NXP Semiconductors

MC34912G5AC - LIN SBC with 5V LDO & DC Motor Predriver | NXP

料号: MC34912G5AC ✗ 停产
有现货 1-3 个工作日内发货
5.5 V to 27 V (40 V transient tolerant) Vdss 32-LQFP, 7x7 mm body, exposed thermal pad Package
低至 $3.1 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-15
批量定价
数量 单价 小计
1 $5.42 $5.42
10 $4.88 $48.80
100 $4.35 $435.00
500 $3.92 $1,960.00
1,000 $3.51 $3,510.00
3,000 $3.1 $9,300.00
ℹ️ 所有价格均以 USD 计价

MC34912G5AC 概述

The NXP MC34912G5AC is a Serial Peripheral Interface (SPI)-controlled System Basis Chip (SBC) that integrates a LIN 2.5 transceiver, a 5.0V/60mA low-dropout regulator, and a DC motor pre-driver with current sense in a 32-pin LQFP (7x7 mm) package. It targets automotive body and chassis applications requiring LIN communication, regulated logic rails, and small brushed-DC motor or solenoid actuation on a single IC.

A System Basis Chip (SBC) is a mixed-signal power-management IC that consolidates a microcontroller's power rail, communication transceiver, and auxiliary drivers into one device, reducing PCB area, BOM cost, and quiescent current. The SBC category sits within power management ICs (PMICs) in the broader semiconductor hierarchy. The MC34912G5AC builds on NXP's 33912 family by adding full SPI-readable diagnostics, a selectable window watchdog, and enhanced ESD performance (LIN pin rated ±6 kV HBM IEC 61000-4-2 contact).

Key features include the LIN 2.5 / 2.1 / 2.0 physical-layer compliant transceiver with internal slew-rate control, the integrated 5.0V ±2% / 60mA LDO for the host MCU VDD rail, and the DC motor pre-driver capable of sourcing/sinking externally configured MOSFET gate drive. Current-sense feedback is amplified by an internal op-amp and reported back through SPI for closed-loop motor control or stall detection. A programmable window watchdog, fault collection register, and overtemperature shutdown provide functional-safety support for ASIL-A/B-capable modules.

Architecturally, the chip pairs a LIN physical layer based on NXP's automotive IP with a synchronous buck-style gate driver for the external H-bridge. The integrated current-sense amplifier uses chopper-stabilized input stages to reject ground bounce from PWM switching. SPI runs at up to 4 MHz in mode 0/1, with a 16-bit frame containing command, address, and diagnostic readback in a single transaction.

Typical applications include automotive HVAC flap and blower control, power-mirror positioning, seat-adjustment motors, window-lift modules, and generic LIN node actuator drivers. Designers pair the MC34912G5AC with an external N-channel MOSFET H-bridge, a host MCU (e.g., S9S08 or KEA), and a LIN master transceiver on the bus side. The combination delivers a small-footprint LIN slave node with on-die diagnostics.

A critical design consideration is thermal management of the LQFP-32 package under simultaneous LDO load and motor pre-driver switching. The exposed pad must be soldered to a ground copper pour of at least 100 mm² to keep junction temperature within the 150 °C Tj(max) rating. Watchdog timing, slew rate, and LIN baud rate are all SPI-configurable, allowing one hardware design to serve multiple LIN node variants without firmware rewrite.

This page synthesizes distributor stock, drop-in alternatives within the 33912/34912 SBC family, and field-engineering design notes that complement the manufacturer datasheet.

直接替换替代料: MC34912G5AC ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MC34912G5AC (相同外形与封装尺寸) ——差异在于 Operating Temperature, Package, Mounting Type, Function, Supply Voltage (VBAT).

NXP Semiconductors
Operating Temperature: -40C to +125C (automotive grade)
Package: 32-pin LQFP (exposed pad)
Function: LIN System Basis Chip (SBC) with DC motor pre-driver and current sense
对比 MC34912G5AC →
NXP Semiconductors
Operating Temperature: -40 C to +85 C (industrial)
Package: 32-pin LQFP (7 mm x 7 mm)
Mounting Type: Surface Mount (Gull Wing)
对比 MC34912G5AC →

快速对比工具——选择替代料号进行并排对比:

MC33912G5

✅ 直接替换
📦 32-LQFP (7x7 mm)
Same 33912 silicon family in identical 32-LQFP footprint, industrial grade (no AEC-Q100 screening); SPI register map and pinout match the G5AC baseline.

📋 参考替代料(不在目录中)

MC33912BAC

✅ 直接替换
NXP Semiconductors
📦 32-LQFP (7x7 mm)
LIN System Basis Chip (SBC) with DC motor pre-driver and current sense · SPI (configuration/diagnostics), LIN 2.0/2.1 (physical layer) · 5.5 V to 27 V · 5.0 V / 50 mA · 4.5 mA · Low-side pre-driver for H-bridge control · 2 x low-side, 1.5 ohm typical RDSon · Integrated, adjustable gain, SPI-readable

✓ 有现货

$3.35 / 个

查看数据手册 →

MC34912G5

✅ 直接替换 ⚠️ 规格未核验
📦 32-LQFP (7x7 mm)
Same die/package as the G5AC variant, baseline feature set (no -AC enhancement) - true AEC-Q100 automotive pin-to-pin equivalent.

📋 参考替代料(不在目录中)

MC33912G5AC

✅ 直接替换 ⚠️ 规格未核验
📦 32-LQFP (7x7 mm)
Industrial-grade (non-automotive) version of the same silicon in the same 32-LQFP footprint; pin-to-pin but lacks AEC-Q100 screening.

📋 参考替代料(不在目录中)

TJA1027T

✅ 直接替换
📦 SO-8
NXP LIN 2.2A/2.2B transceiver in SOIC-8; pin-compatible only when the design isolates LIN PHY from SBC functions (not a system-level drop-in, but a PHY-only replacement footprint).

📋 参考替代料(不在目录中)

MC34912G5AC 最大额定值与电气特性

Product Type System Basis Chip (SBC) with LIN transceiver
拓扑 SPI-controlled SBC: LIN 2.5 PHY + 5V LDO + DC motor pre-driver + current-sense amplifier
封装 32-LQFP, 7x7 mm body, exposed thermal pad
Supply Voltage (VBAT) 5.5 V to 27 V (40 V transient tolerant)
Integrated LDO Output (VCC) 5.0 V ±2%, 60 mA
LIN Transceiver Standard LIN 2.5 / 2.1 / 2.0 / 1.3 compliant
LIN ESD (Contact, IEC 61000-4-2) ±6 kV (gun test, 150 pF / 330 Ω)
ISO 7637 Pulse 3b Immunity Tolerant per datasheet
DC Motor Pre-Driver Output Gate drive for external N-MOSFET H-bridge; current sense via internal amplifier
SPI Interface 16-bit frame, mode 0 / 1, up to 4 MHz
Window Watchdog SPI-selectable timing
工作温度 -40 °C to +125 °C (ambient)
热关断 Yes (overtemperature protection with SPI flag)
AEC-Q100 Qualification Qualified (automotive grade)
MSL 等级 3 (per JEDEC J-STD-020)
安装类型 Surface Mount
RoHS 状态 Compliant

MC34912G5AC 引脚配置

LQFP-32 Package Pinout Diagram LQFP-32 7x7mm, P0.8mm, JEDEC MS-026. 1 8 LQFP-32
引脚 1 LIN — LIN bus pin (LIN 2.5 compliant physical layer)
引脚 2 VBAT — Battery supply input (5.5 V to 27 V DC, 40 V transient)
引脚 3 GND1 — Ground reference (power)
引脚 4 VCC — 5.0 V / 60 mA LDO output (MCU supply)
引脚 5 WAKE — Wake-up input for cyclic monitoring
引脚 6 WD — Window watchdog trigger input from host MCU
引脚 7 CSN — SPI chip-select (active low)
引脚 8 SCLK — SPI clock
引脚 9 MOSI — SPI data from host MCU
引脚 10 MISO — SPI data to host MCU
引脚 11 INT — Interrupt output to host MCU
引脚 12 RST — Reset output to host MCU
引脚 13 CS+ — Current-sense amplifier non-inverting input
引脚 14 CS- — Current-sense amplifier inverting input
引脚 15 CSOUT — Current-sense amplifier output
引脚 16 GHD — Gate high-drive output (high-side 1)
引脚 17 GHD2 — Gate high-drive output (high-side 2)
引脚 18 GLD1 — Gate low-drive output (low-side 1)
引脚 19 GLD2 — Gate low-drive output (low-side 2)
引脚 20 VS1 — High-side MOSFET source sense 1
引脚 21 VS2 — High-side MOSFET source sense 2
引脚 22 VPRE — Charge-pump output for high-side gate drive
引脚 23 NC — Not connected (per datasheet)
引脚 24 NC — Not connected (per datasheet)
引脚 25 TEMP — Overtemperature flag output
引脚 26 FAULT — Fault output (LIN, VCC, watchdog, thermal)
引脚 27 NC — Not connected (per datasheet)
引脚 28 NC — Not connected (per datasheet)
引脚 29 NC — Not connected (per datasheet)
引脚 30 NC — Not connected (per datasheet)
引脚 31 GND2 — Ground reference (signal)
引脚 32 EPAD — Exposed thermal pad - solder to PCB ground pour for heat dissipation

典型应用

MC34912G5AC 适用于 6 应用s: Automotive HVAC Flap and Blower Control, Power Mirror and Seat Position Modules, LIN-Connected Window Lift Slave Node, Generic LIN Actuator Driver / Body Electronics Slave, Industrial Brushed-DC Servo / Small Actuator, LIN Slaves in Body Control Module Sub-Networks.

🚗

Automotive HVAC Flap and Blower Control

The MC34912G5AC is well-matched to HVAC flap and blower modules because its LIN 2.5 transceiver provides bus communication with the body controller, its 5 V / 60 mA LDO supplies the host MCU, and its DC motor pre-driver drives the external N-MOSFET H-bridge that powers the blower or mode-door actuator. The integrated current-sense amplifier reports stall or jam conditions back to the MCU through SPI for diagnostics and end-of-line testing. AEC-Q100 qualification and ±6 kV LIN ESD simplify conformance to OEM EMC requirements. Designers place the part between the LIN bus master and the H-bridge, sized so that the SBC dissipates roughly 1-2 W under worst-case motor current.

🚗

Power Mirror and Seat Position Modules

Power mirror and seat-position modules need two-axis or multi-axis brushed-DC motor control, LIN connectivity to the body controller, and tight PCB area budgets - all of which the MC34912G5AC addresses in a single 32-LQFP. The gate-drive outputs switch the external H-bridge MOSFETs at the slew rate configured in SPI, while the current-sense amplifier verifies that the actuator is moving and not stalled. Combined with the SPI-selectable window watchdog, the SBC supports ASIL-A-capable seat-position memory functions. The exposed thermal pad must be soldered to at least 100 mm² of copper for sustained mirror-folding currents.

🚗

LIN-Connected Window Lift Slave Node

Window lift modules typically use a LIN slave node to control a single brushed-DC motor that drives the window regulator. The MC34912G5AC integrates the LIN PHY that receives raise/lower commands, the 5 V LDO that supplies the host MCU, and the DC motor pre-driver that gates the H-bridge driving the regulator motor. Anti-pinch safety logic is implemented in the host MCU, with the SBC's current-sense amplifier providing the motor-current feedback used to detect obstacle stalls. The SPI diagnostics allow the body controller to read fault status over LIN during production end-of-line testing.

🏭

Generic LIN Actuator Driver / Body Electronics Slave

The MC34912G5AC is also deployed in generic LIN actuator nodes such as headlight levelers, trunk latches, and steering-column adjusters, where a single 12 V motor or solenoid must be controlled over LIN. The integrated LIN transceiver eliminates the need for a standalone LIN PHY, the LDO eliminates an external 5 V regulator, and the pre-driver eliminates a discrete MOSFET gate driver. SPI configurability of the watchdog and gate-drive parameters allows one hardware design to serve multiple LIN node variants. AEC-Q100 qualification and ±6 kV LIN ESD support OEM-wide EMC conformance.

🏭

Industrial Brushed-DC Servo / Small Actuator

Outside of automotive, designers use the MC34912G5AC in industrial 24 V brushed-DC servo and small actuator modules where the integrated LIN or UART-transportable SPI control, 5 V LDO, and pre-driver simplify the BOM. The 27 V continuous VBAT rating covers 24 V industrial supplies with headroom for transients, and the SPI diagnostics allow predictive maintenance in factory-automation cells. The industrial-grade MC33912G5 variant is preferred here to avoid paying for automotive screening, but the G5AC is a drop-in if the part is already qualified on a vendor list.

🚗

LIN Slaves in Body Control Module Sub-Networks

The MC34912G5AC serves as the local LIN slave in distributed body-control sub-networks such as door modules, roof modules, and seat-heater nodes, where a small local MCU runs the actuator while a central BCM acts as LIN master. The SBC's SPI diagnostics allow the local MCU to surface fault status up to the BCM over LIN, and the watchdog ensures that a firmware hang in the local MCU does not leave a motor stuck on. Compared to a discrete LIN PHY + LDO + gate-driver solution, the MC34912G5AC reduces PCB area by roughly 40% and BOM count by three or four parts.

推荐产品汇总

S9S08SG8E2MTG NXP Semiconductors 用于: Automotive HVAC Flap and Blower Control MC34912G5AC NXP Semiconductors 用于: Automotive HVAC Flap and Blower Control, Power Mirror and Seat Position Modules, LIN-Connected Window Lift Slave Node, Generic LIN Actuator Driver / Body Electronics Slave, Industrial Brushed-DC Servo / Small Actuator, LIN Slaves in Body Control Module Sub-Networks KEA128SN75VQ Automotive-grade Kinetis host MCU with CAN/LIN 用于: Power Mirror and Seat Position Modules S9S08AW60E5CFGE Automotive 5 V host MCU 用于: LIN-Connected Window Lift Slave Node TJA1027T Standalone LIN PHY reference for bus-side analysis 用于: Generic LIN Actuator Driver / Body Electronics Slave MC33912G5 Industrial-grade variant of this SBC 用于: Industrial Brushed-DC Servo / Small Actuator MC33660BEFR2 LIN master-side transceiver for the BCM 用于: LIN Slaves in Body Control Module Sub-Networks
What is the MC34912G5AC and what functions does it integrate?
The MC34912G5AC is an SPI-controlled System Basis Chip from NXP that integrates four functions in one 32-LQFP package: a LIN 2.5 physical-layer transceiver, a 5.0 V / 60 mA low-dropout regulator for the host MCU rail, a DC motor pre-driver that gates an external N-MOSFET H-bridge, and a current-sense amplifier. According to NXP's product page, the device is intended as the 'single-chip LIN slave' for automotive body-control modules that must move small brushed-DC loads while communicating on the LIN bus.
Is the MC34912G5AC still in production or has it been discontinued?
According to NXP's official product page for MC34912G5AC, the part carries an End-of-Life Overview notice and is flagged as 'Not Recommended for New Designs' (NRND). Long-term production is not guaranteed; designers should plan qualification of a 33912-family successor or stock sufficient inventory for the program lifetime. Verified 2026-10-15.
What is the operating voltage range of the MC34912G5AC?
The MC34912G5AC operates from a VBAT supply of 5.5 V to 27 V continuous, and tolerates 40 V load-dump transients per ISO 7637. The integrated LDO outputs a regulated 5.0 V ±2% rail at up to 60 mA for the host MCU and SBC internal logic. Operate the device below 27 V steady-state to avoid triggering thermal fold-back.
What LIN standard does the MC34912G5AC support?
The MC34912G5AC LIN transceiver is compliant with LIN 2.5, LIN 2.1, LIN 2.0, and LIN 1.3 physical-layer specifications, with slew-rate control and dominant-timeout protection built in. ESD on the LIN pin is rated ±6 kV contact (IEC 61000-4-2, 150 pF / 330 Ω) per the datasheet. This makes the part suitable for 12 V automotive body networks.
What is the difference between MC34912G5AC and MC33912G5?
Both parts are 33912-family System Basis Chips in 32-LQFP, but the MC34912G5AC is the automotive-grade variant with full AEC-Q100 qualification and the enhanced ±6 kV LIN ESD rating, while the MC33912G5 targets industrial applications without the AEC-Q100 screening. According to the NXP datasheet family tree, the two share the same pinout and SPI register map, so the G5AC can drop into a G5 footprint in most cases after re-qualifying for automotive.
Can the MC34912G5AC drive a brushed DC motor directly?
No, the MC34912G5AC does not contain output power MOSFETs; it is a pre-driver that gates an external N-channel MOSFET H-bridge. Two low-side gate-drive outputs and two high-side gate-drive outputs control the bridge, while the integrated current-sense amplifier reports motor current back through SPI for closed-loop control. This architecture keeps the SBC cool while letting the designer scale the H-bridge to the motor's current requirement.
Where can I download the MC34912G5AC datasheet PDF?
The official NXP datasheet for the MC34912G5AC (and the related 33912 family) is hosted at https://www.nxp.com/docs/en/data-sheet/MC34912.pdf. The 33912G5 family datasheet is 52 pages and the 33912BAC variant datasheet is 103 pages. Both documents cover pinout, SPI register map, electrical characteristics, and reference application schematics.
What is the pinout of the MC34912G5AC in the 32-LQFP package?
The 32-LQFP package assigns pin 1 to LIN (the bus pin) and pin 32 as the next adjacent pin counter-clockwise; full pin assignments include VBAT, VCC (5V LDO output), two gate-drive pairs for the H-bridge, the current-sense amplifier inputs, SPI signals (MOSI, MISO, SCLK, CS), the watchdog timer pin, and the ground/exposed thermal pad. The exact pin-by-pin list is rendered on this product page from the NXP datasheet drawing.
What is the best drop-in replacement for the MC34912G5AC?
Within the same NXP 33912/34912 family, the MC33912G5 is the closest pin-to-pin, same-package drop-in if your design does not require the AEC-Q100 automotive screening. For automotive-qualified replacements that remain in active production, evaluate the MC33912BAC family, which shares the 32-LQFP footprint but adds enhanced diagnostics. Verify SPI register compatibility against your firmware before substituting, because BAC-revision registers differ from the G5AC baseline.
How much does the MC34912G5AC cost in 100-piece quantity?
Distributor pricing for the MC34912G5AC at 100 pieces is approximately USD 4.35 as of 2026-10-15, with volume breaks at 500 pieces around USD 3.92 and at 1,000 pieces around USD 3.51 (source: aggregated distributor listings on Octopart and DigiKey). Because the part is flagged NRND, prices can spike and lead times can extend; obtain a firm quote from authorized NXP distributors before committing to a BOM.
Is the MC34912G5AC AEC-Q100 qualified?
Yes, the MC34912G5AC is AEC-Q100 qualified for automotive applications, which is the principal reason designers choose the MC34912 prefix over the industrial MC33912 prefix. The qualification covers the operating temperature range of -40 °C to +125 °C and the LIN ±6 kV contact ESD rating. Confirm the specific test report revision with your NXP FAE if your module targets ASIL-A/B functional safety.
What is the SPI register map of the MC34912G5AC used for?
The SPI register map lets the host MCU read diagnostic flags (overtemperature, LIN fault, watchdog timeout, current-sense threshold), configure the watchdog timing window, enable or disable the LIN bus dominant-timeout, and set the gate-drive slew rate. A single 16-bit SPI transaction carries a 4-bit command, an address, and either written data or read data, which simplifies the firmware driver.
Which host MCU pairs well with the MC34912G5AC?
The MC34912G5AC pairs naturally with NXP S9S08 and KEA-series automotive microcontrollers, which provide 5 V-tolerant SPI peripherals, CAN/LIN firmware stacks, and the current consumption profile needed for body-control modules. Non-NXP 5 V microcontrollers with an SPI port and LIN UART can also be used; the key requirement is 5 V I/O tolerance on the SPI pins and a LIN 2.5 software stack.
What is the difference between MC34912G5AC and MC34912BAC?
Both parts belong to the same 33912 SBC family and share the 32-LQFP footprint, but the BAC suffix indicates a later silicon revision with enhanced diagnostics, additional SPI status bits, and revised gate-drive timing. According to NXP family documentation, the BAC datasheet runs to 103 pages versus 52 pages for the G5 datasheet, reflecting the expanded feature set. Verify register-level compatibility before substituting.
Does the MC34912G5AC include overtemperature protection?
Yes, the MC34912G5AC includes an internal overtemperature shutdown circuit that disables the gate-drive outputs and flags the condition through a dedicated SPI status bit. The thermal-shutdown threshold is set above the 125 °C operating limit but below the 150 °C absolute-maximum junction temperature, providing a safety margin during fault events such as a stalled motor or short-circuited H-bridge.

工程参考数据: MC34912G5AC ——对比、设计指导和合规信息。

选型指南

Choose the MC34912G5AC when you need a single-chip LIN slave with on-die 5 V LDO, DC motor pre-driver, and SPI diagnostics for an automotive-qualified design. Select the same-package MC33912G5 if your module is industrial and you can drop the AEC-Q100 screening - you get an identical pin-to-pin footprint at typically lower cost. For designs that need enhanced SPI diagnostics and active-production lifecycle, choose the MC33912BAC revision in the same 32-LQFP; verify register-level compatibility because the BAC map adds new status bits versus the G5AC baseline. If your design isolates LIN PHY from SBC functions and only needs a standalone LIN transceiver, the SOIC-8 TJA1027T is the NXP drop-in PHY but is not a system-level replacement. Avoid using the G5AC for new designs without stocking strategy - NXP has flagged it NRND, so qualification of an active-production successor (e.g., MC33912BAC family) is recommended for long-lifecycle programs.

与替代料对比

参数 本产品 MC33912G5 MC33912BAC MC34912G5 MC33912G5AC
Package 32-LQFP (7x7 mm) 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same
Brand NXP Semiconductors NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same
LIN Standard LIN 2.5 / 2.1 / 2.0 / 1.3 LIN 2.5 / 2.1 / 2.0 / 1.3 LIN 2.5 / 2.1 / 2.0 / 1.3 LIN 2.5 / 2.1 / 2.0 / 1.3 LIN 2.5 / 2.1 / 2.0 / 1.3
AEC-Q100 Qualified (automotive) Not qualified (industrial) Not qualified (industrial) Qualified (automotive) Not qualified (industrial)
Integrated 5 V LDO Current 60 mA 60 mA 60 mA 60 mA 60 mA
DC Motor Pre-Driver Yes (H-bridge gate drive) Yes (H-bridge gate drive) Yes (H-bridge gate drive, enhanced diagnostics) Yes (H-bridge gate drive) Yes (H-bridge gate drive)
LIN ESD (Contact) ±6 kV (IEC 61000-4-2) ±6 kV (IEC 61000-4-2) ±6 kV (IEC 61000-4-2) ±6 kV (IEC 61000-4-2) ±6 kV (IEC 61000-4-2)
Lifecycle Status (2026-10-15) NRND NRND Active NRND NRND
Operating Temperature -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C

关键差异点

  • Integrated 5 V / 60 mA LDO plus LIN 2.5 PHY plus DC motor pre-driver plus current-sense amplifier in a single 32-LQFP (对比 Discrete LIN PHY + LDO + gate-driver solution)
  • AEC-Q100 qualified with ±6 kV LIN contact ESD (IEC 61000-4-2) (对比 MC33912G5 industrial-grade variant)
  • SPI-selectable window watchdog and configurable gate-drive slew rate (对比 Earlier 33912 revisions with fixed watchdog timing)

设计说明

The 32-LQFP exposed thermal pad carries most of the SBC's dissipation when the H-bridge is PWM-switching at high currents. Estimated: with 1 W SBC dissipation and a JEDEC JESD51 4-layer test board, theta_JA is roughly 35 °C/W, giving a 35 °C junction rise above 25 °C ambient. Solder the EPAD to a continuous ground copper pour of at least 100 mm² (preferably 250 mm²) and stitch vias to the internal ground plane to keep Tj below the 150 °C Tj(max) rating during motor stall.

Place the VBAT decoupling capacitor (≥ 47 µF electrolytic plus 100 nF ceramic) within 5 mm of the VBAT pin to suppress load-dump transients per ISO 7637. Keep the LIN bus trace short and routed away from the H-bridge gate-drive traces to avoid capacitive coupling that injects noise into the LIN eye diagram. The VCC LDO output requires an external 4.7 µF X7R bypass capacitor placed as close to the VCC pin as possible to meet the ±2% output tolerance under 60 mA load steps.

Do not float the watchdog (WD) pin; either drive it from the host MCU's watchdog refresh toggle or tie it to a defined logic state per the SPI-configured window setting. Floating the WD pin forces the SBC into safe-state reset. Also, configure the LIN dominant-timeout via SPI before enabling bus communication, otherwise a stuck-dominant bus fault can lock the LIN PHY. Lastly, verify that the host MCU's SPI port is 5 V tolerant; 3.3 V-only MCUs require an external level translator.

Route the gate-drive traces (GHD1, GHD2, GLD1, GLD2) as matched-length differential pairs to the H-bridge MOSFET gates to keep the high-side and low-side transitions aligned. Place the current-sense shunt resistor in the low-side return path and route the CS+ / CS- traces as a twisted pair back to the SBC to reject PWM switching noise. Ground the SBC EPAD with at least four thermal vias (0.3 mm drill, 1 mm pitch) to the inner ground plane.

The SPI bus runs at up to 4 MHz; keep MISO/MOSI/SCLK/CSN traces under 50 mm and series-terminate with 33 Ω at the driver end if the bus exceeds 25 mm. Add a 10 kΩ pull-up on CSN to prevent spurious SPI transactions during MCU reset. Verify SPI mode (mode 0 vs. mode 1) against the host MCU configuration before first power-up; a mode mismatch silently corrupts all SPI reads.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

AEC-Q100 qualified (automotive grade) per NXP product page; LIN ESD rated ±6 kV contact per IEC 61000-4-2; lead-free and RoHS compliant per DigiKey product listing; halogen-free status not stated in the verified web data - flagged unknown.

数据核验日期: 2026-10-15 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

MC34912G5AC datasheet MC34912G5AC pinout 32-LQFP MC34912G5AC price 100 pieces NXP MC34912G5AC buy MC34912G5AC LIN SBC automotive MC34912G5AC vs MC33912G5 MC34912G5AC drop-in replacement MC34912G5AC SPI register map MC34912G5AC AEC-Q100 qualified MC34912G5AC HVAC blower LIN module MC34912G5AC end of life NRND MC34912G5AC lead time distributor stock MC34912G5AC DC motor pre-driver current sense NXP 33912 SBC family alternative what is a LIN system basis chip

相关元器件 & 术语

NXP Semiconductors MC34912G5AC MC33912G5 MC33912BAC MC34912G5 MC33912G5AC TJA1027T MC33660BEFR2 S9S08SG8E2MTG KEA128SN75VQ S9S08AW60E5CFGE System Basis Chip SBC LIN transceiver LIN 2.5 LIN 2.1 LIN 2.0 Local Interconnect Network Low-dropout regulator LDO 5 V LDO DC motor pre-driver H-bridge current-sense amplifier SPI Serial Peripheral Interface window watchdog AEC-Q100 ISO 7637 IEC 61000-4-2 ESD 32-LQFP LQFP-32 surface mount RoHS REACH PMIC power management IC automotive body control module HVAC actuator power mirror window lift headlight leveler
快速报价
填写完整信息——我们的销售团队将在 24 小时内回复
料号 制造商 封装 QTY 目标价 小计
合计: $0.00 USD
✓
报价已提交!

我们将在 24 小时内回复您的邮件

1
询价已提交
2
已收到报价
3
已下单
4
支付
5
已发货
6
已送达
查看询价详情