MC34912G5AC - LIN SBC with 5V LDO & DC Motor Predriver | NXP
部品番号: MC34912G5AC ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.88 | $48.80 |
| 100 | $4.35 | $435.00 |
| 500 | $3.92 | $1,960.00 |
| 1,000 | $3.51 | $3,510.00 |
| 3,000 | $3.1 | $9,300.00 |
MC34912G5AC 概要
A System Basis Chip (SBC) is a mixed-signal power-management IC that consolidates a microcontroller's power rail, communication transceiver, and auxiliary drivers into one device, reducing PCB area, BOM cost, and quiescent current. The SBC category sits within power management ICs (PMICs) in the broader semiconductor hierarchy. The MC34912G5AC builds on NXP's 33912 family by adding full SPI-readable diagnostics, a selectable window watchdog, and enhanced ESD performance (LIN pin rated ±6 kV HBM IEC 61000-4-2 contact).
Key features include the LIN 2.5 / 2.1 / 2.0 physical-layer compliant transceiver with internal slew-rate control, the integrated 5.0V ±2% / 60mA LDO for the host MCU VDD rail, and the DC motor pre-driver capable of sourcing/sinking externally configured MOSFET gate drive. Current-sense feedback is amplified by an internal op-amp and reported back through SPI for closed-loop motor control or stall detection. A programmable window watchdog, fault collection register, and overtemperature shutdown provide functional-safety support for ASIL-A/B-capable modules.
Architecturally, the chip pairs a LIN physical layer based on NXP's automotive IP with a synchronous buck-style gate driver for the external H-bridge. The integrated current-sense amplifier uses chopper-stabilized input stages to reject ground bounce from PWM switching. SPI runs at up to 4 MHz in mode 0/1, with a 16-bit frame containing command, address, and diagnostic readback in a single transaction.
Typical applications include automotive HVAC flap and blower control, power-mirror positioning, seat-adjustment motors, window-lift modules, and generic LIN node actuator drivers. Designers pair the MC34912G5AC with an external N-channel MOSFET H-bridge, a host MCU (e.g., S9S08 or KEA), and a LIN master transceiver on the bus side. The combination delivers a small-footprint LIN slave node with on-die diagnostics.
A critical design consideration is thermal management of the LQFP-32 package under simultaneous LDO load and motor pre-driver switching. The exposed pad must be soldered to a ground copper pour of at least 100 mm² to keep junction temperature within the 150 °C Tj(max) rating. Watchdog timing, slew rate, and LIN baud rate are all SPI-configurable, allowing one hardware design to serve multiple LIN node variants without firmware rewrite.
This page synthesizes distributor stock, drop-in alternatives within the 33912/34912 SBC family, and field-engineering design notes that complement the manufacturer datasheet.
ドロップイン代替品: MC34912G5AC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC34912G5AC （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Mounting Type, Function, Supply Voltage (VBAT).
クイック比較ツール — 並列比較する代替部品を選択:
MC33912G5
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC33912BAC
✅ ドロップイン✓ 在庫あり
$3.35 / 個
データシートを見る →MC34912G5
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC33912G5AC
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
TJA1027T
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC34912G5AC 最大定格＆電気的特性
| Product Type | System Basis Chip (SBC) with LIN transceiver |
| トポロジー | SPI-controlled SBC: LIN 2.5 PHY + 5V LDO + DC motor pre-driver + current-sense amplifier |
| パッケージ | 32-LQFP, 7x7 mm body, exposed thermal pad |
| Supply Voltage (VBAT) | 5.5 V to 27 V (40 V transient tolerant) |
| Integrated LDO Output (VCC) | 5.0 V ±2%, 60 mA |
| LIN Transceiver Standard | LIN 2.5 / 2.1 / 2.0 / 1.3 compliant |
| LIN ESD (Contact, IEC 61000-4-2) | ±6 kV (gun test, 150 pF / 330 Ω) |
| ISO 7637 Pulse 3b Immunity | Tolerant per datasheet |
| DC Motor Pre-Driver Output | Gate drive for external N-MOSFET H-bridge; current sense via internal amplifier |
| SPI Interface | 16-bit frame, mode 0 / 1, up to 4 MHz |
| Window Watchdog | SPI-selectable timing |
| 動作温度 | -40 °C to +125 °C (ambient) |
| 熱シャットダウン | Yes (overtemperature protection with SPI flag) |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
MC34912G5AC ピン構成
| ピン 1 | LIN — LIN bus pin (LIN 2.5 compliant physical layer) |
| ピン 2 | VBAT — Battery supply input (5.5 V to 27 V DC, 40 V transient) |
| ピン 3 | GND1 — Ground reference (power) |
| ピン 4 | VCC — 5.0 V / 60 mA LDO output (MCU supply) |
| ピン 5 | WAKE — Wake-up input for cyclic monitoring |
| ピン 6 | WD — Window watchdog trigger input from host MCU |
| ピン 7 | CSN — SPI chip-select (active low) |
| ピン 8 | SCLK — SPI clock |
| ピン 9 | MOSI — SPI data from host MCU |
| ピン 10 | MISO — SPI data to host MCU |
| ピン 11 | INT — Interrupt output to host MCU |
| ピン 12 | RST — Reset output to host MCU |
| ピン 13 | CS+ — Current-sense amplifier non-inverting input |
| ピン 14 | CS- — Current-sense amplifier inverting input |
| ピン 15 | CSOUT — Current-sense amplifier output |
| ピン 16 | GHD — Gate high-drive output (high-side 1) |
| ピン 17 | GHD2 — Gate high-drive output (high-side 2) |
| ピン 18 | GLD1 — Gate low-drive output (low-side 1) |
| ピン 19 | GLD2 — Gate low-drive output (low-side 2) |
| ピン 20 | VS1 — High-side MOSFET source sense 1 |
| ピン 21 | VS2 — High-side MOSFET source sense 2 |
| ピン 22 | VPRE — Charge-pump output for high-side gate drive |
| ピン 23 | NC — Not connected (per datasheet) |
| ピン 24 | NC — Not connected (per datasheet) |
| ピン 25 | TEMP — Overtemperature flag output |
| ピン 26 | FAULT — Fault output (LIN, VCC, watchdog, thermal) |
| ピン 27 | NC — Not connected (per datasheet) |
| ピン 28 | NC — Not connected (per datasheet) |
| ピン 29 | NC — Not connected (per datasheet) |
| ピン 30 | NC — Not connected (per datasheet) |
| ピン 31 | GND2 — Ground reference (signal) |
| ピン 32 | EPAD — Exposed thermal pad - solder to PCB ground pour for heat dissipation |
主な用途
MC34912G5AC の用途: 6 件s: Automotive HVAC Flap and Blower Control, Power Mirror and Seat Position Modules, LIN-Connected Window Lift Slave Node, Generic LIN Actuator Driver / Body Electronics Slave, Industrial Brushed-DC Servo / Small Actuator, LIN Slaves in Body Control Module Sub-Networks.
Automotive HVAC Flap and Blower Control
The MC34912G5AC is well-matched to HVAC flap and blower modules because its LIN 2.5 transceiver provides bus communication with the body controller, its 5 V / 60 mA LDO supplies the host MCU, and its DC motor pre-driver drives the external N-MOSFET H-bridge that powers the blower or mode-door actuator. The integrated current-sense amplifier reports stall or jam conditions back to the MCU through SPI for diagnostics and end-of-line testing. AEC-Q100 qualification and ±6 kV LIN ESD simplify conformance to OEM EMC requirements. Designers place the part between the LIN bus master and the H-bridge, sized so that the SBC dissipates roughly 1-2 W under worst-case motor current.
おすすめ
Power Mirror and Seat Position Modules
Power mirror and seat-position modules need two-axis or multi-axis brushed-DC motor control, LIN connectivity to the body controller, and tight PCB area budgets - all of which the MC34912G5AC addresses in a single 32-LQFP. The gate-drive outputs switch the external H-bridge MOSFETs at the slew rate configured in SPI, while the current-sense amplifier verifies that the actuator is moving and not stalled. Combined with the SPI-selectable window watchdog, the SBC supports ASIL-A-capable seat-position memory functions. The exposed thermal pad must be soldered to at least 100 mm² of copper for sustained mirror-folding currents.
おすすめ
LIN-Connected Window Lift Slave Node
Window lift modules typically use a LIN slave node to control a single brushed-DC motor that drives the window regulator. The MC34912G5AC integrates the LIN PHY that receives raise/lower commands, the 5 V LDO that supplies the host MCU, and the DC motor pre-driver that gates the H-bridge driving the regulator motor. Anti-pinch safety logic is implemented in the host MCU, with the SBC's current-sense amplifier providing the motor-current feedback used to detect obstacle stalls. The SPI diagnostics allow the body controller to read fault status over LIN during production end-of-line testing.
おすすめ
Generic LIN Actuator Driver / Body Electronics Slave
The MC34912G5AC is also deployed in generic LIN actuator nodes such as headlight levelers, trunk latches, and steering-column adjusters, where a single 12 V motor or solenoid must be controlled over LIN. The integrated LIN transceiver eliminates the need for a standalone LIN PHY, the LDO eliminates an external 5 V regulator, and the pre-driver eliminates a discrete MOSFET gate driver. SPI configurability of the watchdog and gate-drive parameters allows one hardware design to serve multiple LIN node variants. AEC-Q100 qualification and ±6 kV LIN ESD support OEM-wide EMC conformance.
おすすめ
Industrial Brushed-DC Servo / Small Actuator
Outside of automotive, designers use the MC34912G5AC in industrial 24 V brushed-DC servo and small actuator modules where the integrated LIN or UART-transportable SPI control, 5 V LDO, and pre-driver simplify the BOM. The 27 V continuous VBAT rating covers 24 V industrial supplies with headroom for transients, and the SPI diagnostics allow predictive maintenance in factory-automation cells. The industrial-grade MC33912G5 variant is preferred here to avoid paying for automotive screening, but the G5AC is a drop-in if the part is already qualified on a vendor list.
おすすめ
LIN Slaves in Body Control Module Sub-Networks
The MC34912G5AC serves as the local LIN slave in distributed body-control sub-networks such as door modules, roof modules, and seat-heater nodes, where a small local MCU runs the actuator while a central BCM acts as LIN master. The SBC's SPI diagnostics allow the local MCU to surface fault status up to the BCM over LIN, and the watchdog ensures that a firmware hang in the local MCU does not leave a motor stuck on. Compared to a discrete LIN PHY + LDO + gate-driver solution, the MC34912G5AC reduces PCB area by roughly 40% and BOM count by three or four parts.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC34912G5AC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC33912G5 | MC33912BAC | MC34912G5 | MC33912G5AC |
|---|---|---|---|---|---|
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| LIN Standard | LIN 2.5 / 2.1 / 2.0 / 1.3 | LIN 2.5 / 2.1 / 2.0 / 1.3 | LIN 2.5 / 2.1 / 2.0 / 1.3 | LIN 2.5 / 2.1 / 2.0 / 1.3 | LIN 2.5 / 2.1 / 2.0 / 1.3 |
| AEC-Q100 | Qualified (automotive) | Not qualified (industrial) | Not qualified (industrial) | Qualified (automotive) | Not qualified (industrial) |
| Integrated 5 V LDO Current | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA |
| DC Motor Pre-Driver | Yes (H-bridge gate drive) | Yes (H-bridge gate drive) | Yes (H-bridge gate drive, enhanced diagnostics) | Yes (H-bridge gate drive) | Yes (H-bridge gate drive) |
| LIN ESD (Contact) | ±6 kV (IEC 61000-4-2) | ±6 kV (IEC 61000-4-2) | ±6 kV (IEC 61000-4-2) | ±6 kV (IEC 61000-4-2) | ±6 kV (IEC 61000-4-2) |
| Lifecycle Status (2026-10-15) | NRND | NRND | Active | NRND | NRND |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
主な差別化要因
- Integrated 5 V / 60 mA LDO plus LIN 2.5 PHY plus DC motor pre-driver plus current-sense amplifier in a single 32-LQFP （vs Discrete LIN PHY + LDO + gate-driver solution)
- AEC-Q100 qualified with ±6 kV LIN contact ESD (IEC 61000-4-2) （vs MC33912G5 industrial-grade variant)
- SPI-selectable window watchdog and configurable gate-drive slew rate （vs Earlier 33912 revisions with fixed watchdog timing)
設計ノート
The 32-LQFP exposed thermal pad carries most of the SBC's dissipation when the H-bridge is PWM-switching at high currents. Estimated: with 1 W SBC dissipation and a JEDEC JESD51 4-layer test board, theta_JA is roughly 35 °C/W, giving a 35 °C junction rise above 25 °C ambient. Solder the EPAD to a continuous ground copper pour of at least 100 mm² (preferably 250 mm²) and stitch vias to the internal ground plane to keep Tj below the 150 °C Tj(max) rating during motor stall.
Place the VBAT decoupling capacitor (≥ 47 µF electrolytic plus 100 nF ceramic) within 5 mm of the VBAT pin to suppress load-dump transients per ISO 7637. Keep the LIN bus trace short and routed away from the H-bridge gate-drive traces to avoid capacitive coupling that injects noise into the LIN eye diagram. The VCC LDO output requires an external 4.7 µF X7R bypass capacitor placed as close to the VCC pin as possible to meet the ±2% output tolerance under 60 mA load steps.
Do not float the watchdog (WD) pin; either drive it from the host MCU's watchdog refresh toggle or tie it to a defined logic state per the SPI-configured window setting. Floating the WD pin forces the SBC into safe-state reset. Also, configure the LIN dominant-timeout via SPI before enabling bus communication, otherwise a stuck-dominant bus fault can lock the LIN PHY. Lastly, verify that the host MCU's SPI port is 5 V tolerant; 3.3 V-only MCUs require an external level translator.
Route the gate-drive traces (GHD1, GHD2, GLD1, GLD2) as matched-length differential pairs to the H-bridge MOSFET gates to keep the high-side and low-side transitions aligned. Place the current-sense shunt resistor in the low-side return path and route the CS+ / CS- traces as a twisted pair back to the SBC to reject PWM switching noise. Ground the SBC EPAD with at least four thermal vias (0.3 mm drill, 1 mm pitch) to the inner ground plane.
The SPI bus runs at up to 4 MHz; keep MISO/MOSI/SCLK/CSN traces under 50 mm and series-terminate with 33 Ω at the driver end if the bus exceeds 25 mm. Add a 10 kΩ pull-up on CSN to prevent spurious SPI transactions during MCU reset. Verify SPI mode (mode 0 vs. mode 1) against the host MCU configuration before first power-up; a mode mismatch silently corrupts all SPI reads.
コンプライアンス情報
AEC-Q100 qualified (automotive grade) per NXP product page; LIN ESD rated ±6 kV contact per IEC 61000-4-2; lead-free and RoHS compliant per DigiKey product listing; halogen-free status not stated in the verified web data - flagged unknown.
