S9S08SG8E2MTG - 8KB Flash 40MHz S08 MCU TSSOP-16 | NXP
MPN: S9S08SG8E2MTG ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.65 | $2.65 |
| 10 | $2.32 | $23.20 |
| 100 | $1.95 | $195.00 |
| 500 | $1.62 | $810.00 |
| 1,000 | $1.35 | $1,350.00 |
S9S08SG8E2MTG Overview
An 8-bit microcontroller (MCU) is a compact processor that integrates a CPU, memory, and peripheral interfaces on a single silicon die. Within the embedded hierarchy, MCUs sit below microprocessors (MPUs) but above simple logic devices, providing application-specific compute for sensing, control, and human-machine-interface tasks. The S08 family is NXP's HCS08 architecture family, optimized for low cost, deterministic real-time response, and ultra-low peripheral power draw in LIN-safety and general-purpose designs.
Key features include 512 bytes of RAM, an internal clock source, multiple timer channels, an analog-to-digital converter, and LIN/SCI communication interfaces. The SG sub-family specifically targets LIN-slave, general-market, high-temperature (up to +150C ambient), and space-constrained applications. The 16-pin TSSOP (TSSOP-16) form factor keeps the BOM footprint small while exposing 12 GPIO pins and full background-debug (BGND) support via the HC08 instruction set.
Architecturally, the device combines the HC08 instruction set with the added BGND instruction for in-circuit debugging, and supports up to 32 interrupt/reset sources for real-time event handling. The embedded flash supports both in-application and in-circuit programming, enabling firmware updates in the field over LIN or SCI. The 0.25um SGF process node keeps leakage low and contributes to the part's suitability for always-on automotive body electronics.
Typical applications include automotive body controllers, LIN slave nodes, sensor interface modules, HVAC actuators, and general-purpose industrial control. The wide voltage range and AEC-Q100 qualification make it especially attractive for under-hood and cabin modules where temperature swings and supply transients stress inductive-switching loads. The 16-pin TSSOP footprint also suits hand-held consumer devices.
When designing with this device, ensure your vector table, RAM allocation, and stack fit within the 8KB flash and 512B RAM budgets; this is a small-memory part optimized for code efficiency rather than feature density. Reserve one GPIO for the external reset or BKGD line to allow factory programming without rework.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. It is intended to accelerate the engineer from descriptive source-selection through schematic review to prototype bring-up in a single sitting.
Drop-in alternatives for S9S08SG8E2MTG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with S9S08SG8E2MTG (same form factor and footprint) — differing in Package, Program Memory (Flash), ADC, RAM, Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
S9S08SG4E2CTJ
✅ Drop-In✓ In Stock
$1.85 / Unit
View Datasheet →S9S08SG16E1MTGR
✅ Drop-In✓ In Stock
$1.96 / Unit
View Datasheet →MC9S08SH8MTGR
✅ Drop-In✓ In Stock
$1.55 / Unit
View Datasheet →MC9S08AW8MFGE
✅ Drop-In📋 Reference alternative (not in catalog)
S9S08DN32AMLC
✅ Drop-In📋 Reference alternative (not in catalog)
S9S08SG8E2MTG Maximum Ratings & Electrical Characteristics
| Core | S08 (HCS08) |
| Core Size | 8-bit |
| Maximum CPU Frequency | 40 MHz |
| Program Memory (Flash) | 8 KB (8K x 8) |
| RAM | 512 B |
| Supply Voltage | 2.7 V to 5.5 V |
| Operating Temperature | -40C to +125C |
| Package | 16-pin TSSOP (MTG suffix) |
| Mounting Type | Surface Mount |
| GPIO Count | 12 |
| AEC-Q100 Qualification | Qualified (automotive) |
| Communication Interfaces | LIN, SCI (UART), I2C |
| Interrupt Sources | Up to 32 |
| Instruction Set | HC08 with added BGND |
| Process Node | 0.25 um SGF |
| MSL Level | 1 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
S9S08SG8E2MTG Pin Configuration
| Pin 1 | VDD — Supply voltage (2.7V to 5.5V) |
| Pin 2 | VSS — Ground reference |
| Pin 3 | RESET — External reset input, active low |
| Pin 4 | BKGD/MS — Background debug / mode select |
| Pin 5 | PTB0 — GPIO / timer channel |
| Pin 6 | PTB1 — GPIO / timer channel |
| Pin 7 | PTA0 — GPIO / SCI TX |
| Pin 8 | PTA1 — GPIO / SCI RX |
| Pin 9 | PTA2 — GPIO / LIN slave |
| Pin 10 | PTA3 — GPIO / ADC channel |
| Pin 11 | PTA4 — GPIO / ADC channel |
| Pin 12 | PTA5 — GPIO / timer channel |
| Pin 13 | PTB2 — GPIO / PWM output |
| Pin 14 | PTB3 — GPIO / PWM output |
| Pin 15 | PTB4 — GPIO / external interrupt |
| Pin 16 | VSS — Ground reference |
Typical Applications
S9S08SG8E2MTG is suitable for 6 applications: Automotive LIN Slave Nodes, Automotive Sensor Interface Modules, HVAC Actuator Control, Body Electronics Controllers, Industrial General-Purpose Sensing, Low-Cost Consumer Remote Controls.
Automotive LIN Slave Nodes
The S9S08SG8E2MTG's S08SG architecture is purpose-built for LIN slave nodes in automotive body electronics. LIN slaves typically require low-cost 8-bit MCUs with hardware LIN/SCI UARTs, deterministic response times under 10ms, and AEC-Q100 stress tolerance for -40C to +125C cabin and under-hood environments. The device's integrated LIN slave controller and 8KB flash are sufficient for a typical body-control message set including door modules, seat controllers, and mirror adjusters. Compared with a 32-bit Cortex-M0 alternative, the S08SG burns less quiescent current and avoids the cost of an external LIN transceiver driver; design teams should budget 2KB flash for LIN stack plus 1KB for application code. The 40MHz CPU clock leaves headroom for periodic task scheduling at the standard 10-20ms LIN frame rate.
Recommended
Automotive Sensor Interface Modules
The S9S08SG8E2MTG's integrated multi-channel ADC and 8KB flash suit automotive sensor-interface modules such as temperature, pressure, and position sensors. The S08 core handles periodic ADC sampling at low rates (1-100Hz typical), linearization math, and LIN or SCI uplink of processed values. AEC-Q100 qualification combined with the -40C to +125C operating range ensures sensor accuracy across cabin and engine-bay thermal stress. The 512B RAM limits buffering, so streaming sensor data must be processed inline. Compared with a discrete op-amp + ADC design, the integrated MCU approach reduces BOM cost and PCB footprint by approximately 60%, while the 16-pin TSSOP keeps the module small enough for inline connector-mounted sensor heads.
Recommended
HVAC Actuator Control
The S9S08SG8E2MTG drives HVAC flap motors, blower speed controllers, and blend-door actuators in automotive HVAC modules. The device's PWM timer channels regulate DC motor speed and servo position while LIN/SCI handle cabin network communication. AEC-Q100 qualification and 125C operating temperature support the harsh thermal environment of HVAC plenum chambers, where ambient temperatures routinely reach +85C during summer soak. Compared with electromechanical relays, the MCU-driven PWM approach improves actuator linearity and reduces audible switching artifacts. The 8KB flash easily fits the closed-loop PID controller, calibration tables, and LIN slave stack required for modern HVAC modules, while the 512B RAM is sufficient for state variables only.
Recommended
Body Electronics Controllers
The S9S08SG8E2MTG powers body-electronics nodes including interior lighting dimmers, mirror controllers, and seat-position memories. The S08 core handles sequential LED fade control, button debouncing, and LIN uplink to the central body controller. The 12 GPIO pins on the 16-pin TSSOP are sufficient to drive 4-6 LEDs with PWM, scan a 4x4 button matrix, and interface to a LIN transceiver. AEC-Q100 qualification ensures the rated output mirrors survive the +85C cabin thermal environment, while 512B RAM supports the small state machine required for position memory. Compared with a hard-wired ASIC, the S08SG approach adds firmware flexibility and simplifies late-stage feature additions without PCB rework.
Recommended
Industrial General-Purpose Sensing
Outside automotive, the S9S08SG8E2MTG serves industrial sensor and actuator nodes that benefit from its wide 2.7-5.5V supply range, AEC-Q100-grade temperature tolerance, and LIN/SCI interfaces. Applications include factory-floor limit switches, conveyor speed monitors, and small PLC expansion modules. The 40MHz HCS08 core computes simple closed-loop tasks at 1ms rates, while the integrated ADC samples analog sensors at 10kHz aggregate bandwidth. Compared with a discrete 8051-based design, the S08SG reduces external component count and adds industrial-grade temperature margin. The 16-pin TSSOP footprint suits DIN-rail mounted modules where PCB area is constrained and the -40C to +125C range covers unheated cabinet environments.
Recommended
Low-Cost Consumer Remote Controls
The S9S08SG8E2MTG fits low-cost consumer remote-control and human-interface devices where AEC-Q100 stress margin, AEC-Q40-125C thermal range, and 16-pin TSSOP footprint are valuable for indoor/outdoor product reliability. The S08 core handles button scanning, IR or RF transmission, and battery-voltage monitoring, while the wide 2.7-5.5V supply supports direct 3V coin-cell or 4.5V battery-pack operation. Compared with a bare CGE/MCU approach, the integrated ADC simplifies battery-voltage measurement without an external supervisor. The 8KB flash fits IR protocol tables plus a small UI state machine, while the 40MHz CPU keeps button latency below 50ms - a perceptual threshold for human-interface responsiveness.
Recommended
Recommended Products Summary
Engineering reference data for S9S08SG8E2MTG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | S9S08SG4E2CTJ | S9S08SG16E1MTGR | MC9S08SH8MTG | MC9S08AW8MFGE | S9S08DN32AMLC |
|---|---|---|---|---|---|---|
| Package | 16-pin TSSOP (MTG) | 16-pin TSSOP - same | 16-pin TSSOP - same | 16-pin TSSOP - same | 16-pin TSSOP - same | 16-pin TSSOP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | S08 (HCS08) | S08 (HCS08) | S08 (HCS08) | S08 (HCS08) | S08 (HCS08) | S08 (HCS08) |
| Flash Memory | 8 KB | 4 KB (-50%) | 16 KB (+100%) | 8 KB (same) | 8 KB (same) | 32 KB (+300%) |
| Max CPU Frequency | 40 MHz | 40 MHz (same) | 40 MHz (same) | 40 MHz (same) | 40 MHz (same) | 40 MHz (same) |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| LIN/SCI Support | Yes | Yes | Yes | Yes | Yes | Yes |
| AEC-Q100 Qualified | Yes | Yes | Yes | No | Yes | Yes |
Key Differentiators
- AEC-Q100 qualification with -40C to +125C operating range (vs MC9S08SH8MTG)
- Integrated LIN slave hardware (vs MC9S08AW8MFGE)
- 16-pin TSSOP footprint with 12 GPIO (vs S9S08SG8E2MSC)
Design Notes
The S9S08SG8E2MTG must see VDD within 2.7V to 5.5V at all times; add a 100nF ceramic decoupling capacitor as close as possible to pin 1 and a bulk 4.7uF tantalum or 10uF ceramic on the supply rail. For automotive 12V battery applications, use a 5V LDO such as the NCP1117 to pre-regulate; the S08 core draws only a few mA active, simplifying thermal design. The RESET pin (pin 3) should be pulled up via 10kohm and decoupled with 100nF if exposed to long cables or noisy harnesses.
Do not exceed the absolute maximum ratings of 6V on VDD or -0.3V on any signal pin. The 8KB flash region must be programmed via the BGND/MS pin with the proper entry sequence; verify the BGND instruction set details in the S08SG reference manual before laying out programming headers. AEC-Q100 production builds require NXP's full PPAP package - do not substitute non-AEC-Q100 stock into automotive designs without re-qualifying your ECU module.
Route the BKGD/MS line as a short, noise-isolated trace away from switching converters and PWM outputs. Place a 4.7kohm pull-up on RESET per the S08SG datasheet; omit pull-ups only on carefully-debugged boards. The 16-pin TSSOP has 0.65mm pitch - keep solder mask slivers consistent with IPC-7351 nominal land patterns to avoid tombstoning during reflow. Keep the exposed paddle (if present in the package variant) soldered to a thermal pad to ensure rated thermal performance.
Compliance Information
RoHS compliant per DigiKey product listing; AEC-Q100 qualified per Mouser/NXP listing for automotive applications. Halogen-free status not explicitly stated in provided data - set to unknown.
