NXP Semiconductors

MCF5274CVM166 - 166MHz 32-Bit ROMless MPU | NXP | BGA

MPN: MCF5274CVM166 ✗ End of Life
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2.5 V / 3.3 V Vdss 256-map BGA, 17 mm x 17 mm Package 166 MHz Speed ROMless Memory
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Price updated: 2026-10-20
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MCF5274CVM166 Overview

The NXP Semiconductors MCF5274CVM166 is a 166 MHz, 32-bit, ROMless ColdFire V2 integrated microprocessor supplied in a 256-map BGA package measuring 17 mm by 17 mm. Its key verified characteristics are the 166 MHz operating frequency, 32-bit RISC processing, external memory rather than embedded program memory, and surface-mount MAPBGA construction. The device is positioned for control-intensive embedded systems that need substantial processing capability, networking-oriented peripherals, and external program or data storage.

A microprocessor is a programmable control component that executes instructions and coordinates memory, communication, and peripheral functions. In the broader semiconductor hierarchy, this device belongs to embedded processors, then 32-bit RISC processors, then integrated microprocessors and system-on-chip devices. Its ROMless architecture separates the processor from embedded program memory, allowing system designers to select external storage according to firmware size, boot requirements, update strategy, and product configuration.

The verified product listing identifies a ColdFire V2 core, 166 MHz clocking, and a 256-map BGA package. Search results also associate the device with connection, protection, and peripheral choices intended for cost-sensitive, power-conscious applications requiring significant control processing for file management, connectivity, data buffering, and user-interface functions. Because the excerpted data does not provide the complete peripheral list, core dimensions, memory interface details, or electrical timing tables, those values should be confirmed in the manufacturer hardware specification before schematic capture.

This processor is relevant to industrial control equipment, embedded network controllers, file-management systems, data buffers, and human-machine interfaces. Its 166 MHz rating favors workloads that need more control headroom than lower-clock ColdFire implementations, while ROMless operation permits storage to be scaled independently. The tradeoff is board complexity: external memory and a large fine-pitch BGA require careful routing, decoupling, assembly capability, and firmware verification.

For new or replacement hardware, use a 256-map BGA-specific footprint and follow the manufacturer’s pin, voltage, clock, memory-interface, and decoupling guidance. Do not infer compatibility from the 166 MHz suffix alone. Confirm the complete ordering code, package drawing, exposed-pad requirements, operating-temperature grade, and board revision before release to production.

This page combines verified manufacturer and distributor identity data with package, lifecycle, sourcing, and design guidance. It also distinguishes documented facts from missing electrical details and avoids presenting unverified alternatives as drop-in replacements.

Drop-in alternatives for MCF5274CVM166 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MCF5274CVM166 (same form factor and footprint) — differing in Mounting Type, Operating Temperature, Package, Program Memory Type.

NXP Semiconductors
Mounting Type: Surface Mount (BGA)
Operating Temperature: -40C to +85C (industrial)
Package: 256-MAPBGA (17x17 mm)
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MCF5274CVM166 Maximum Ratings & Electrical Characteristics

Product Type 32-bit ROMless integrated microprocessor
Processor Core ColdFire V2
Maximum Clock Frequency 166 MHz
Instruction Width 32 bit
Program Memory Type ROMless
External Oscillator External
Package 256-map BGA, 17 mm x 17 mm
Mounting Type Surface mount
Nominal I/O Supply Voltage 2.5 V / 3.3 V
Core Supply Range in Cross-Reference Result 1.4 V to 1.6 V
Operating Temperature -40°C to 85°C
RAM Organization Reported by Third-Party Listing 64K x 8

MCF5274CVM166 256-map bga, 17 mm x 17 mm Pin Configuration Guide

Pin configuration for MCF5274CVM166 (256-map bga, 17 mm x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-map bga, 17 mm x 17 mm package pinout diagram for MCF5274CVM166

No detailed pinout data available for MCF5274CVM166.

Refer to the datasheet for full pin configuration.

Typical Applications

MCF5274CVM166 is suitable for 6 applications: Industrial Embedded Control, Connectivity Controller, Data Buffer and File Management, Human-Machine Interface Controller, Data Acquisition Gateway, Cost-Sensitive Embedded Platform.

🏭

Industrial Embedded Control

MCF5274CVM166 fits an existing industrial controller that needs a 166 MHz, 32-bit ColdFire V2 processor for coordinated control tasks, connectivity handling, and local data management. Its ROMless configuration allows program memory to be selected separately from the processor, supporting controlled boot code, field updates, or code partitioning. The important qualification is lifecycle status: NXP lists the part as NRND, so a new machine platform should include an approved migration plan. Board bring-up must follow the official 256-map BGA layout, power sequencing, external memory, and decoupling requirements.

🌐

Connectivity Controller

The MCF5274CVM166 can serve as the control processor in an embedded connectivity appliance where protocol handling, buffering, and real-time management need more processing headroom than a low-rate 8- or 16-bit controller. The verified 166 MHz, 32-bit ColdFire V2 architecture is relevant to gateways or embedded network equipment, while ROMless operation permits external storage sized to firmware and recovery requirements. Exact MAC, PHY, serial-interface, protocol, and electrical specifications are not present in the supplied excerpts and must be checked before assigning network ports.

🖥️

Data Buffer and File Management

MCF5274CVM166 is applicable to systems that move or organize data between local storage and external interfaces, because NXP identifies file management, data buffering, and user-interface processing as target workloads. The 32-bit ColdFire V2 core operates at 166 MHz, while ROMless construction leaves program-memory implementation flexible. For a design, confirm the required external-memory width, timing, protocol engines, DMA behavior, cache implications, and boot topology in the manufacturer hardware specification; those details are not fully visible in the verified search results.

📺

Human-Machine Interface Controller

The processor’s 166 MHz 32-bit architecture is suitable for coordinating display, input, storage, and communications in an embedded HMI. A ColdFire V2 system can divide control tasks from user-interface updates without relying on a separate host processor, while ROMless operation enables storage choices that match firmware size. Actual suitability depends on display-interface availability, external memory, graphics requirements, and latency; these parameters are absent from the verified excerpts and should not be inferred from processor frequency alone.

📡

Data Acquisition Gateway

MCF5274CVM166 can coordinate acquisition, local buffering, and upstream communication in a gateway whose firmware is already qualified around the ColdFire platform. Its 166 MHz 32-bit core provides processing capacity for protocol conversion and data organization, and ROMless operation makes external program storage possible. Engineers must still verify analog interfaces, ADC resources, timer availability, memory interfaces, and I/O voltage tolerances from the full hardware document. For new safety- or longevity-sensitive programs, compare a current processor because this MPN is NRND.

⚙️

Cost-Sensitive Embedded Platform

MCF5274CVM166 matches legacy cost-sensitive platforms that already depend on its ColdFire V2 software ecosystem, external-memory architecture, and 256-map BGA assembly process. Its 166 MHz clock offers useful control-processing margin without requiring embedded ROM, allowing the same processor family to serve multiple product variants with different memory configurations. The engineering compromise is long-term risk: the device is NRND, and the verified data does not provide a modern security inventory or lifecycle roadmap. Production teams should document obsolescence monitoring and a tested migration path.

What is the MCF5274CVM166?
The MCF5274CVM166 is a NXP Semiconductors 166 MHz, 32-bit, ROMless ColdFire V2 integrated microprocessor in a 256-map BGA package. According to the NXP product page, it targets cost-sensitive, power-conscious systems requiring significant control processing for file management, connectivity, data buffering, and user-interface functions. Its processor architecture, external oscillator arrangement, and ROMless configuration make it an embedded system component rather than a general-purpose desktop processor.
What are the key specifications of MCF5274CVM166 that engineers should know?
The documented headline specifications are a 166 MHz maximum clock, a 32-bit ColdFire V2 core, ROMless operation, an external oscillator, and a 256-map BGA package measuring 17 mm by 17 mm. These values come from the verified NXP and DigiKey product records. A third-party cross-reference result additionally reports a 1.4 V to 1.6 V core-supply range, 2.5 V or 3.3 V nominal I/O supply, 64K x 8 RAM organization, and a -40°C to 85°C operating range.
Where can I download the MCF5274CVM166 datasheet?
The official starting point for the MCF5274CVM166 datasheet is the NXP product page at https://www.nxp.com/part/MCF5274CVM166. The verified search results also identify an MCF5275 hardware specification through a third-party document index. For design release, use the NXP document link because archived copies may not include the latest product-change notices, package drawings, errata, or lifecycle information.
What is the lifecycle status of MCF5274CVM166?
The official NXP product page identifies MCF5274CVM166 as NRND, meaning not recommended for new designs. Existing supported production may still be available, but engineers should use the manufacturer’s product-change and purchasing guidance before committing a new design. The verified distributor pages provide sourcing information, while the NXP page remains the controlling source for lifecycle notices and migration recommendations.
Where can I buy MCF5274CVM166 online?
MCF5274CVM166 can be queried through NXP, DigiKey, Mouser, Newark, Heisener, and other listings in the verified data. The NXP page is appropriate for lifecycle and product notices, while authorized distributors provide quotation, inventory, and fulfillment options. The verified Heisener listing reports 4,416 pieces in stock at a reference price of $51.2009 per unit, but that stock and price require confirmation before purchase.
What is the price of MCF5274CVM166?
The only exact unit price in the verified data is $51.2009 from Heisener, shown as reference pricing rather than a guaranteed XAIPART offer. The same listing states that 4,416 pieces were in stock, but inventory and pricing can change without notice. Use that figure as an as-of 2026-10-20 market reference and request a current quotation before procurement.
What is the lead time for MCF5274CVM166?
The verified Heisener result states that the part can ship immediately and showed an estimated delivery window of July 14 through July 19, but that dated window is not reliable for a purchase made on 2026-10-20. Because the part is NRND and distributor inventory changes, current lead time must be obtained from NXP or an authorized distributor rather than inferred from the cached search excerpt.
Is MCF5274CVM166 in stock?
A verified Heisener search result reported 4,416 pieces in stock, while the DigiKey page uses a ship-today promotional phrase. Neither result establishes current stock as of the page-generation date because inventory changes rapidly. For an NRND processor, confirm the physical inventory, date code, lot traceability, and authorized source before treating the component as available for a new build.
What package does MCF5274CVM166 use?
MCF5274CVM166 uses a 256-map BGA package measuring 17 mm by 17 mm. DigiKey identifies it as a 256-MAPBGA, and a distributor search result describes surface-mount tray packaging. Because this is a large fine-pitch BGA rather than a leaded package, PCB design must follow the official land pattern, via arrangement, solder-mask, paste, and assembly requirements.
Can MCF5274CVM166 operate from 2.5 V and 3.3 V?
The verified distributor search results describe MCF5274CVM166 as a device for 2.5 V and 3.3 V operation, while a third-party cross-reference result reports a 1.4 V to 1.6 V core-supply range. These figures suggest separate core and I/O supply domains, but the exact power rails, sequencing, tolerance, and current limits are not supplied in the verified excerpts. Consult the official hardware specification before designing the power tree.
What is MCF5274CVM166 used for?
MCF5274CVM166 is suited to embedded systems needing substantial control processing for file management, connectivity, data buffering, and user-interface functions. Its 166 MHz ColdFire V2 processor provides more clock headroom than lower-rate implementations, while ROMless operation allows external program storage to match the product’s boot and update requirements. NXP specifically describes the family as useful for cost-sensitive, power-conscious designs.
MCF5274CVM166 vs MCF5272VM66J: which is better?
MCF5274CVM166 and MCF5272VM66J cannot be treated as verified drop-in equivalents from the supplied data. MCF5274CVM166 is documented as a 166 MHz ROMless device in a 256-map BGA, while MCF5272VM66J appears in the Site MPN list without verified package, memory, voltage, or pin-compatibility details. Choose MCF5274CVM166 for an existing design qualified to that exact part; do not substitute MCF5272VM66J without complete manufacturer documentation and board-level verification.
MCF5274CVM166 vs MCF5474ZP266: which processor fits?
MCF5274CVM166 and MCF5474ZP266 are not verified as interchangeable, and the supplied data does not establish a shared pinout, package, clock, memory interface, or peripheral set. MCF5274CVM166 is specifically documented as a 166 MHz ROMless ColdFire V2 processor in 256-map BGA. Select MCF5474ZP266 only after its official documentation proves the required performance, memory, connectivity, package, and software requirements are met.
When should I choose MCF5274CVM166 over another ColdFire processor?
Choose MCF5274CVM166 when an existing qualified design specifically uses the 166 MHz ROMless ColdFire V2 device and its 256-map BGA implementation. Prefer a current processor for new development unless software, certification, or supply-chain continuity strongly favors retaining the platform. The NRND status means the main reasons to select it are migration cost, existing firmware reuse, or approved continuation rather than access to the newest silicon.
Is MCF5274CVM166 suitable for a new embedded-control design?
MCF5274CVM166 can support a new embedded-control design technically, but it is not the default recommendation because NXP marks it NRND. Its 166 MHz ColdFire V2 core and ROMless architecture suit control, connectivity, buffering, file-management, and user-interface workloads. New projects should compare current NXP processors and verify long-term availability, toolchain support, software security, package assembly, and migration cost before committing.
What can replace MCF5274CVM166?
No verified drop-in replacement was found in the supplied cross-reference data, so MCF5274CVM166 should be sourced as the exact ordered part or treated as a redesign task. The search results contain generic cross-reference tools and comparison pages, but no candidate is proven to share the 256-map BGA footprint, pin functions, clock requirements, memory interface, voltage domains, peripheral set, and firmware behavior. Validate any proposed replacement against the official hardware specification and production software.
Where do I find the MCF5274CVM166 pinout and BGA layout?
The pin assignments and recommended 256-map BGA land pattern must be taken from the NXP MCF5274CVM166 product documentation and MCF5275 family hardware specification; they are not included in the verified excerpts. Do not derive the layout by scaling another 256-ball device or by using the shorter pinout names returned by third-party catalog pages. Confirm every ball assignment, power domain, test point, and package drawing against the controlled manufacturer document.

Engineering reference data for MCF5274CVM166 — comparison, design guidance, and compliance information.

Selection Guide

Select MCF5274CVM166 when maintaining an existing 166 MHz ColdFire V2 design offers a lower-risk path than redesign and the assembly process is already qualified for its 256-map BGA. Its ROMless architecture is useful when external program and data memory must be sized independently, and NXP identifies connectivity, buffering, file management, and user-interface workloads as suitable. For new designs, start with current processors because the MPN is NRND. MCF5272VM66J and MCF5474ZP266 are not verified drop-in alternatives because their packages, pinouts, voltage systems, memory interfaces, and peripherals are not established by the supplied data. Treat them only as redesign candidates requiring full datasheet, firmware, and board verification.

Key Differentiators

  • Exact 166 MHz verified operating point (vs MCF5272VM66J)
  • Documented 256-map BGA package (vs MCF5474ZP266)
  • ROMless flexibility for external program storage (vs MCF51AC256BVLKE)

Design Notes

Do not design the supply rails from catalog snippets alone. The verified results mention 2.5 V and 3.3 V I/O operation plus a third-party report of a 1.4 V to 1.6 V core range, implying separate power considerations. Confirm nominal voltage, tolerance, startup sequence, current limits, and decoupling directly from the NXP hardware specification before schematic release.

The 256-map BGA requires an exact manufacturer land pattern, via configuration, solder-mask definition, and paste stencil. Preserve the documented ball numbering orientation and provide unobstructed inspection and X-ray access. Because the verified excerpts do not include the pinout, do not create a board footprint by copying a generic 256-ball library symbol.

ROMless does not mean memory optional; the design still needs boot and application storage through the verified external-memory architecture. Review bus timing, reset behavior, clock source requirements, and firmware image layout in the family hardware specification. Also treat the 166 MHz rating as a maximum operating point and validate power, signal integrity, and temperature across the complete clock range.

The supplied data does not provide power dissipation, junction temperature, or package thermal resistance, so a defensible thermal estimate cannot be calculated. For production hardware, measure or model worst-case core and I/O activity using the manufacturer power data, account for ambient temperature and board copper, and define a thermal-control and derating strategy appropriate to the final enclosure.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

The verified excerpts do not provide formal RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. No compliance claim should be inferred from the distributor listing.

Related Searches

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Related Components & Terms

NXP Semiconductors MCF5274CVM166 MCF527x ColdFire V2 32-bit RISC processor integrated microprocessor embedded processor system-on-chip ROMless architecture 166 MHz 256-map BGA 17 mm by 17 mm package surface-mount device external memory file management connectivity data buffering human-machine interface MCF5272VM66J MCF5474ZP266 NRND lifecycle status industrial control data acquisition embedded networking
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