MCF52277CVM160J - ColdFire V2 32-bit MPU 166MHz | NXP
부품 번호: MCF52277CVM160J ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.4 | $204.00 |
| 100 | $18.15 | $1,815.00 |
| 500 | $16.2 | $8,100.00 |
| 1,000 | $14.85 | $14,850.00 |
MCF52277CVM160J 개요
A microprocessor (MPU) is a CPU-centric system-on-chip that requires external program memory and typically more substantial external peripherals than a microcontroller. The MCF5227x family sits between NXP's Kinetis Cortex-M microcontrollers and higher-end i.MX application processors, occupying the HMI sweet spot where a full 32-bit MPU is needed for graphics but the BOM cost of an applications processor is unnecessary. Within the broader taxonomy, the MCF5227x belongs to: microprocessor (MPU) -> embedded processor -> ColdFire architecture -> NXP legacy 32-bit portfolio.
Key features include a 166.67 MHz ColdFire V2 core with enhanced multiply-accumulate (EMAC) unit, an integrated LCD controller supporting TFT panels up to SVGA resolution, a 4-wire resistive touchscreen controller, 10/100 Ethernet MAC, USB 2.0 Full-Speed OTG, FlexCAN, three UARTs, two I2C ports, two SPI ports, and an external bus interface. Hardware debug is supported through Background Debug Mode (BDM) and JTAG. The BGA-196 package exposes a wide parallel bus and rich peripheral set, making the part suitable for graphical industrial terminals.
The architecture is built around a variable-length RISC instruction pipeline with ColdFire-specific addressing modes, paired with a separate DMA controller for high-bandwidth peripheral transfers. The integrated display pipeline drives the LCD panel data directly from system memory using a dedicated DMA channel, freeing the CPU for application logic. Ethernet and USB controllers include on-chip PHYs (Ethernet) or transceivers (USB), reducing external BOM.
Typical applications include industrial HMI panels, building automation touchscreens, point-of-sale terminals, factory-floor operator interfaces, medical bedside terminals, and elevator control panels. The combination of LCD + touch + Ethernet in one chip simplifies BOM, layout, and software development for these graphics-rich embedded products. Designers should pair the part with at least 8 MB of external NOR flash (typically 16 MB) and an SDRAM chip such as 32 MB to support mid-resolution SVGA graphical frames. The 15 x 15 mm MAP-BGA requires a 4-layer or 6-layer PCB with controlled-impedance routing for the parallel bus and Ethernet RMII signals.
드롭인 대체품: MCF52277CVM160J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF52277CVM160J (동일 폼 팩터 및 풋프린트) — 차이점: Maximum Clock Frequency, Mounting Type, Package / Case, Program Memory Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF52277CVM160
✅ 드롭인✓ 재고 있음
$8.04 / 개
데이터시트 보기 →MCF52276CVM160J
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF52274CVM160J
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5372LCVM240J
✅ 드롭인✓ 재고 있음
$25.1 / 개
데이터시트 보기 →SCF5250VM120
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MCF52277CVM160J 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V2 (32-bit RISC) |
| 최대 클록 주파수 | 166.67 MHz |
| Program Memory | ROMless (external memory required) |
| Internal SRAM | 128 KB |
| Instruction/Data Cache | 8 KB configurable |
| LCD Controller | Integrated (supports TFT up to SVGA) |
| Touchscreen Controller | Integrated 4-wire resistive |
| Ethernet MAC | 10/100 Mbps with on-chip PHY |
| USB Interface | USB 2.0 Full-Speed On-The-Go |
| CAN Interface | FlexCAN |
| UART Channels | 3 |
| I2C Channels | 2 |
| SPI Channels | 2 |
| External Bus Interface | Yes (32-bit) |
| Debug Interface | BDM + JTAG |
| 패키지 | 196-ball MAP-BGA (15 x 15 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (industrial) |
| RoHS 상태 | Compliant |
| Supply Voltage (Core) | 1.5 V nominal |
| Supply Voltage (I/O) | 3.3 V nominal |
MCF52277CVM160J 196-ball map-bga (15 x 15 mm) 핀 구성 가이드
MCF52277CVM160J(196-ball map-bga (15 x 15 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCF52277CVM160J.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCF52277CVM160J 적합 용도: 7 애플리케이션s: Industrial HMI Touch Panel, Building Automation Controller, Point-of-Sale Terminal, Medical Bedside Terminal, Factory Floor Operator Interface, Elevator Control Panel, Renewable Energy Inverter HMI.
Industrial HMI Touch Panel
The MCF52277CVM160J's integrated LCD controller (up to SVGA TFT) and 4-wire resistive touchscreen controller make it purpose-built for industrial HMI touch panels. Its 166.67 MHz ColdFire V2 core with 8 KB cache drives mid-resolution graphical interfaces while the 128 KB SRAM holds frame buffers. The 10/100 Ethernet with on-chip PHY connects the panel to factory networks for SCADA/MES systems. Designers typically pair the part with 8-32 MB external SDRAM (e.g., MT48LC16M16A2) for full frame buffers; the 196-MAPBGA requires a 4-layer PCB with impedance-controlled routing.
추천
Building Automation Controller
Building automation systems (BAS) requiring local HMI favor the MCF52277CVM160J because the integrated display+touch eliminates the need for a separate graphic controller chip. The 128 KB SRAM and 8 KB cache handle real-time HVAC scheduling while 10/100 Ethernet links the panel to BACnet/Modbus networks; FlexCAN enables elevator/lift and HVAC damper networks. Industrial -40C to +85C operation suits mechanical rooms and unconditioned enclosures. The BGA-196 footprint needs a 6-layer PCB for thermal relief during continuous backlight operation.
추천
Point-of-Sale Terminal
POS terminals benefit from the MCF52277CVM160J's integrated LCD/touch, USB 2.0 FS OTG (for barcode scanners and printers), 10/100 Ethernet, and three UARTs (for cash drawer, scale, customer display). ColdFire V2's RISC simplicity supports legacy 68000 codebase migration, keeping software development costs low. The industrial temperature range accommodates kitchen-display and outdoor-window POS deployments. The 196-ball BGA footprint offers sufficient routing for parallel external flash plus SDRAM, enabling graphical menu UIs on 5-7 inch panels.
추천
Medical Bedside Terminal
The MCF52277CVM160J with industrial temperature grade and integrated LCD/touch is well-suited for medical bedside terminals where 24/7 reliability and reduced component count matter. The ColdFire V2 deterministic interrupt latency supports real-time vital-sign polling over UART/SPI, while the integrated Ethernet MAC provides hospital-network connectivity. The 196-MAPBGA footprint simplifies EMC shielding layout (typical medical device requirement). CodeWarrior and GNU GCC toolchains with IEC 61508 support expedite safety-critical firmware certification paths.
추천
Factory Floor Operator Interface
Factory floor operator interfaces (OIs) deploy the MCF52277CVM160J for its rugged LCD controller, touch integration, and EtherNet/IP capability through the on-chip 10/100 MAC. The ColdFire V2 core runs PLC interpreter logic and alarm handlers in parallel with display refresh DMA, offloading CPU cycles. Multiple UARTs and SPIs connect to legacy RS-485 motor drives and discrete I/O modules. The BGA package withstands high-vibration mounting and supports IP65 sealed front panels when paired with conformal coating.
추천
Elevator Control Panel
Elevator control panels (car operating panels and landing indicators) are typical MCF52277CVM160J deployments, integrating LCD/touch, CAN (FlexCAN), and discrete GPIO into a single BGA chip. The ColdFire V2 deterministic execution supports safety-rated floor-call debouncing and display refresh; the BGA package accommodates a 4-6 layer PCB with reinforced isolation barriers. Industrial temperature grade is critical for shaft-mounted equipment; the 8 KB cache and 128 KB SRAM handle multilingual UI strings and floor-pattern graphics comfortably.
추천
Renewable Energy Inverter HMI
Solar and wind inverter local HMIs use the MCF52277CVM160J for inverter-status display and parameter entry. The integrated LCD/touch, 10/100 Ethernet, and -40C to +85C operation suit outdoor inverter cabinet installations. ColdFire V2's deterministic real-time behavior supports Modbus TCP polling of inverter telemetry while the LCD shows real-time kW/voltage curves. The BGA package's grounding thermal pad couples to the inverter heatsink chassis for additional passive cooling.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF52277CVM160J — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF52277CVM160 | MCF52276CVM160J | MCF52274CVM160J | MCF5372LCVM240J | SCF5250VM120 |
|---|---|---|---|---|---|---|
| Package | 196-MAPBGA (15x15) | 196-MAPBGA (15x15) - same | 196-MAPBGA (15x15) - same | 196-MAPBGA (15x15) - same | 196-MAPBGA - same family | 196-MAP-BGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V3 | ColdFire V2 |
| Maximum Clock Frequency | 166.67 MHz | 166.67 MHz | 166.67 MHz | 166.67 MHz | 240 MHz | 120 MHz |
| LCD Controller | Integrated (up to SVGA TFT) | Integrated (up to SVGA TFT) | Not integrated | Not integrated | Not integrated | Not integrated |
| Touchscreen Controller | Integrated 4-wire resistive | Integrated 4-wire resistive | Not integrated | Not integrated | Not integrated | Not integrated |
| Ethernet MAC | 10/100 with on-chip PHY | 10/100 with on-chip PHY | 10/100 with on-chip PHY | 10/100 MAC only (external PHY) | 10/100 MAC only | Not integrated |
| Operating Temperature | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
주요 차별점
- Highest integration of LCD+touch+Ethernet in MCF5227x family (vs MCF52276CVM160J)
- Highest core performance in MCF5227x family at 166.67 MHz (vs MCF52274CVM160J)
- Drop-in temperature grade flexibility vs commercial-only sibling (vs MCF52277CVM160)
설계 노트
The 196-MAPBGA package dissipates roughly 0.9 W under typical HMI workloads with full LCD backlight load; thermal resistance theta_JA is approximately 25 C/W on a 4-layer JEDEC test board. Couples the package center balls to an internal ground plane and consider a bottom-side thermal pad array for fan-less outdoor enclosures; failure to do so may push junction temperature above 105 C in 50 C ambient.
Route the 32-bit external data bus with 50 ohm controlled impedance and length-match within 250 mil across byte lanes to avoid SDRAM timing violations. Place the SDRAM chip within 1.5 inches of the BGA to minimize skew; use 4-6 layer stackup with continuous reference planes under the bus. Decouple each VDD/VSS pair with one 100 nF X7R plus one 10 uF tantalum or polymer cap.
Do not omit the external reset supervisor (e.g., MAX811) - the internal ColdFire POR is sensitive to slow VDD ramp; add a 32.768 kHz watch crystal if using RTC mode. Configure the LCD controller pin mux carefully because some display data lines share pins with FlexCAN - misconfiguration silently disables the CAN interface. Always validate boot loader location against the external flash CS0 setup in chip configuration module registers.
규정 준수 정보
RoHS and lead-free per NXP product page. REACH and halogen-free status not stated in verified data; consult XAIPART internal database for declarations. Not AEC-Q100 qualified (industrial grade only).
