LFE5UM5G-85F8BG554I - 84K LUT, 5G SERDES ECP5 FPGA | Lattice
Référence : LFE5UM5G-85F8BG554I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $135.8 | $1 358,00 |
| 100 | $118.2 | $11 820,00 |
| 250 | $109.4 | $27 350,00 |
| 500 | $99.6 | $49 800,00 |
LFE5UM5G-85F8BG554I Présentation
What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic IC that lets designers implement arbitrary digital functions in silicon after PCB fabrication. Within the broader taxonomy, the ECP5-5G sits in the FPGA & CPLD category, below the hierarchy programmable logic device -> logic IC -> integrated circuit -> semiconductor. FPGAs are the modern descendants of CPLDs and PALs, offering millions of gates, dedicated DSP blocks, hard memory, and high-speed transceivers for protocol bridging, video processing, and parallel compute acceleration.
Key features of this device include up to 84,000 LUT4-equivalent logic elements, 3,744 Kbit of distributed EBR plus large RAM, 156 (18x18) hardware multiplier/DSP blocks, 4 SERDES channels supporting CPRI, PCIe Gen1/Gen2, SGMII, and 5 Gbps multi-protocol links, plus hardened I/O supporting DDR3 memory interfaces up to 800 Mbps. The part is offered in the industrial temperature range and supports TransFR transparent field reconfiguration plus dual-boot/multi-boot image fallback for robust remote upgrades.
Architecturally the ECP5-5G fabric uses Lattice's LUT4-based logic with carry chains, distributed and block RAM, and DSP slices arranged in rows for high-utilization designs. The 5G SERDES hard IP and 1.2 V core deliver strong mW-per-MIPS efficiency, making the family the standard for small-cell, industrial vision, and protocol-bridge applications where 7-series FPGAs would be oversized and over-powered.
Typical applications include 5G small-cell fronthaul using CPRI/JESD204B, machine-vision and industrial camera bridging, LED video wall scan-driver control, multi-protocol interface bridging (PCIe, SGMII, GigE, SLVS-EC), and low-power IoT aggregation. The combination of low static power, abundant DSP, and 5G SERDES in a sub-1 W envelope is the part's central value proposition.
When designing with this device, plan thermal strategy around the 554-FBGA substrate: although each SERDES is power-efficient, a fully loaded 5G configuration can push total power to 1.5-2 W, so a 4-layer PCB with a 2x2 ball-grid thermal via array under the package is recommended. Use Lattice Diamond or Lattice Radiant design software and the ECP5-5G sysCONFIG port to enable dual-boot, TransFR, and in-field updates without external boot memory.
This page synthesizes distributor pricing, drop-in alternative FPGAs, application pairing, and practical PCB/thermal design notes that complement the Lattice datasheet, giving engineers a single source for sourcing and BOM decisions.
Alternatives de remplacement direct pour LFE5UM5G-85F8BG554I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LFE5UM5G-85F8BG554I (même facteur de forme et même empreinte) — différant par Design Software, Operating Temperature, Package, Peak Reflow Temperature, Terminal Finish.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LFE5UM5G-85F-8BG554C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LFE5UM5G-85F-8BG554I
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →LFE5U-85F-8BG554I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LFE5UM5G-85F8BG554I Valeurs maximales et caractéristiques électriques
| Product Family | ECP5-5G |
| Product Type | Field Programmable Gate Array (FPGA) |
| Logic Elements / LUT4 | 83,600 (84,000 nominal) |
| Embedded Block RAM (EBR) | 3,744 Kbit (3,833,856 bits) |
| DSP / 18x18 Multipliers | 156 |
| SERDES Channels | 4 (5 Gbps multi-protocol) |
| SERDES Protocols | PCIe Gen1/Gen2, SGMII, CPRI, JESD204B, 5G multi-protocol |
| User I/O Count (this package) | 259 |
| Core Voltage | 1.2 V |
| Boîtier | 554-FBGA (caBGA) |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Type de montage | Surface Mount |
| Niveau de sensibilité à l'humidité (MSL) | 3 |
| Peak Reflow Temperature | 260C (30 s max, JESD-609 e1) |
| Terminal Finish | Tin Silver Copper (SnAgCu) |
| Configuration | SPI, JTAG, sysCONFIG, dual-boot, multi-boot, TransFR |
| Boundary Scan | IEEE 1149.1 compliant |
| Design Software | Lattice Diamond / Lattice Radiant |
| Statut RoHS | Compliant (per Lattice product page) |
Guide de configuration des broches du LFE5UM5G-85F8BG554I 554-fbga (cabga)
Configuration des broches du LFE5UM5G-85F8BG554I (boîtier 554-fbga (cabga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LFE5UM5G-85F8BG554I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LFE5UM5G-85F8BG554I convient pour 6 applications: 5G Small-Cell Fronthaul, Industrial Machine Vision Aggregation, PCIe Gen2 Endpoint Bridge, LED Video Wall Scan-Driver Controller, Industrial IoT Gateway Aggregation, Multi-Protocol Industrial Interface Bridge.
5G Small-Cell Fronthaul
The LFE5UM5G-85F8BG554I fits 5G small-cell fronthaul because it integrates 4 hardened 5 Gbps SERDES channels supporting CPRI up to 4.915 Gbps and JESD204B up to 4 Gbps, alongside 156 (18x18) DSP slices and 3,744 Kbit EBR for sample-rate conversion. The fabric runs CPRI I/Q data, distributed FFT pre-processing, and ORAN fronthaul split option 7-2x in a single sub-1 W envelope. Engineers choose this part over a Xilinx Artix-7 for 70-80% lower static power at the same 5G SERDES data rate, and over a Xilinx Spartan-7 for hard SERDES that Spartan-7 lacks. Pair it with an LCMXO3LF-6900E-5MG256I for board-management housekeeping and a KSZ9031RNXIA for 1G SGMII backhaul.
Recommandé
Industrial Machine Vision Aggregation
For multi-camera machine-vision aggregation the LFE5UM5G-85F8BG554I provides 259 user I/O, sufficient to land 4-6 SLVS-EC or sub-LVds camera links, plus 4 SERDES channels for 5 Gbps upstream to a host processor. The 3,744 Kbit EBR serves as line buffer for 2K-4K image data at 60 fps without external SDRAM, and 156 DSP slices accelerate Bayer-to-RGB and edge-detection pre-processing. Designers prefer this part over a Xilinx Zynq-7010 when no ARM hard-core is needed - lower BOM cost, lower power, simpler PCB. The 554-FBGA footprint is footprint-compatible with the LFE5UM5G-25F-8BG554I when designs scale down to 25K LUTs. Pair with a DS90UH949TRGCTQ1 serializer for the camera-side link.
Recommandé
PCIe Gen2 Endpoint Bridge
The LFE5UM5G-85F8BG554I is a strong fit for PCIe Gen2 x1/x2 endpoint bridging because the 4 SERDES channels natively support PCIe Gen1 (2.5 Gbps) and Gen2 (5 Gbps) with hardened PCS/PMA. The fabric implements the PCIe transaction layer, custom DMA engines, and application logic, with 259 I/O available for local bus expansion. Designers pick this part over an ASSP PCIe switch when custom protocol logic and proprietary features are needed. A heatsink or 4-layer thermal via array is recommended at full PCIe Gen2 x2 link, where total power reaches approximately 1.5 W. Pair with a 100 MHz LVDS reference clock and a FT2233HPQ-TRAY for JTAG/USB debug access.
Recommandé
LED Video Wall Scan-Driver Controller
The LFE5UM5G-85F8BG554I drives LED video walls by aggregating multiple HDMI/DisplayPort inputs and re-driving hundreds of scan-driver lines at low latency. 259 user I/O support up to 16 parallel scan-driver connectors; 3,744 Kbit EBR holds 1-2 frames of color-mapped data; 156 DSP blocks run chroma up-scaling and color space conversion in real time. Compared to a Xilinx Spartan-6, the ECP5-5G delivers comparable logic at half the power and adds the optional 5G SERDES for a future 8K tile-to-tile link. The 1.2 V core simplifies power-tree design vs older 2.5 V/3.3 V FPGA cores. Pair with a FPF2895UCX for power-rail management and a HD3SS3212IRKSR for HDMI input MUX.
Recommandé
Industrial IoT Gateway Aggregation
The LFE5UM5G-85F8BG554I sits at the heart of an industrial IoT gateway by aggregating multiple field-bus protocols (Modbus, EtherCAT, CAN-FD) and forwarding them through a single SGMII/Ethernet uplink. The 4 SERDES channels support an SGMII backhaul to a host SoC, while 259 I/O support 8-12 isolated field-bus segments. Industrial -40C to +100C temperature range suits outdoor cabinet installations. ECP5-5G mW-per-MIPS advantage over a Xilinx Artix-7 makes it the right choice for fan-less gateways. The dual-boot and TransFR features allow remote firmware update without field-technician visits. Pair with a LAN8742A-CZ-TR for the backhaul PHY and a TPS3823-33DBVR for supervisory reset.
Recommandé
Multi-Protocol Industrial Interface Bridge
The LFE5UM5G-85F8BG554I is well suited as a multi-protocol bridge in industrial control cabinets: 4 SERDES handle upstream SGMII/PCIe, while the 259 I/O provide LVDS-25, LVCMOS-18/33, and HSTL/SSTL banks for downstream parallel buses and memories. The fabric runs UART/SPI/I2C bridges, GPIO expansion, and custom protocol translation at sub-1 W. Compared to using multiple ASSP bridges, one ECP5-5G replaces 3-5 parts and reduces BOM. Dual-boot allows field upgrades of the bridge protocol stack without affecting the host firmware. Pair with an ISO7762FDWR for SPI-isolator bridges and a DRV8426PWPR if the design also drives stepper motors downstream.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LFE5UM5G-85F8BG554I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LFE5UM5G-85F-8BG554C | LFE5UM5G-85F-8BG554I | LFE5U-85F-8BG554I |
|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 554-FBGA (caBGA) | 554-FBGA (caBGA) - same | 554-FBGA (caBGA) - same | 554-FBGA (caBGA) - same |
| Logic Elements (LUT4) | 83,600 | 83,600 | 83,600 | 83,600 |
| 5G SERDES Channels | 4 (5 Gbps) | 4 (5 Gbps) | 4 (5 Gbps) | None (ECP5 base family) |
| Block RAM (EBR) | 3,744 Kbit | 3,744 Kbit | 3,744 Kbit | 3,744 Kbit |
| DSP / 18x18 Multipliers | 156 | 156 | 156 | 156 |
| User I/O (this package) | 259 | 259 | 259 | 259 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| MSL Level | 3 | 3 | 3 | 3 |
Principaux différenciateurs
- Hardened 5 Gbps SERDES with multi-protocol PCS (vs LFE5U-85F-8BG554I)
- Industrial -40C to +100C temperature grade (vs LFE5UM5G-85F-8BG554C)
- Sub-1 W power envelope at full 5G SERDES utilization (vs Xilinx Artix-7 (XC7A100T-2FGG676I equivalent class))
Notes de conception
The 554-FBGA (caBGA) package has a limited top-side heatsink attach area, so thermal design relies on bottom-side PCB heat extraction. Use a 4-layer PCB with a 2x2 thermal via array (0.3 mm drill, 1.0 mm pitch) under the central BGA core. Estimated: at 1.5 W total device power (full 5G SERDES link + 70% logic utilization), the junction-to-ambient thermal resistance is approximately 18 C/W with a 4-layer 100x100 mm board, giving ~27C temperature rise. Designers targeting 85C ambient should size power budget to <1.2 W total to leave margin.
The 554-FBGA has 0.8 mm ball pitch - escape routing must use micro-via stack-up or staggered via-in-pad. A standard 4-layer FR-4 stack-up with 1-oz copper outer / 0.5-oz inner and laser-drilled micro-vias (0.1 mm) is sufficient. Match length on all DDR3 byte groups to within 25 mils to maintain 800 Mbps margin. Keep SERDES high-speed traces on the top layer with continuous ground plane reference and length-matched within 5 mils across the 4 SERDES channels. Place 100 nF + 4.7 uF decoupling within 1 mm of each power pin.
Do not attempt to program an ECP5-5G bitstream on a base ECP5 device or vice versa - bitstream headers are silicon-version-locked. The 'I' (industrial) and 'C' (commercial) temperature grades share the same bitstream. Note: the LFE5UM5G-85F8BG554I is fully populated in the 554-ball BGA - do not mistake the BG554 package for the lower-cost 256-ball or 381-ball variants in the same family. Verify the package code on the device label matches the design footprint before PCB assembly.
Use the Lattice Diamond / Radiant 'Package and Pinout' view to confirm the design uses the correct 554-FBGA ball-map. The 4 SERDES channels are on dedicated balls - keep these on the same PCB layer with no via transitions. The JTAG, configuration, and clock pins are on the outer ring of balls; route them short to the configuration header and reference clock. Place the boot SPI flash within 25 mm of the FPGA to keep SPI configuration traces short.
Informations de conformité
RoHS compliance confirmed via Lattice product page and Vyrian third-party listing; JESD-609 e1 (SnAgCu) terminal finish per Vyrian datasheet. AEC-Q100 not applicable - the part is qualified to JEDEC industrial -40C to +100C, not the automotive AEC-Q100 reliability standard. For automotive-grade ECP5-5G variants, contact Lattice sales.
