M1AFS600-2FG484I - Fusion FPGA 600K Gates, 172 I/O | Microchip
MPN: M1AFS600-2FG484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $119.8 | $11,980.00 |
| 500 | $108.4 | $54,200.00 |
| 1,000 | $97.6 | $97,600.00 |
Drop-in alternatives for M1AFS600-2FG484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
AFS600-2FGG484I
β Drop-Inπ Reference alternative (not in catalog)
M1AFS600-2FGG484I
β Drop-Inπ Reference alternative (not in catalog)
AFS600-1FG484I
β Drop-Inπ Reference alternative (not in catalog)
M1AFS600-1FGG484K
β Drop-Inβ In Stock
$155 / Unit
View Datasheet βM7AFS600-FGG484I
β Drop-Inβ In Stock
$219.2 / Unit
View Datasheet βM1AFS600-2FG484I Maximum Ratings & Electrical Characteristics
| Manufacturer Part Number | M1AFS600-2FG484I |
| Family | Fusion (Flash FPGA with ARM Cortex-M1) |
| System Gates | 600K |
| Logic Cells | 13824 |
| Total RAM Bits | 110592 bits |
| User I/O | 172 |
| Supply Voltage - Core | 1.5 V (1.425 V to 1.575 V) |
| Process Technology | 130 nm CMOS |
| Speed Grade | 2 |
| Reference Frequency (per distributor listing) | 1470.59 MHz |
| Package | 484-FBGA, 23x23 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Configuration Technology | Flash (non-volatile, instant-on) |
| Packaging | Tray |
M1AFS600-2FG484I 484-fbga, 23x23 mm Pin Configuration Guide
Complete pinout information for M1AFS600-2FG484I (484-fbga, 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS600-2FG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS600-2FG484I is suitable for 6 applications: Industrial Automation and Motor Control, Aerospace and Defense Embedded Processing, Smart Power and Energy Management, Embedded System Control with ARM Processing, Secure and Instant-On Systems, Test, Measurement and Protocol Bridging.
Industrial Automation and Motor Control
The M1AFS600-2FG484I fits industrial automation because its 600K-gate flash fabric and ARM Cortex-M1 processor integrate motion sequencing, PWM generation, and protocol bridging in one 484-FBGA device. With 172 user I/O, it directly drives encoder interfaces, ADC front ends, and fieldbus transceivers without external glue logic. Because the flash configuration is non-volatile and instant-on, drives and PLC modules boot deterministically without external configuration memory - a key advantage over SRAM FPGAs in factory equipment that must restart safely after power dips. The industrial -40C to +100C rating covers cabinet and motor-drive thermal environments.
Recommended
Aerospace and Defense Embedded Processing
Defense subsystems favor the M1AFS600-2FG484I because Actel/Microsemi-origin flash FPGAs are inherently non-volatile and resistant to bitstream interception, unlike SRAM FPGAs that load configuration from external flash at every power-up. The ARM Cortex-M1 core handles telemetry and housekeeping while the 600K-gate fabric implements custom interfaces, and the 484-FBGA provides 172 I/O for backplane and sensor routing. The industrial temperature rating plus Microchip's heritage in rad-tolerant families makes migration paths available. Designs should verify program-specific screening and environmental requirements independently with Microchip.
Recommended
Smart Power and Energy Management
The Fusion family was architected specifically for smart power control, so the M1AFS600-2FG484I is a natural fit for power sequencing, energy metering, and battery management controllers. Its mixed-signal heritage pairs the ARM Cortex-M1 with analog-oriented fabric resources, while 600K gates implement multi-channel PWM, soft-start state machines, and digital protection comparators. The 110592-bit embedded RAM buffers metering samples and event logs. Instant-on flash configuration means power rails are supervised from the first millisecond after brownout - a requirement SRAM FPGAs cannot meet without external configuration devices.
Recommended
Embedded System Control with ARM Processing
When a design needs a microcontroller plus custom logic, the M1AFS600-2FG484I eliminates the classic two-chip MCU+FPGA split. The ARM Cortex-M1 runs firmware while the 600K-gate fabric implements peripherals that do not exist on standard MCUs - custom serial engines, deterministic logic interfaces, or proprietary accelerators. On-chip fabric-to-processor coupling removes off-chip bus latency between MCU and FPGA, and 172 user I/O host both firmware-driven and fabric-driven signals. Non-volatile flash startup means the system runs firmware immediately with no configuration controller or boot ROM negotiation.
Recommended
Secure and Instant-On Systems
The M1AFS600-2FG484I suits applications where configuration security and boot time are critical: network appliances, secure gateways, and anti-tamper systems. Flash-based fabric stores the bitstream on-chip, eliminating the external configuration flash that exposes SRAM FPGAs to bitstream cloning and bus-snooping attacks, and removing 10-100 ms of configuration delay at power-up. For always-on infrastructure equipment, the 1.5V core supply (1.425V to 1.575V) keeps power budget predictable, and the 484-FBGA's 23x23 mm footprint packs 600K gates and 172 I/O into a dense surface-mount package.
Recommended
Test, Measurement and Protocol Bridging
Instrument makers use the M1AFS600-2FG484I as a configurable protocol bridge and timing engine: the 600K-gate fabric implements UART/SPI/I2C to custom bus translation, trigger state machines, and timestamping at fabric speed, while the ARM Cortex-M1 handles USB or Ethernet command parsing and housekeeping. The 110592-bit embedded RAM captures trace buffers, and 172 I/O fan out to front-panel connectors and ADC/DAC chips. Distributor listings cite a 1470.59 MHz family reference figure, reflecting the timing resolution achievable in the fabric for TDC-style measurement circuits.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS600-2FG484I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AFS600-2FGG484I | M1AFS600-2FGG484I | AFS600-1FG484I | M7AFS600-FGG484I |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| User I/O | 172 | 172 | 172 | 172 | 172 |
| Speed Grade | 2 | 2 | 2 | 1 (faster) | [DATA_NEEDED] |
| Total RAM Bits | 110592 | 110592 | 110592 | 110592 | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | [DATA_NEEDED] |
| Lead-Free / Green Ball | No (standard FG) | Yes (FGG) | Yes (FGG) | No (FG) | Yes (FGG) |
| Operating Temperature | -40C to +100C (Industrial) | Industrial | Industrial | Industrial | Industrial |
Key Differentiators
- Integrated ARM Cortex-M1 processor in flash fabric (vs AFS600-2FGG484I)
- Cost-optimized speed grade (vs M1AFS600-1FGG484K)
- Instant-on non-volatile flash configuration (vs SRAM FPGAs (Xilinx/AMD Artix-7 class))
Design Notes
Power the M1AFS600-2FG484I core from a regulated 1.5V rail held within 1.425V to 1.575V (per distributor specification data). Use a low-noise LDO or wide-input DC-DC followed by an LC filter, and follow Microchip's Fusion power-up sequencing requirements for auxiliary and I/O rails. Because flash FPGAs draw startup current differently from SRAM FPGAs (no configuration fetch), size the bulk capacitance for steady-state fabric switching current rather than inrush. Estimate: at moderate fabric utilization, allow headroom for at least 2x nominal core current in the 1.5V converter.
For the 484-ball FBGA (23x23 mm), place a 0.1 uF ceramic decoupling capacitor at every power/ground ball pair on the underside of the board, plus bulk capacitance at the board edge. Fan out with via-in-pad or dog-bone escapes on 0.8 mm pitch as appropriate, and dedicate complete internal planes to core and I/O grounds to control simultaneous switching noise across the 172 user I/O. Follow Microchip's Fusion FPGA PCB layout application notes for bank grouping and ball-mapped power assignment.
Do not interchange FG (standard ball) and FGG (green/lead-free ball) suffixes casually in a RoHS-regulated BOM - the M1AFS600-2FG484I uses standard FG ball metallurgy, so compliance-driven programs should specify the FGG variant instead. Also remember that M1AFS600-1FGG484K is speed grade 1 while this part is speed grade 2: design timing margins against grade 2, or recompile and re-verify when substituting across speed grades in the same 484 footprint.
Compliance Information
Standard FG suffix indicates non-green ball metallurgy; the FGG variants (e.g., AFS600-2FGG484I) denote lead-free/green. Confirm RoHS/REACH status with Microchip for the exact ordering code before specifying in compliant programs.
