
The LFE5UM5G-85F8BG554I is well suited as a multi-protocol bridge in industrial control cabinets: 4 SERDES handle upstream SGMII/PCIe, while the 259 I/O provide LVDS-25, LVCMOS-18/33, and HSTL/SSTL banks for downstream parallel buses and memories. The fabric runs UART/SPI/I2C bridges, GPIO expansion, and custom protocol translation at sub-1 W. Compared to using multiple ASSP bridges, one ECP5-5G replaces 3-5 parts and reduces BOM. Dual-boot allows field upgrades of the bridge protocol stack without affecting the host firmware. Pair with an ISO7762FDWR for SPI-isolator bridges and a DRV8426PWPR if the design also drives stepper motors downstream.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LFE5UM5G-85F8BG554I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LFE5UM5G-85F-8BG554C | LFE5UM5G-85F-8BG554I | LFE5U-85F-8BG554I |
|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 554-FBGA (caBGA) | 554-FBGA (caBGA) - same | 554-FBGA (caBGA) - same | 554-FBGA (caBGA) - same |
| Logic Elements (LUT4) | 83,600 | 83,600 | 83,600 | 83,600 |
| 5G SERDES Channels | 4 (5 Gbps) | 4 (5 Gbps) | 4 (5 Gbps) | None (ECP5 base family) |
| Block RAM (EBR) | 3,744 Kbit | 3,744 Kbit | 3,744 Kbit | 3,744 Kbit |
| DSP / 18x18 Multipliers | 156 | 156 | 156 | 156 |
| User I/O (this package) | 259 | 259 | 259 | 259 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| MSL Level | 3 | 3 | 3 | 3 |
Wichtigste Unterscheidungsmerkmale
- Hardened 5 Gbps SERDES with multi-protocol PCS (vs. LFE5U-85F-8BG554I)
- Industrial -40C to +100C temperature grade (vs. LFE5UM5G-85F-8BG554C)
- Sub-1 W power envelope at full 5G SERDES utilization (vs. Xilinx Artix-7 (XC7A100T-2FGG676I equivalent class))
Designhinweise
The 554-FBGA (caBGA) package has a limited top-side heatsink attach area, so thermal design relies on bottom-side PCB heat extraction. Use a 4-layer PCB with a 2x2 thermal via array (0.3 mm drill, 1.0 mm pitch) under the central BGA core. Estimated: at 1.5 W total device power (full 5G SERDES link + 70% logic utilization), the junction-to-ambient thermal resistance is approximately 18 C/W with a 4-layer 100x100 mm board, giving ~27C temperature rise. Designers targeting 85C ambient should size power budget to <1.2 W total to leave margin.
The 554-FBGA has 0.8 mm ball pitch - escape routing must use micro-via stack-up or staggered via-in-pad. A standard 4-layer FR-4 stack-up with 1-oz copper outer / 0.5-oz inner and laser-drilled micro-vias (0.1 mm) is sufficient. Match length on all DDR3 byte groups to within 25 mils to maintain 800 Mbps margin. Keep SERDES high-speed traces on the top layer with continuous ground plane reference and length-matched within 5 mils across the 4 SERDES channels. Place 100 nF + 4.7 uF decoupling within 1 mm of each power pin.
Do not attempt to program an ECP5-5G bitstream on a base ECP5 device or vice versa - bitstream headers are silicon-version-locked. The 'I' (industrial) and 'C' (commercial) temperature grades share the same bitstream. Note: the LFE5UM5G-85F8BG554I is fully populated in the 554-ball BGA - do not mistake the BG554 package for the lower-cost 256-ball or 381-ball variants in the same family. Verify the package code on the device label matches the design footprint before PCB assembly.
Use the Lattice Diamond / Radiant 'Package and Pinout' view to confirm the design uses the correct 554-FBGA ball-map. The 4 SERDES channels are on dedicated balls - keep these on the same PCB layer with no via transitions. The JTAG, configuration, and clock pins are on the outer ring of balls; route them short to the configuration header and reference clock. Place the boot SPI flash within 25 mm of the FPGA to keep SPI configuration traces short.
Compliance-Informationen
RoHS compliance confirmed via Lattice product page and Vyrian third-party listing; JESD-609 e1 (SnAgCu) terminal finish per Vyrian datasheet. AEC-Q100 not applicable - the part is qualified to JEDEC industrial -40C to +100C, not the automotive AEC-Q100 reliability standard. For automotive-grade ECP5-5G variants, contact Lattice sales.
