MPC8313EVRAGDC - PowerQUICC II Pro SoC 400MHz | NXP
MPN： MPC8313EVRAGDC ⚠ 最後購買機會MPC8313EVRAGDC 概覽
A PowerQUICC SoC is a family of integrated communications processors from NXP (formerly Freescale) that combine one or more Power Architecture processor cores with networking and I/O peripherals, deriving from the classic PowerQUICC II Pro product line. The MPC8313E sits in the lower-power, lower-cost tier of that family, optimized for entry-level networking, residential gateways, and industrial control applications where deterministic Ethernet throughput and a small footprint matter more than multi-gigabit switching fabric.
Key features include the 32-bit e300c4 processor core, a 32-bit DDR1/DDR2 memory controller with ECC support, dual GMII/TBI/RGMII Gigabit Ethernet interfaces, two USB 2.0 ports (host/device/OTG), a 32-bit/66 MHz PCI controller, an integrated security engine (SEC 3.x) for DES/3DES/AES/SHA/RSA acceleration, and 16 KB I-cache plus 16 KB D-cache. The device supports JTAG debug and COP for in-system emulation, and exposes flexible interrupt routing via the SIU.
Architecturally, the MPC8313E uses a 90 nm CMOS process and an internal SoC platform bus with dedicated DMA channels to offload packet processing from the e300 core. The SEC coprocessor executes cryptographic operations independently, freeing the host CPU for control-plane tasks. The result is a highly-integrated single-chip solution that replaces discrete CPU + Ethernet MAC + crypto + memory controller designs.
Typical applications include residential gateways and SOHO routers, set-top box and IPTV edge nodes, industrial control and factory automation controllers, networked printers and multifunction devices, and secure access points. The combination of GbE, USB, PCI, and SEC in one package targets cost-sensitive connected-product designs.
When designing with this device, use at least four layers with continuous ground/power planes for the BGA breakout, and follow NXP's reference design for DDR2 termination. Verify thermal management because 516-ball BGAs require thermal vias under the die to keep junction below 105 C in enclosed chassis. PCB layout must respect length-matched DDR and GMII/PCI traces per the hardware specification manual.
This page synthesizes distributor pricing, drop-in NXP replacements, and practical design notes not found in the NXP datasheet alone, enabling rapid sourcing decisions for the legacy MPC8313E platform.
直接替換替代品，適用於 MPC8313EVRAGDC — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8313EVRAGDC （相同外形與佔位） — 差異在於 Ethernet, Memory Controller, Operating Temperature, Package, RoHS Status.
MPC8313EVRADCA
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8313ECVRAGDA
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC8313CVRAGDC
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8313EVRAGDC 最大額定值與電氣特性
| Processor Family | PowerQUICC II Pro (MPC83xx) |
| Core Architecture | 32-bit e300 RISC |
| Maximum CPU Frequency | 400 MHz |
| Core Voltage | 0.95 V to 1.05 V |
| I/O Voltage | 2.5 V / 3.3 V |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Memory Controller | DDR1 / DDR2 with ECC |
| Ethernet | 2x 10/100/1000 Mbps (GMII/TBI/RGMII) |
| USB | USB 2.0 host/device/OTG |
| PCI Controller | 32-bit / 66 MHz PCI |
| Security Engine | SEC 3.x (DES/3DES/AES/SHA/RSA) |
| 封裝 | 516-Ball TEBGA (Tape Enhanced BGA) |
| 工作溫度 | 0 C to +105 C |
| Process Technology | 90 nm CMOS |
| RoHS 狀態 | Compliant (per NXP product page) |
MPC8313EVRAGDC 516-ball tebga (tape enhanced bga) 腳位配置指南
MPC8313EVRAGDC（516-ball tebga (tape enhanced bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8313EVRAGDC.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8313EVRAGDC 適用於 6 應用s: Residential Gateway and SOHO Router, Industrial Control and Factory Automation Controller, Set-Top Box and IPTV Edge Node, Networked Printer and Multifunction Device Controller, Secure Wireless Access Point, Network-Attached Storage (NAS) Controller Board.
Residential Gateway and SOHO Router
The MPC8313EVRAGDC's 400 MHz e300 core, dual Gigabit Ethernet MACs, and integrated security engine make it a strong fit for SOHO routers and residential gateways. The hardware SEC accelerates IPsec/SSL VPN tunnels offloading the e300 core for control-plane routing and NAT. Designers typically run Linux on the chip with 128 MB DDR2 and store firmware in parallel NOR flash. The 516 TEBGA footprint keeps the board under 100x100 mm even with integrated GbE+USB+PCI, helping hit consumer BOM targets. NXP reference designs for the MPC8313E include complete board collateral, schematics, and U-Boot port for accelerated development.
推薦
Industrial Control and Factory Automation Controller
The 0 to 105 C operating range, robust PCI interface, and dual GbE MACs position the MPC8313EVRAGDC well for PLCs and industrial controllers requiring deterministic Ethernet and fieldbus bridging. Its hardware security engine secures industrial IoT uplink traffic to the cloud without burdening the real-time control loop. The 516-ball TEBGA package supports vibration-tolerant PCB mounting suitable for cabinet installations. PROFINET or EtherCAT master firmware can run on the e300 core with the GbE MACs serving industrial Ethernet traffic; PCI bridges to legacy fieldbus cards without requiring an external MAC.
推薦
Set-Top Box and IPTV Edge Node
Set-top box and IPTV edge node designs benefit from the MPC8313EVRAGDC's PCI expansion for tuner cards, USB 2.0 for external storage, and Gigabit Ethernet for streaming video uplink. The SEC engine handles conditional access and DRM decryption efficiently, freeing the e300 CPU for media protocol handling and user interface rendering. The 516 TEBGA footprint allows compact chassis designs that resemble consumer hubs rather than rack-mounted appliances. DDR2 memory up to 1 GB supports buffered video at 1080p60 without dropouts.
推薦
Networked Printer and Multifunction Device Controller
Office printers and multifunction peripherals leverage the MPC8313EVRAGDC's combination of USB 2.0 device port for direct PC connection, Gigabit Ethernet for shared office networks, and PCI for scanner/print engine ASICs. The e300 core runs standard print server firmware stacks such as CUPS or vendor proprietary IPS protocols. Hardware-accelerated encryption via SEC secures SMB/IP printing and administrative web UIs. DDR2 memory buffers large print jobs at full duplex, with engine side throughput exceeding 60 ppm when properly tuned.
推薦
Secure Wireless Access Point
Enterprise and SMB wireless access points pair a Wi-Fi MAC/BB chipset over PCI with the MPC8313EVRAGDC handling AP control, 802.1X authentication, WPA2/AES encryption via the SEC engine, and centralized management. The dual GbE MACs support uplink and dedicated packet inspection port for IDS/IPS without external switching ASICs. Compact 516 TEBGA keeps the AP motherboard small while leaving room for PoE conditioning. Running Linux with hostapd or vendor firmware is fully supported by NXP BSP releases.
推薦
Network-Attached Storage (NAS) Controller Board
Two- to four-bay SOHO NAS controllers benefit from the MPC8313EVRAGDC's SATA-ready PCI expansion (via bridge chips), dual GbE MACs for link aggregation or bonding, and the security engine for encrypted volumes. The e300 core runs ext4 or ZFS file systems on a standard NAS distro, while DDR2 to 1 GB supports read/write cache. The 516 TEBGA footprint and 105 C thermal envelope are appropriate for ventilated chassis. RAID levels 0/1/5/6 are handled by driver/firmware on the host CPU, with hardware SHA acceleration for parity computation.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8313EVRAGDC — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8313EVRADCA | MPC8313ECVRAGDA | MPC8313CVRAGDC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-Ball TEBGA | 516-Ball TEBGA - same | 516-Ball TEBGA - same | 516-Ball TEBGA - same |
| CPU Core | e300 @ 400 MHz | e300 @ 400 MHz | e300 @ 333 MHz | e300 @ 400 MHz |
| Security Engine (SEC) | Yes (SEC 3.x) | Yes (SEC 3.x) | Yes (SEC 3.x) | No |
| DDR1/DDR2 Controller | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) |
| Gigabit Ethernet MACs | 2x GbE | 2x GbE | 2x GbE | 2x GbE |
| PCI Controller | 32-bit / 66 MHz | 32-bit / 66 MHz | 32-bit / 66 MHz | 32-bit / 66 MHz |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C |
主要差異化特點
- Integrated hardware security engine eliminates external crypto ASIC (對比MPC8313CVRAGDC)
- Same 516-ball TEBGA footprint retained across revision letters (對比MPC8313EVRADCA (rev A))
- Lowerest-speed part in 516 TEBGA MPC83xx family for lower power consumption (對比MPC8313ECVRAGDA at 333 MHz)
設計說明
Estimated: The 516-ball TEBGA package requires at minimum a 4-layer PCB stack-up with a continuous reference ground plane under the BGA. Use via-in-pad with filled and plated-over vias for clean breakout; aim for 0.5 mm escape pitch and length-matched DDR2 traces within 50 mil tolerance. Place at least eight thermal vias under the BGA die to keep the junction below 105 C per NXP hardware specs. Decoupling stacks of 100 nF + 10 uF ceramic must hug each power pin within 200 mil.
Sequence the 1.0 V core, 2.5 V DDR, and 3.3 V I/O rails per the NXP hardware manual order to avoid CMOS latch-up. The core regulator should be a 6 A capable DC-DC (e.g. TPS54620) with soft-start to limit inrush when the DDR controller initializes. Estimated: At maximum CPU activity the core draws roughly 800 mA; oversize the regulator to 1.5x for power-oscillation margin. Add a TPS3823 supervisor to hold the system in reset until the rails stabilize.
MPC8313EVRAGDC is on Last Time Buy per NXP product discontinuation notice - place final orders promptly and verify the replacement PCN before designing new boards. Designers transitioning to the recommended replacement should double-check that the SEC engine crypto API and DDR2 initialization sequence are identical, otherwise firmware revisions may be required. Do not assume the silicon revision letter (DC vs DA) implies software differences; consult the NXP errata document before sign-off.
Estimated: With 800 mA core draw on 1.0 V plus DDR2 active, total power dissipation approaches 1.5 W worst case. Even at the lower end, the 516 TEBGA needs a thermal pad connected to the inner ground plane using 0.3 mm thermal vias on a 1.0 mm grid. Inside an enclosed gateway operating at 70 C ambient, a copper spreader or aluminum stiffener is recommended to keep junction below 95 C and preserve long-term reliability.
合規資訊
NXP product page lists RoHS compliance for Pb-free assembly. Last Time Buy status applies per the NXP product discontinuation notice linked from nxp.com/part/MPC8313EVRAGDC.
