MCF5251CVM140 vs MCF5253CVM140 Vergleich
Detaillierter Direktvergleich von MCF5251CVM140 von NXP Semiconductors und MCF5253CVM140 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCF5251CVM140 - ColdFire V2 140MHz MPU, USB-OTG, 225-MAPBGA | NXP
MCF5251CVM140 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MCF5251CVM140 | MCF5253CVM140 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,20 | $27,40 |
| Core Architecture | ColdFire V2 (32-bit) | — |
| Maximum Core Frequency | 140 MHz | — |
| Core Type | 32-Bit MPU | — |
| Program Memory Type | ROMless (external flash required) | ROMless (external memory) |
| Gehäuse | 225-MAPBGA (13x13 mm, also described as 225-LFBGA) | — |
| Operating Voltage | [DATA_NEEDED: core/IO voltage range] | — |
| USB Interface | USB-OTG with integrated PHY (Host + Function) | — |
| Enhanced MAC (eMAC) | Yes - hardware multiply-accumulator | — |
| Real-Time Clock | Yes - tamper-proof RTC | — |
| Ethernet | 10/100 MAC (on selected family members) | — |
| External Bus Interface | 32-bit with SDRAM controller and chip-select logic | — |
| Betriebstemperaturbereich | -40C to +85C (industrial, inferred from CVM suffix) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| RoHS-Status | [DATA_NEEDED: confirm RoHS declaration] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: confirm lead-free] | — |
| Core Processor | — | ColdFire V2 (MCF525x) |
| Core Size | — | 32-Bit |
| Speed | — | 140 MHz |
| RAM Size | — | 128K x 8 |
| Oscillator Type | — | External |
| Connectivity | — | USB-OTG |
| Peripherals | — | eMAC, tamper-proof RTC, USB-OTG |
| Versorgungsspannung | — | 3.3 V |
| Gehäuse / Bauform | — | 225-LFBGA (225-MAPBGA, 13x13 mm) |
| Architecture | — | RISC, enhanced multiplier-accumulator (eMAC) |
| Application Target | — | Consumer / Industrial (audio decode, file management, system control) |
| Supplier Device Package | — | 225-MAPBGA |
| Lebenszyklusstatus | — | End of Life (per NXP product page) |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |