M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
MPN: M1AFS600-2FG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.35 | $623.50 |
| 100 | $56.8 | $5,680.00 |
| 500 | $51.2 | $25,600.00 |
| 1,000 | $46.75 | $46,750.00 |
Drop-in alternatives for M1AFS600-2FG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M1AFS600-FG256
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View Datasheet →M7AFS600-FGG256
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View Datasheet →M1AFS1500-2FGG256
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View Datasheet →M1AFS250-2FG256I
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Contact for price
View Datasheet →A3P600-2FG256
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View Datasheet →M1AFS600-2FG256 Maximum Ratings & Electrical Characteristics
| Series | M1AFS600 (Fusion) |
| System Gates | 600000 gates |
| Logic Elements | 110592 |
| Embedded Processor | ARM Cortex-M1 |
| Number of I/Os | 119 I/O |
| Core Supply Voltage | 1.5 V |
| Technology | 130 nm flash-based |
| Package / Case | 256-LBGA (FBGA-256) |
| Mounting Style | SMD/SMT |
| Operating Temperature - Minimum | 0 C |
| Operating Temperature - Maximum | +70 C |
| Packaging | Tray |
| Analog Peripherals | Configurable analog block (Fusion mixed-signal) |
| On-chip Memory | Large flash memory blocks |
| Clock Management | On-chip clock generation and management (PLL) |
| Configuration | Flash-based, live at power-up, no external config PROM required |
M1AFS600-2FG256 256-lbga (fbga-256) Pin Configuration Guide
Complete pinout information for M1AFS600-2FG256 (256-lbga (fbga-256) package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS600-2FG256.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS600-2FG256 is suitable for 6 applications: Board Power Management and Monitoring, Embedded ARM Control Systems, Motor Control, Smart Battery Charging Systems, Clock Generation and Management, Industrial I/O and Glue Logic Consolidation.
Board Power Management and Monitoring
Fusion mixed-signal FPGAs were created specifically for power management: the configurable analog block measures multiple voltage, current, and temperature channels on-board, while the flash fabric implements sequencing and fault-response state machines. The M1AFS600-2FG256 replaces discrete supervisory ICs, ADCs, and glue logic in a single 256-ball device, cutting BOM count and board area. A design monitoring four rails at 12-bit resolution can trigger controlled shutdown or power-good signaling within microseconds. Because the fabric is live at power-up, monitoring begins before a soft CPU even boots - a key advantage over processor-based supervisors.
Recommended
Embedded ARM Control Systems
The hard ARM Cortex-M1 processor makes the M1AFS600-2FG256 a single-chip embedded controller: firmware runs on the deterministic Cortex-M1 while custom peripherals - PWM engines, UARTs, encoders - are instantiated in the surrounding 110592-element fabric. This architecture suits industrial equipment that historically paired a microcontroller with a small CPLD. The flash-based fabric boots instantly, so the ARM core begins executing at power-up without external configuration memory. With 119 user I/Os in the FG256 package, one device can replace an MCU plus a mid-density FPGA, reducing procurement to a single line item.
Recommended
Motor Control
Motor control demands precise PWM generation, fast current sensing, and deterministic loop closure - all areas where the M1AFS600-2FG256 excels. The fabric can implement multi-channel high-resolution PWM at hundreds of kHz while the analog block samples phase currents and heatsink temperature; the ARM Cortex-M1 runs the speed/torque control loop. According to Microchip, Fusion FPGAs target motor control among their primary application areas. Implementing commutation logic in hardware removes software latency jitter, and flash fabrics tolerate the electrically noisy environment around power stages better than SRAM-based parts.
Recommended
Smart Battery Charging Systems
Smart battery chargers require charge-profile state machines, voltage/current telemetry, and host communication - the exact combination the Fusion M1AFS600-2FG256 integrates. The analog block digitizes pack voltage, charge current, and cell temperature, the fabric implements CC/CV charge profiles and safety interlocks in deterministic hardware, and the ARM Cortex-M1 handles SMBus/I2C host protocols and logging to the on-chip flash blocks. Implementing safety logic in hardware rather than firmware provides fail-safe behavior independent of software state, which is valuable for charge-termination and over-temperature protection decisions.
Recommended
Clock Generation and Management
Fusion FPGAs include comprehensive on-chip clock generation and management circuitry, and the M1AFS600-2FG256 extends this with fabric-implemented frequency synthesizers, jitter cleaners, and distribution logic. A single device can generate multiple system clocks from one reference, monitor clock presence via the analog block, and implement hitless switchover between redundant references. The 130nm flash fabric provides deterministic routing delays, useful for phase-aligned clock output banks. With 119 I/Os, one FG256 package can service clock distribution for a full backplane while the ARM core manages configuration over I2C.
Recommended
Industrial I/O and Glue Logic Consolidation
Legacy industrial boards often combine a microprocessor, several PAL/GAL devices, counters, and level-shift buffers. The M1AFS600-2FG256 consolidates all of this into one flash-based, live-at-power-up device: the fabric absorbs address decoding, interrupt control, and timing logic while the ARM core replaces the original MCU. The commercial 0C to +70C grade fits indoor factory environments, and the FG256 1.0mm ball pitch simplifies rework compared with finer-pitch BGA packages. Migration path: if obsolescence strikes, pin-compatible M7AFS600 and M1AFS1500 FG256 variants keep the same PCB footprint.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS600-2FG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS600-FG256 | M7AFS600-FG256 | M1AFS1500-2FGG256 | A3P600-2FG256 |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi Fusion) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology (ProASIC3) |
| Package | 256-LBGA (FG256) | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same |
| System Gates | 600000 gates | 600000 gates | 600000 gates | 1500000 gates | 600000 gates |
| Embedded Processor | ARM Cortex-M1 (hard core) | ARM Cortex-M1 (hard core) | ARM Cortex-M1 (hard core) | ARM Cortex-M1 (hard core) | None (soft CPU in fabric only) |
| Configurable Analog Block | Yes (Fusion analog) | Yes (Fusion analog) | Yes (Fusion analog) | Yes (Fusion analog) | No |
| Core Supply Voltage | 1.5 V | 1.5 V | [DATA_NEEDED] | [DATA_NEEDED] | 1.5 V |
| Operating Temperature | 0 C to +70 C (commercial) | [DATA_NEEDED] | [DATA_NEEDED] | -40 C to +85 C (industrial) | [DATA_NEEDED] |
| Speed Grade | -2 (fast) | Standard (slower than -2) | Standard M7 grade | -2 | -2 |
| Configuration Type | Flash (live at power-up) | Flash (live at power-up) | Flash (live at power-up) | Flash (live at power-up) | Flash (live at power-up) |
Key Differentiators
- Hard ARM Cortex-M1 processor on die (vs A3P600-2FG256)
- Integrated configurable analog block (vs A3P600-2FG256)
- Fast -2 speed grade (vs M1AFS600-FG256)
- Lower cost and same footprint vs larger die (vs M1AFS1500-2FGG256)
- Commercial temperature optimizes cost (vs M1AFS250-2FG256I)
Design Notes
The M1AFS600-2FG256 requires a 1.5V core rail plus I/O bank supplies. Sequence the core before or simultaneously with I/O supplies and add bulk plus 0.1uF decoupling at each VCC ball pair of the FG256 grid; with 256 balls, distribute decoupling across the array rather than clustering at one corner. Verify startup transient current of the flash fabric in the Fusion power-play data before sizing the 1.5V regulator - hot-configuration can briefly spike above static draw.
The 256-ball LBGA uses a 1.0mm ball pitch, allowing via-in-pad with 0.3mm drills and dogbone or direct via escape on 4+ layer boards. Dedicate at least one complete internal layer to a solid ground plane under the die; the Fusion analog block shares the die with switching fabric logic, so a clean return path directly affects ADC measurement accuracy. Do not route fast signals under the package center where the analog balls sit.
The commercial 0C to +70C grade is the most common selection error: outdoor, automotive-adjacent, or fanless enclosures routinely exceed 70C ambient near hot components. If in doubt, select an -I industrial variant or the M7AFS600 family and re-run timing at the correct temperature corner in Libero SoC. Also remember the -2 grade timing does not carry across the M1 to M7 migration - re-run static timing analysis after any die change, even pin-compatible ones.
With 119 user I/Os on a 1.0mm-pitch BGA, simultaneous switching noise is the primary signal-integrity risk. Group switching outputs by bank, spread high-drive outputs across banks, and reference them to solid planes. Match bank VCCI to your signaling standard (3.3V LVCMOS for most board-level glue, 2.5V/1.8V for memory interfaces) and keep stub lengths under 10mm for signals above 100MHz.
Compliance Information
Compliance status not stated in the provided distributor listings. Microchip FGG (lead-free) suffix variants exist in the family; verify RoHS/REACH on the official Microchip product page for this exact ordering code.