MK26FN2M0VMI18 - 180MHz Cortex-M4F 2MB MCU | NXP
Teilenummer: MK26FN2M0VMI18 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $31.554 | $31,55 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MK26FN2M0VMI18 Übersicht
A microcontroller is a programmable semiconductor system containing a processor core, memory, and integrated peripherals. Arm Cortex-M4F devices add DSP instructions and single-precision floating-point hardware to the Cortex-M architecture. The MK26 family therefore belongs to the hierarchy microcontroller, embedded processor, processor IC, and integrated circuit, serving as the central control element for connected industrial equipment.
Verified device information highlights up to 180 MHz core operation, 2 MB of nonvolatile flash, and 256 KB of SRAM. The part integrates high-speed and full-speed USB physical layers, smart peripherals that retain operation in Stop modes, and enhanced security intended for industrial use. These features support complex control loops, local data processing, human-interface connectivity, and firmware-intensive applications.
The 169-MAPBGA package offers high I/O density but requires careful PCB layout, escape routing, assembly capability, and thermal validation. Because the verified sources do not provide the complete pin mapping, electrical limits, or detailed USB transceiver characteristics, those values are not inferred here. Designers should use the official NXP documentation for pin assignments, decoupling, clocking, and PCB land-pattern requirements.
Typical applications include industrial human-machine interfaces, USB-connected data loggers, factory equipment controllers, connected sensors, and embedded gateways. Its processing headroom and memory capacity make it suitable where concurrent control, communications, data buffering, and secure firmware handling are required. The dual USB architecture can support high-speed device communication alongside full-speed connectivity, subject to the device-specific implementation.
A critical design consideration is package-level routing: the 169-MAPBGA requires advanced assembly and multilayer PCB capability, so pin escape, power integrity, and USB signal routing should be reviewed before layout begins. Verify the exact NXP pinout and reference design because the supplied web results do not expose a complete ball assignment.
This page consolidates verified NXP and distributor information, practical package guidance, and clearly marked data gaps. It intentionally avoids invented pin names, electrical limits, lifecycle claims, or substitute specifications that cannot be established from the supplied evidence.
Drop-in-Alternativen für MK26FN2M0VMI18 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MK26FN2M0VMI18 (gleiche Bauform und Footprint) – abweichend in Package, SRAM, Mounting Type, ADC, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MK26FN2M0VMD18
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK22FX512AVMC12
✅ Drop-In✓ Auf Lager
$14.45 / Stück
Datenblatt ansehen →MK20DX256VLH7
✅ Drop-In✓ Auf Lager
$7.42 / Stück
Datenblatt ansehen →MK26FN2M0VMI18 Grenzwerte & elektrische Eigenschaften
| Product Type | 32-bit ARM Cortex-M4F Microcontroller |
| Manufacturer | NXP Semiconductors |
| Core | ARM Cortex-M4F |
| Maximum Core Frequency | 180 MHz |
| Program Flash Memory | 2 MB |
| Flash Organization | 2M x 8 |
| SRAM | 256 KB |
| DSP Instructions | Supported |
| Floating-Point Unit | Single precision |
| USB Connectivity | Dual USB: Full-speed plus high-speed |
| USB Physical Transceiver | High-speed USB physical transceiver integrated |
| Low-Power Feature | Peripherals with operation in Stop modes |
| Security Positioning | Enhanced security for industrial applications |
| Gehäuse | 169-MAPBGA (9 x 9 mm) |
| Pin-Anzahl | 169 balls |
| Montageart | Surface Mount |
| Lebenszyklusstatus | Active |
MK26FN2M0VMI18 169-mapbga (9 x 9 mm) Pinbelegungsleitfaden
Pinbelegung für MK26FN2M0VMI18 (169-mapbga (9 x 9 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MK26FN2M0VMI18.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MK26FN2M0VMI18 ist geeignet für 8 Anwendungs: Industrial Human-Machine Interface, USB Connected Data Logger, Factory Equipment Controller, Connected Sensor Gateway, Embedded Security Gateway, Low-Power Connected Sensor Node, USB Test and Measurement Instrument, Connected Motor and Motion Control.
Industrial Human-Machine Interface
The MK26FN2M0VMI18 fits industrial HMI controllers that combine graphical or touch input, local logic, and USB peripheral connectivity. Its up-to-180 MHz Cortex-M4F core provides instruction throughput for user-interface updates, while 2 MB flash supports a larger embedded application and 256 KB SRAM supports working buffers. The 169-MAPBGA also offers high I/O density for display, touch, communications, and storage interfaces. Design validation must account for the fine-pitch package, multilayer escape routing, and the exact USB and display pin assignments from the NXP documentation.
Empfohlen
USB Connected Data Logger
The MK26FN2M0VMI18 is suitable for a USB-connected industrial data logger that samples local sensors and transfers records to a host or gateway. Its dual USB capability can support full-speed and high-speed connectivity, while the Cortex-M4F core can handle filtering and buffering beyond basic acquisition. The 2 MB flash and 256 KB SRAM provide room for firmware, configuration, and transient data. Confirm PHY layout, connector protection, power sequencing, and host compatibility using the NXP reference design before release.
Empfohlen
Factory Equipment Controller
Use the MK26FN2M0VMI18 as the central controller in factory equipment when the design needs real-time control plus multiple communications functions. Its 180 MHz Cortex-M4F performance supports DSP instructions and single-precision floating-point calculations, useful for motor, motion, or signal-processing tasks. The large 2 MB flash and 256 KB SRAM reduce dependence on external memory for moderately complex firmware. The MCU is not qualified solely by its core frequency, however: industrial temperature, EMC, functional safety, isolation, and long-term supply requirements must be checked separately.
Empfohlen
Connected Sensor Gateway
The MK26FN2M0VMI18 can act as a connected sensor gateway when multiple local sensors feed a central controller that must also communicate over USB. Its 256 KB SRAM supports buffering and protocol state, and the 2 MB flash accommodates firmware, data structures, and security-related code. The Cortex-M4F core allows efficient fixed-point or floating-point processing before transmission. A practical design should isolate analog front ends from the BGA digital region, validate USB impedance and return paths, and confirm the exact peripheral multiplexing before schematic capture.
Empfohlen
Embedded Security Gateway
The MK26FN2M0VMI18's enhanced security positioning for industrial applications makes it a candidate for embedded gateways, access-control equipment, and authenticated data-transfer products. The Cortex-M4F core can run protocol stacks and security workloads, while 2 MB flash and 256 KB SRAM provide application headroom. Verify the exact hardware cryptographic features, secure-boot behavior, key-storage options, and certification requirements in the NXP datasheet; the supplied evidence establishes enhanced security positioning but does not expose a complete cryptographic feature list.
Empfohlen
Low-Power Connected Sensor Node
The MK26FN2M0VMI18 can support connected sensor nodes that periodically process local measurements and communicate over USB when a high-performance mode is needed. Verified device information highlights smarter peripherals with operation in Stop modes, which can help systems balance responsiveness and power consumption. The exact Stop-mode current, wake-up time, and peripheral retention behavior were not provided and must be confirmed from the official NXP documentation. Low-power validation should include sensor standby timing, USB suspend behavior, brownout conditions, and battery or supply regulation.
Empfohlen
USB Test and Measurement Instrument
The MK26FN2M0VMI18 is suitable for compact test and measurement equipment that needs high processing speed, data buffering, and host connectivity. Its 180 MHz Cortex-M4F core can process acquisition data, execute DSP-oriented routines, and manage USB transfers, while 2 MB flash supports application firmware and 256 KB SRAM supports temporary buffers. The dual USB description may simplify connecting both high-speed and full-speed peripherals. Validate analog isolation, measurement accuracy, clock stability, USB compliance, and thermal performance independently of the MCU marketing specifications.
Empfohlen
Connected Motor and Motion Control
The MK26FN2M0VMI18 can serve as a high-performance motion-control front end when a design needs more processing headroom and memory than a small general-purpose MCU provides. The Cortex-M4F DSP and floating-point capabilities are relevant to filtering, control-loop computation, and sensor fusion, while 256 KB SRAM can hold control state and data buffers. Use an external motor driver and power stage rather than driving motors directly from the MCU. The 169-MAPBGA package requires careful high-speed layout and thermal design around the power and signal pins.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MK26FN2M0VMI18 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MK26FN2M0VMD18 | MK22FX512AVMC12 | MK20DX256VLH7 | MIMXRT1064DVL6A | MCIMX6Y1CVK05AB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Product Type | 32-bit Cortex-M4F MCU | Cortex-M4 MCU | Kinetis Cortex-M4 MCU | Kinetis Cortex-M4 MCU | Cortex-M4 MCU | Cortex-A9 application processor |
| Package | 169-MAPBGA (9 x 9 mm) | 169-MAPBGA (family/package value requires verification) | 169-MAPBGA (package value requires verification) | 169-MAPBGA (package value requires verification) | LQFP-144 | BGA-291 |
Wichtigste Unterscheidungsmerkmale
- Higher verified memory capacity than the compared Kinetis MK20 and MK22 references (vs. MK20DX256VLH7)
- Higher verified flash capacity than the MK22 reference (vs. MK22FX512AVMC12)
- Higher core frequency than the verified K6 comparison part (vs. MIMXRT1064DVL6A)
- Dual USB positioning supports both full-speed and high-speed connectivity (vs. MIMXRT1064DVL6A)
- High-density 169-MAPBGA integration (vs. MIMXRT1064DVL6A)
Designhinweise
The 169-MAPBGA package requires multilayer escape routing and fine-pitch assembly planning. Keep power, ground, clock, USB, and high-speed signal paths within the manufacturer-recommended layout topology. Because the supplied sources do not provide the official ball map or land pattern, do not start production routing from inferred pin assignments; obtain the current NXP package drawing and reference design first.
Validate the complete power tree before schematic release. The verified material confirms a 180 MHz Cortex-M4F MCU with high-speed USB, but it does not provide the exact core, I/O, analog, USB, or total supply-current limits. Use the official datasheet for regulator headroom, sequencing, decoupling values, and power-gating requirements. Separate sensitive analog and USB supplies where the reference circuit calls for it.
USB signal integrity depends on correct differential routing, controlled impedance, continuous return paths, and compliant connector and protection implementation. The MK26FN2M0VMI18 includes high-speed USB physical-layer capability, so layout errors can affect enumeration and data reliability. Follow the NXP USB layout guidance, verify trace geometry against the board stack-up, and test with a compliant USB analyzer during hardware bring-up.
Do not estimate the MK26FN2M0VMI18 thermal limit from core frequency alone. Actual junction temperature depends on supply voltage, clock utilization, I/O activity, package construction, PCB copper, ambient temperature, and airflow. Use the manufacturer thermal characterization data when available and measure operating temperature in the final enclosure, especially for sustained 180 MHz operation in a small industrial enclosure.
Avoid treating a related Kinetis MPN as automatically interchangeable. Peripheral muxing, USB routing, boot configuration, memory organization, temperature grade, security features, and firmware startup behavior can differ even when the core family and flash capacity match. For any substitution, compare the official pin table, errata, reference design, and device initialization code before approving the change.
Compliance-Informationen
The supplied verified sources do not explicitly provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations for MK26FN2M0VMI18. Compliance must be confirmed using the current NXP product documentation and supplier certificates.
