MC34912G5AC - LIN SBC with 5V LDO & DC Motor Predriver | NXP
Teilenummer: MC34912G5AC ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.88 | $48,80 |
| 100 | $4.35 | $435,00 |
| 500 | $3.92 | $1.960,00 |
| 1.000 | $3.51 | $3.510,00 |
| 3.000 | $3.1 | $9.300,00 |
MC34912G5AC Übersicht
A System Basis Chip (SBC) is a mixed-signal power-management IC that consolidates a microcontroller's power rail, communication transceiver, and auxiliary drivers into one device, reducing PCB area, BOM cost, and quiescent current. The SBC category sits within power management ICs (PMICs) in the broader semiconductor hierarchy. The MC34912G5AC builds on NXP's 33912 family by adding full SPI-readable diagnostics, a selectable window watchdog, and enhanced ESD performance (LIN pin rated ±6 kV HBM IEC 61000-4-2 contact).
Key features include the LIN 2.5 / 2.1 / 2.0 physical-layer compliant transceiver with internal slew-rate control, the integrated 5.0V ±2% / 60mA LDO for the host MCU VDD rail, and the DC motor pre-driver capable of sourcing/sinking externally configured MOSFET gate drive. Current-sense feedback is amplified by an internal op-amp and reported back through SPI for closed-loop motor control or stall detection. A programmable window watchdog, fault collection register, and overtemperature shutdown provide functional-safety support for ASIL-A/B-capable modules.
Architecturally, the chip pairs a LIN physical layer based on NXP's automotive IP with a synchronous buck-style gate driver for the external H-bridge. The integrated current-sense amplifier uses chopper-stabilized input stages to reject ground bounce from PWM switching. SPI runs at up to 4 MHz in mode 0/1, with a 16-bit frame containing command, address, and diagnostic readback in a single transaction.
Typical applications include automotive HVAC flap and blower control, power-mirror positioning, seat-adjustment motors, window-lift modules, and generic LIN node actuator drivers. Designers pair the MC34912G5AC with an external N-channel MOSFET H-bridge, a host MCU (e.g., S9S08 or KEA), and a LIN master transceiver on the bus side. The combination delivers a small-footprint LIN slave node with on-die diagnostics.
A critical design consideration is thermal management of the LQFP-32 package under simultaneous LDO load and motor pre-driver switching. The exposed pad must be soldered to a ground copper pour of at least 100 mm² to keep junction temperature within the 150 °C Tj(max) rating. Watchdog timing, slew rate, and LIN baud rate are all SPI-configurable, allowing one hardware design to serve multiple LIN node variants without firmware rewrite.
This page synthesizes distributor stock, drop-in alternatives within the 33912/34912 SBC family, and field-engineering design notes that complement the manufacturer datasheet.
Drop-in-Alternativen für MC34912G5AC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC34912G5AC (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Mounting Type, Function, Supply Voltage (VBAT).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC33912G5
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33912BAC
✅ Drop-In✓ Auf Lager
$3.35 / Stück
Datenblatt ansehen →MC34912G5
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC33912G5AC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TJA1027T
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC34912G5AC Grenzwerte & elektrische Eigenschaften
| Product Type | System Basis Chip (SBC) with LIN transceiver |
| Topologie | SPI-controlled SBC: LIN 2.5 PHY + 5V LDO + DC motor pre-driver + current-sense amplifier |
| Gehäuse | 32-LQFP, 7x7 mm body, exposed thermal pad |
| Supply Voltage (VBAT) | 5.5 V to 27 V (40 V transient tolerant) |
| Integrated LDO Output (VCC) | 5.0 V ±2%, 60 mA |
| LIN Transceiver Standard | LIN 2.5 / 2.1 / 2.0 / 1.3 compliant |
| LIN ESD (Contact, IEC 61000-4-2) | ±6 kV (gun test, 150 pF / 330 Ω) |
| ISO 7637 Pulse 3b Immunity | Tolerant per datasheet |
| DC Motor Pre-Driver Output | Gate drive for external N-MOSFET H-bridge; current sense via internal amplifier |
| SPI Interface | 16-bit frame, mode 0 / 1, up to 4 MHz |
| Window Watchdog | SPI-selectable timing |
| Betriebstemperatur | -40 °C to +125 °C (ambient) |
| Thermisches Abschalten | Yes (overtemperature protection with SPI flag) |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
MC34912G5AC Pin-Konfiguration
| Pin 1 | LIN — LIN bus pin (LIN 2.5 compliant physical layer) |
| Pin 2 | VBAT — Battery supply input (5.5 V to 27 V DC, 40 V transient) |
| Pin 3 | GND1 — Ground reference (power) |
| Pin 4 | VCC — 5.0 V / 60 mA LDO output (MCU supply) |
| Pin 5 | WAKE — Wake-up input for cyclic monitoring |
| Pin 6 | WD — Window watchdog trigger input from host MCU |
| Pin 7 | CSN — SPI chip-select (active low) |
| Pin 8 | SCLK — SPI clock |
| Pin 9 | MOSI — SPI data from host MCU |
| Pin 10 | MISO — SPI data to host MCU |
| Pin 11 | INT — Interrupt output to host MCU |
| Pin 12 | RST — Reset output to host MCU |
| Pin 13 | CS+ — Current-sense amplifier non-inverting input |
| Pin 14 | CS- — Current-sense amplifier inverting input |
| Pin 15 | CSOUT — Current-sense amplifier output |
| Pin 16 | GHD — Gate high-drive output (high-side 1) |
| Pin 17 | GHD2 — Gate high-drive output (high-side 2) |
| Pin 18 | GLD1 — Gate low-drive output (low-side 1) |
| Pin 19 | GLD2 — Gate low-drive output (low-side 2) |
| Pin 20 | VS1 — High-side MOSFET source sense 1 |
| Pin 21 | VS2 — High-side MOSFET source sense 2 |
| Pin 22 | VPRE — Charge-pump output for high-side gate drive |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | TEMP — Overtemperature flag output |
| Pin 26 | FAULT — Fault output (LIN, VCC, watchdog, thermal) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | GND2 — Ground reference (signal) |
| Pin 32 | EPAD — Exposed thermal pad - solder to PCB ground pour for heat dissipation |
Typische Anwendungen
MC34912G5AC ist geeignet für 6 Anwendungs: Automotive HVAC Flap and Blower Control, Power Mirror and Seat Position Modules, LIN-Connected Window Lift Slave Node, Generic LIN Actuator Driver / Body Electronics Slave, Industrial Brushed-DC Servo / Small Actuator, LIN Slaves in Body Control Module Sub-Networks.
Automotive HVAC Flap and Blower Control
The MC34912G5AC is well-matched to HVAC flap and blower modules because its LIN 2.5 transceiver provides bus communication with the body controller, its 5 V / 60 mA LDO supplies the host MCU, and its DC motor pre-driver drives the external N-MOSFET H-bridge that powers the blower or mode-door actuator. The integrated current-sense amplifier reports stall or jam conditions back to the MCU through SPI for diagnostics and end-of-line testing. AEC-Q100 qualification and ±6 kV LIN ESD simplify conformance to OEM EMC requirements. Designers place the part between the LIN bus master and the H-bridge, sized so that the SBC dissipates roughly 1-2 W under worst-case motor current.
Empfohlen
Power Mirror and Seat Position Modules
Power mirror and seat-position modules need two-axis or multi-axis brushed-DC motor control, LIN connectivity to the body controller, and tight PCB area budgets - all of which the MC34912G5AC addresses in a single 32-LQFP. The gate-drive outputs switch the external H-bridge MOSFETs at the slew rate configured in SPI, while the current-sense amplifier verifies that the actuator is moving and not stalled. Combined with the SPI-selectable window watchdog, the SBC supports ASIL-A-capable seat-position memory functions. The exposed thermal pad must be soldered to at least 100 mm² of copper for sustained mirror-folding currents.
Empfohlen
LIN-Connected Window Lift Slave Node
Window lift modules typically use a LIN slave node to control a single brushed-DC motor that drives the window regulator. The MC34912G5AC integrates the LIN PHY that receives raise/lower commands, the 5 V LDO that supplies the host MCU, and the DC motor pre-driver that gates the H-bridge driving the regulator motor. Anti-pinch safety logic is implemented in the host MCU, with the SBC's current-sense amplifier providing the motor-current feedback used to detect obstacle stalls. The SPI diagnostics allow the body controller to read fault status over LIN during production end-of-line testing.
Empfohlen
Generic LIN Actuator Driver / Body Electronics Slave
The MC34912G5AC is also deployed in generic LIN actuator nodes such as headlight levelers, trunk latches, and steering-column adjusters, where a single 12 V motor or solenoid must be controlled over LIN. The integrated LIN transceiver eliminates the need for a standalone LIN PHY, the LDO eliminates an external 5 V regulator, and the pre-driver eliminates a discrete MOSFET gate driver. SPI configurability of the watchdog and gate-drive parameters allows one hardware design to serve multiple LIN node variants. AEC-Q100 qualification and ±6 kV LIN ESD support OEM-wide EMC conformance.
Empfohlen
Industrial Brushed-DC Servo / Small Actuator
Outside of automotive, designers use the MC34912G5AC in industrial 24 V brushed-DC servo and small actuator modules where the integrated LIN or UART-transportable SPI control, 5 V LDO, and pre-driver simplify the BOM. The 27 V continuous VBAT rating covers 24 V industrial supplies with headroom for transients, and the SPI diagnostics allow predictive maintenance in factory-automation cells. The industrial-grade MC33912G5 variant is preferred here to avoid paying for automotive screening, but the G5AC is a drop-in if the part is already qualified on a vendor list.
Empfohlen
LIN Slaves in Body Control Module Sub-Networks
The MC34912G5AC serves as the local LIN slave in distributed body-control sub-networks such as door modules, roof modules, and seat-heater nodes, where a small local MCU runs the actuator while a central BCM acts as LIN master. The SBC's SPI diagnostics allow the local MCU to surface fault status up to the BCM over LIN, and the watchdog ensures that a firmware hang in the local MCU does not leave a motor stuck on. Compared to a discrete LIN PHY + LDO + gate-driver solution, the MC34912G5AC reduces PCB area by roughly 40% and BOM count by three or four parts.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC34912G5AC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC33912G5 | MC33912BAC | MC34912G5 | MC33912G5AC |
|---|---|---|---|---|---|
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| LIN Standard | LIN 2.5 / 2.1 / 2.0 / 1.3 | LIN 2.5 / 2.1 / 2.0 / 1.3 | LIN 2.5 / 2.1 / 2.0 / 1.3 | LIN 2.5 / 2.1 / 2.0 / 1.3 | LIN 2.5 / 2.1 / 2.0 / 1.3 |
| AEC-Q100 | Qualified (automotive) | Not qualified (industrial) | Not qualified (industrial) | Qualified (automotive) | Not qualified (industrial) |
| Integrated 5 V LDO Current | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA |
| DC Motor Pre-Driver | Yes (H-bridge gate drive) | Yes (H-bridge gate drive) | Yes (H-bridge gate drive, enhanced diagnostics) | Yes (H-bridge gate drive) | Yes (H-bridge gate drive) |
| LIN ESD (Contact) | ±6 kV (IEC 61000-4-2) | ±6 kV (IEC 61000-4-2) | ±6 kV (IEC 61000-4-2) | ±6 kV (IEC 61000-4-2) | ±6 kV (IEC 61000-4-2) |
| Lifecycle Status (2026-10-15) | NRND | NRND | Active | NRND | NRND |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
Wichtigste Unterscheidungsmerkmale
- Integrated 5 V / 60 mA LDO plus LIN 2.5 PHY plus DC motor pre-driver plus current-sense amplifier in a single 32-LQFP (vs. Discrete LIN PHY + LDO + gate-driver solution)
- AEC-Q100 qualified with ±6 kV LIN contact ESD (IEC 61000-4-2) (vs. MC33912G5 industrial-grade variant)
- SPI-selectable window watchdog and configurable gate-drive slew rate (vs. Earlier 33912 revisions with fixed watchdog timing)
Designhinweise
The 32-LQFP exposed thermal pad carries most of the SBC's dissipation when the H-bridge is PWM-switching at high currents. Estimated: with 1 W SBC dissipation and a JEDEC JESD51 4-layer test board, theta_JA is roughly 35 °C/W, giving a 35 °C junction rise above 25 °C ambient. Solder the EPAD to a continuous ground copper pour of at least 100 mm² (preferably 250 mm²) and stitch vias to the internal ground plane to keep Tj below the 150 °C Tj(max) rating during motor stall.
Place the VBAT decoupling capacitor (≥ 47 µF electrolytic plus 100 nF ceramic) within 5 mm of the VBAT pin to suppress load-dump transients per ISO 7637. Keep the LIN bus trace short and routed away from the H-bridge gate-drive traces to avoid capacitive coupling that injects noise into the LIN eye diagram. The VCC LDO output requires an external 4.7 µF X7R bypass capacitor placed as close to the VCC pin as possible to meet the ±2% output tolerance under 60 mA load steps.
Do not float the watchdog (WD) pin; either drive it from the host MCU's watchdog refresh toggle or tie it to a defined logic state per the SPI-configured window setting. Floating the WD pin forces the SBC into safe-state reset. Also, configure the LIN dominant-timeout via SPI before enabling bus communication, otherwise a stuck-dominant bus fault can lock the LIN PHY. Lastly, verify that the host MCU's SPI port is 5 V tolerant; 3.3 V-only MCUs require an external level translator.
Route the gate-drive traces (GHD1, GHD2, GLD1, GLD2) as matched-length differential pairs to the H-bridge MOSFET gates to keep the high-side and low-side transitions aligned. Place the current-sense shunt resistor in the low-side return path and route the CS+ / CS- traces as a twisted pair back to the SBC to reject PWM switching noise. Ground the SBC EPAD with at least four thermal vias (0.3 mm drill, 1 mm pitch) to the inner ground plane.
The SPI bus runs at up to 4 MHz; keep MISO/MOSI/SCLK/CSN traces under 50 mm and series-terminate with 33 Ω at the driver end if the bus exceeds 25 mm. Add a 10 kΩ pull-up on CSN to prevent spurious SPI transactions during MCU reset. Verify SPI mode (mode 0 vs. mode 1) against the host MCU configuration before first power-up; a mode mismatch silently corrupts all SPI reads.
Compliance-Informationen
AEC-Q100 qualified (automotive grade) per NXP product page; LIN ESD rated ±6 kV contact per IEC 61000-4-2; lead-free and RoHS compliant per DigiKey product listing; halogen-free status not stated in the verified web data - flagged unknown.
