MPC8313EVRAGDC - PowerQUICC II Pro SoC 400MHz | NXP
Teilenummer: MPC8313EVRAGDC ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $53.52 | $53,52 |
| 10 | $49.1 | $491,00 |
| 100 | $42.85 | $4.285,00 |
| 500 | $37 | $18.500,00 |
| 1.000 | $31.5 | $31.500,00 |
MPC8313EVRAGDC Übersicht
A PowerQUICC SoC is a family of integrated communications processors from NXP (formerly Freescale) that combine one or more Power Architecture processor cores with networking and I/O peripherals, deriving from the classic PowerQUICC II Pro product line. The MPC8313E sits in the lower-power, lower-cost tier of that family, optimized for entry-level networking, residential gateways, and industrial control applications where deterministic Ethernet throughput and a small footprint matter more than multi-gigabit switching fabric.
Key features include the 32-bit e300c4 processor core, a 32-bit DDR1/DDR2 memory controller with ECC support, dual GMII/TBI/RGMII Gigabit Ethernet interfaces, two USB 2.0 ports (host/device/OTG), a 32-bit/66 MHz PCI controller, an integrated security engine (SEC 3.x) for DES/3DES/AES/SHA/RSA acceleration, and 16 KB I-cache plus 16 KB D-cache. The device supports JTAG debug and COP for in-system emulation, and exposes flexible interrupt routing via the SIU.
Architecturally, the MPC8313E uses a 90 nm CMOS process and an internal SoC platform bus with dedicated DMA channels to offload packet processing from the e300 core. The SEC coprocessor executes cryptographic operations independently, freeing the host CPU for control-plane tasks. The result is a highly-integrated single-chip solution that replaces discrete CPU + Ethernet MAC + crypto + memory controller designs.
Typical applications include residential gateways and SOHO routers, set-top box and IPTV edge nodes, industrial control and factory automation controllers, networked printers and multifunction devices, and secure access points. The combination of GbE, USB, PCI, and SEC in one package targets cost-sensitive connected-product designs.
When designing with this device, use at least four layers with continuous ground/power planes for the BGA breakout, and follow NXP's reference design for DDR2 termination. Verify thermal management because 516-ball BGAs require thermal vias under the die to keep junction below 105 C in enclosed chassis. PCB layout must respect length-matched DDR and GMII/PCI traces per the hardware specification manual.
This page synthesizes distributor pricing, drop-in NXP replacements, and practical design notes not found in the NXP datasheet alone, enabling rapid sourcing decisions for the legacy MPC8313E platform.
Drop-in-Alternativen für MPC8313EVRAGDC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8313EVRAGDC (gleiche Bauform und Footprint) – abweichend in Ethernet, Memory Controller, Operating Temperature, Package, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8313EVRADCA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8313ECVRAGDA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8313CVRAGDC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8313EVRAGDC Grenzwerte & elektrische Eigenschaften
| Processor Family | PowerQUICC II Pro (MPC83xx) |
| Core Architecture | 32-bit e300 RISC |
| Maximum CPU Frequency | 400 MHz |
| Core Voltage | 0.95 V to 1.05 V |
| I/O Voltage | 2.5 V / 3.3 V |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Memory Controller | DDR1 / DDR2 with ECC |
| Ethernet | 2x 10/100/1000 Mbps (GMII/TBI/RGMII) |
| USB | USB 2.0 host/device/OTG |
| PCI Controller | 32-bit / 66 MHz PCI |
| Security Engine | SEC 3.x (DES/3DES/AES/SHA/RSA) |
| Gehäuse | 516-Ball TEBGA (Tape Enhanced BGA) |
| Betriebstemperatur | 0 C to +105 C |
| Process Technology | 90 nm CMOS |
| RoHS-Status | Compliant (per NXP product page) |
MPC8313EVRAGDC 516-ball tebga (tape enhanced bga) Pinbelegungsleitfaden
Pinbelegung für MPC8313EVRAGDC (516-ball tebga (tape enhanced bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8313EVRAGDC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8313EVRAGDC ist geeignet für 6 Anwendungs: Residential Gateway and SOHO Router, Industrial Control and Factory Automation Controller, Set-Top Box and IPTV Edge Node, Networked Printer and Multifunction Device Controller, Secure Wireless Access Point, Network-Attached Storage (NAS) Controller Board.
Residential Gateway and SOHO Router
The MPC8313EVRAGDC's 400 MHz e300 core, dual Gigabit Ethernet MACs, and integrated security engine make it a strong fit for SOHO routers and residential gateways. The hardware SEC accelerates IPsec/SSL VPN tunnels offloading the e300 core for control-plane routing and NAT. Designers typically run Linux on the chip with 128 MB DDR2 and store firmware in parallel NOR flash. The 516 TEBGA footprint keeps the board under 100x100 mm even with integrated GbE+USB+PCI, helping hit consumer BOM targets. NXP reference designs for the MPC8313E include complete board collateral, schematics, and U-Boot port for accelerated development.
Empfohlen
Industrial Control and Factory Automation Controller
The 0 to 105 C operating range, robust PCI interface, and dual GbE MACs position the MPC8313EVRAGDC well for PLCs and industrial controllers requiring deterministic Ethernet and fieldbus bridging. Its hardware security engine secures industrial IoT uplink traffic to the cloud without burdening the real-time control loop. The 516-ball TEBGA package supports vibration-tolerant PCB mounting suitable for cabinet installations. PROFINET or EtherCAT master firmware can run on the e300 core with the GbE MACs serving industrial Ethernet traffic; PCI bridges to legacy fieldbus cards without requiring an external MAC.
Empfohlen
Set-Top Box and IPTV Edge Node
Set-top box and IPTV edge node designs benefit from the MPC8313EVRAGDC's PCI expansion for tuner cards, USB 2.0 for external storage, and Gigabit Ethernet for streaming video uplink. The SEC engine handles conditional access and DRM decryption efficiently, freeing the e300 CPU for media protocol handling and user interface rendering. The 516 TEBGA footprint allows compact chassis designs that resemble consumer hubs rather than rack-mounted appliances. DDR2 memory up to 1 GB supports buffered video at 1080p60 without dropouts.
Empfohlen
Networked Printer and Multifunction Device Controller
Office printers and multifunction peripherals leverage the MPC8313EVRAGDC's combination of USB 2.0 device port for direct PC connection, Gigabit Ethernet for shared office networks, and PCI for scanner/print engine ASICs. The e300 core runs standard print server firmware stacks such as CUPS or vendor proprietary IPS protocols. Hardware-accelerated encryption via SEC secures SMB/IP printing and administrative web UIs. DDR2 memory buffers large print jobs at full duplex, with engine side throughput exceeding 60 ppm when properly tuned.
Empfohlen
Secure Wireless Access Point
Enterprise and SMB wireless access points pair a Wi-Fi MAC/BB chipset over PCI with the MPC8313EVRAGDC handling AP control, 802.1X authentication, WPA2/AES encryption via the SEC engine, and centralized management. The dual GbE MACs support uplink and dedicated packet inspection port for IDS/IPS without external switching ASICs. Compact 516 TEBGA keeps the AP motherboard small while leaving room for PoE conditioning. Running Linux with hostapd or vendor firmware is fully supported by NXP BSP releases.
Empfohlen
Network-Attached Storage (NAS) Controller Board
Two- to four-bay SOHO NAS controllers benefit from the MPC8313EVRAGDC's SATA-ready PCI expansion (via bridge chips), dual GbE MACs for link aggregation or bonding, and the security engine for encrypted volumes. The e300 core runs ext4 or ZFS file systems on a standard NAS distro, while DDR2 to 1 GB supports read/write cache. The 516 TEBGA footprint and 105 C thermal envelope are appropriate for ventilated chassis. RAID levels 0/1/5/6 are handled by driver/firmware on the host CPU, with hardware SHA acceleration for parity computation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8313EVRAGDC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8313EVRADCA | MPC8313ECVRAGDA | MPC8313CVRAGDC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-Ball TEBGA | 516-Ball TEBGA - same | 516-Ball TEBGA - same | 516-Ball TEBGA - same |
| CPU Core | e300 @ 400 MHz | e300 @ 400 MHz | e300 @ 333 MHz | e300 @ 400 MHz |
| Security Engine (SEC) | Yes (SEC 3.x) | Yes (SEC 3.x) | Yes (SEC 3.x) | No |
| DDR1/DDR2 Controller | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) |
| Gigabit Ethernet MACs | 2x GbE | 2x GbE | 2x GbE | 2x GbE |
| PCI Controller | 32-bit / 66 MHz | 32-bit / 66 MHz | 32-bit / 66 MHz | 32-bit / 66 MHz |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C |
Wichtigste Unterscheidungsmerkmale
- Integrated hardware security engine eliminates external crypto ASIC (vs. MPC8313CVRAGDC)
- Same 516-ball TEBGA footprint retained across revision letters (vs. MPC8313EVRADCA (rev A))
- Lowerest-speed part in 516 TEBGA MPC83xx family for lower power consumption (vs. MPC8313ECVRAGDA at 333 MHz)
Designhinweise
Estimated: The 516-ball TEBGA package requires at minimum a 4-layer PCB stack-up with a continuous reference ground plane under the BGA. Use via-in-pad with filled and plated-over vias for clean breakout; aim for 0.5 mm escape pitch and length-matched DDR2 traces within 50 mil tolerance. Place at least eight thermal vias under the BGA die to keep the junction below 105 C per NXP hardware specs. Decoupling stacks of 100 nF + 10 uF ceramic must hug each power pin within 200 mil.
Sequence the 1.0 V core, 2.5 V DDR, and 3.3 V I/O rails per the NXP hardware manual order to avoid CMOS latch-up. The core regulator should be a 6 A capable DC-DC (e.g. TPS54620) with soft-start to limit inrush when the DDR controller initializes. Estimated: At maximum CPU activity the core draws roughly 800 mA; oversize the regulator to 1.5x for power-oscillation margin. Add a TPS3823 supervisor to hold the system in reset until the rails stabilize.
MPC8313EVRAGDC is on Last Time Buy per NXP product discontinuation notice - place final orders promptly and verify the replacement PCN before designing new boards. Designers transitioning to the recommended replacement should double-check that the SEC engine crypto API and DDR2 initialization sequence are identical, otherwise firmware revisions may be required. Do not assume the silicon revision letter (DC vs DA) implies software differences; consult the NXP errata document before sign-off.
Estimated: With 800 mA core draw on 1.0 V plus DDR2 active, total power dissipation approaches 1.5 W worst case. Even at the lower end, the 516 TEBGA needs a thermal pad connected to the inner ground plane using 0.3 mm thermal vias on a 1.0 mm grid. Inside an enclosed gateway operating at 70 C ambient, a copper spreader or aluminum stiffener is recommended to keep junction below 95 C and preserve long-term reliability.
Compliance-Informationen
NXP product page lists RoHS compliance for Pb-free assembly. Last Time Buy status applies per the NXP product discontinuation notice linked from nxp.com/part/MPC8313EVRAGDC.
