MCF5251CVM140 vs MCF5253CVM140 Vergleich

Detaillierter Direktvergleich von MCF5251CVM140 von NXP Semiconductors und MCF5253CVM140 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF5251CVM140 MCF5251CVM140 - ColdFire V2 140MHz MPU, USB-OTG, 225-MAPBGA | NXP

MCF5251CVM140 - ColdFire V2 140MHz MPU, USB-OTG, 225-MAPBGA | NXP

MCF5251CVM140 ⚠ Letzte Bestellmöglichkeit
NXP Semiconductors
MCF5253CVM140 MCF5253CVM140 - ColdFire V2 32-bit 140MHz MCU | NXP

MCF5253CVM140 - ColdFire V2 32-bit 140MHz MCU | NXP

MCF5253CVM140 ✗ Abgekündigt

Spezifikationsvergleich

Parameter MCF5251CVM140 MCF5253CVM140
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Letzte Kaufgelegenheit Ende des Lebenszyklus
Lagerstatus In Stock In Stock
Stückpreis (USD) $18,20 $27,40
Core Architecture ColdFire V2 (32-bit) —
Maximum Core Frequency 140 MHz —
Core Type 32-Bit MPU —
Program Memory Type ROMless (external flash required) ROMless (external memory)
Gehäuse 225-MAPBGA (13x13 mm, also described as 225-LFBGA) —
Operating Voltage [DATA_NEEDED: core/IO voltage range] —
USB Interface USB-OTG with integrated PHY (Host + Function) —
Enhanced MAC (eMAC) Yes - hardware multiply-accumulator —
Real-Time Clock Yes - tamper-proof RTC —
Ethernet 10/100 MAC (on selected family members) —
External Bus Interface 32-bit with SDRAM controller and chip-select logic —
Betriebstemperaturbereich -40C to +85C (industrial, inferred from CVM suffix) —
Montageart Surface Mount (BGA) Surface Mount
MSL-Level [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
RoHS-Status [DATA_NEEDED: confirm RoHS declaration] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: confirm lead-free] —
Core Processor — ColdFire V2 (MCF525x)
Core Size — 32-Bit
Speed — 140 MHz
RAM Size — 128K x 8
Oscillator Type — External
Connectivity — USB-OTG
Peripherals — eMAC, tamper-proof RTC, USB-OTG
Versorgungsspannung — 3.3 V
Gehäuse / Bauform — 225-LFBGA (225-MAPBGA, 13x13 mm)
Architecture — RISC, enhanced multiplier-accumulator (eMAC)
Application Target — Consumer / Industrial (audio decode, file management, system control)
Supplier Device Package — 225-MAPBGA
Lebenszyklusstatus — End of Life (per NXP product page)
Betriebstemperatur — [DATA_NEEDED: operating temperature range]

Datenblätter & Ressourcen

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