MPC852TZT66A - PowerQUICC 32-Bit MPU, 66MHz, 256-BGA | NXP
Teilenummer: MPC852TZT66A ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2.895,00 |
| 500 | $24.6 | $12.300,00 |
| 1.000 | $21.85 | $21.850,00 |
MPC852TZT66A Übersicht
A microprocessor (MPU) is an integrated circuit that combines a central processing unit, memory interfaces, and peripheral controllers on a single die, forming the compute core of an embedded system. Within the broader semiconductor taxonomy, MPUs sit alongside microcontrollers (MCUs) under the broader umbrella of embedded processors, distinguished by higher clock speeds, external memory buses, and richer peripheral sets suitable for systems running complex operating systems or protocol stacks.
Key features of the MPC852TZT66A include an integrated CPM (Communications Processor Module) that offloads communications-intensive processing from the main core, hardware acceleration for common serial protocols, and a 32-bit external memory bus supporting SDRAM, SRAM, and ROM. The 256-PBGA package is RoHS non-compliant per the verified datasheet, indicating lead-containing solder balls that are still in service for legacy industrial programs.
Architecturally, the MPC852T integrates a Power Architecture execution unit with a RISC-style CPM, enabling parallel handling of communications channels without burdening the host CPU. The device exposes a 32-bit data bus, address lines for external memory expansion, and a CPM block supporting HDLC, Ethernet, UART, and other serial protocols through SCCs and SMCs.
Typical applications include WAN interface cards, ISDN terminal adapters, industrial control routers, and legacy telecom line cards. The deterministic CPM performance and mature PowerQUICC toolchain make it a long-life choice for systems that have already been designed around this family.
A key design consideration is the legacy 1.8V core and 3.3V I/O dual-rail requirement, which mandates an efficient sequencing and decoupling strategy. Engineers should also budget for the large 23x23 mm BGA footprint and ensure PCB thermal relief is adequate for sustained CPM workloads.
This page synthesizes distributor pricing, NXP MPC8xx family alternatives, and legacy PowerQUICC design notes not found in the manufacturer datasheet summary.
Drop-in-Alternativen für MPC852TZT66A – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC852TZT66A (gleiche Bauform und Footprint) – abweichend in Operating Temperature, RoHS Status, Package, Core Architecture, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC852TCZT66A
✅ Drop-In✓ Auf Lager
$49.95 / Stück
Datenblatt ansehen →MPC852TVR66A
✅ Drop-In✓ Auf Lager
$7.4 / Stück
Datenblatt ansehen →MPC852TZT50A
✅ Drop-In✓ Auf Lager
$13.5 / Stück
Datenblatt ansehen →MPC852TZT66A Grenzwerte & elektrische Eigenschaften
| Processor Type | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | Power Architecture |
| Maximum Clock Speed | 66 MHz |
| Number of Cores | 1 |
| Datenbusbreite | 32-Bit |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 3.3 V |
| Gehäuse / Bauform | 256-PBGA (23x23 mm) |
| Montageart | Surface Mount |
| Packaging | Tray |
| Betriebstemperatur | 0 C to +95 C |
| Communications Module | CPM (HDLC/Ethernet/UART) |
| Lead Free Status | Contains Lead |
| RoHS-Status | RoHS Non-Compliant |
| Series | PowerQUICC, MPC852 |
MPC852TZT66A 256-pbga (23x23 mm) Pinbelegungsleitfaden
Pinbelegung für MPC852TZT66A (256-pbga (23x23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC852TZT66A.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC852TZT66A ist geeignet für 6 Anwendungs: WAN Interface Cards, ISDN Terminal Adapters, Industrial Control Routers, Legacy Telecom Line Cards, Embedded Protocol Bridges, POS / ATM Network Terminals.
WAN Interface Cards
The MPC852TZT66A's integrated CPM (Communications Processor Module) and 66 MHz Power Architecture core make it a strong fit for WAN interface cards in branch-office routers. The CPM offloads HDLC framing and serial-protocol handling from the host CPU, allowing the card to terminate multiple T1/E1 lines deterministically. Designers place the part on the WAN mezzanine alongside a PHY transceiver; the 32-bit external memory bus connects directly to SDRAM for packet buffering, and the 256-PBGA footprint keeps the card area compact.
Empfohlen
ISDN Terminal Adapters
ISDN terminal adapters benefit from the MPC852TZT66A's hardware-accelerated HDLC channels and dual 3.3V/1.8V power domains. The CPM's SCCs handle BRI/PRI D-channel framing in hardware, leaving the 32-bit core free for call control and management stacks. The 0-95 C operating range fits indoor customer-premises equipment, and the 256-PBGA (23x23) package keeps adapter boards slim enough for desktop enclosures.
Empfohlen
Industrial Control Routers
Industrial control routers use the MPC852TZT66A for deterministic serial-protocol routing between Ethernet, RS-232/RS-485, and legacy fieldbuses. The integrated CPM handles the real-time serial traffic, while the Power Architecture core runs the routing/management firmware. The 66 MHz clock gives enough headroom for small Linux/RTOS stacks, and the 256-PBGA industrial temperature option makes the part suitable for control-cabinet environments.
Empfohlen
Legacy Telecom Line Cards
Legacy telecom line cards remain a core application for the MPC852TZT66A, where long-lived PowerQUICC firmware is already qualified and deployed. The CPM's TDM channels and HDLC controllers map directly to standard telecom backplane interfaces, and the 66 MHz Power Architecture core is sufficient for channelized voice/data aggregation. The 256-BGA (23x23) footprint matches the mechanical envelope of established line-card designs.
Empfohlen
Embedded Protocol Bridges
Embedded protocol bridges that translate between Ethernet and legacy serial protocols benefit from the MPC852TZT66A's mixed CPM peripherals. The 66 MHz core handles routing tables while SCCs and SMCs run the serial-side protocols; the 32-bit external bus interfaces directly to SRAM or SDRAM for frame buffering. The 3.3V I/O domain simplifies interfacing to standard PHY and transceiver chips without level shifters.
Empfohlen
POS / ATM Network Terminals
Point-of-sale and ATM network terminals historically use the MPC852TZT66A for secure transaction routing over PSTN or leased-line networks. The 66 MHz core handles the TCP/IP stack and encryption tasks, while the CPM manages the dial-up modem or leased-line interface. The 256-BGA package and 0-95 C temperature range suit the indoor terminal enclosures, and the dual 1.8V/3.3V rails simplify power-supply design with common LDO regulators.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC852TZT66A – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC852TCZT66A | MPC852TVR66A | MPC852TZT50A |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same |
| Maximum Clock Speed | 66 MHz | 66 MHz | 66 MHz | 50 MHz |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C |
| Communications Module (CPM) | HDLC/Ethernet/UART | HDLC/Ethernet/UART | HDLC/Ethernet/UART | HDLC/Ethernet/UART |
| Data Bus Width | 32-Bit | 32-Bit | 32-Bit | 32-Bit |
| RoHS Status | Non-Compliant (contains lead) | Non-Compliant (contains lead) | Non-Compliant (contains lead) | Non-Compliant (contains lead) |
Wichtigste Unterscheidungsmerkmale
- Same-die drop-in with only a suffix change (vs. MPC852TCZT66A)
- Higher clock speed within same BGA footprint (vs. MPC852TZT50A)
- Same 256-PBGA footprint across MPC8xx family (vs. MPC850DEVR50BU)
Designhinweise
The MPC852TZT66A requires two independent supplies: a 1.8V rail for the core and a 3.3V rail for I/O. Both rails must be sequenced correctly (core typically powers up before I/O) to avoid latch-up. Use low-dropout regulators with enable inputs tied together, or place a small supervisor IC to enforce power sequencing. Decoupling should include 0.1uF ceramics near every supply pin plus bulk 10uF tantalums on each rail.
The 256-PBGA (23x23 mm) at 1.27 mm pitch demands via-in-pad or dog-bone fanout, plus controlled-impedance routing for the external memory bus. Place 4-layer or 6-layer stack-ups with dedicated ground planes under the BGA to manage SI on the 32-bit bus. Thermal vias beneath the package help dissipate heat during sustained CPM workloads.
Do not assume the MPC852TZT66A is RoHS-compliant: the verified datasheet flags it as containing lead in the BGA solder balls. Designs targeting the EU RoHS directive must use a lead-free ordering code. Also, watch out for static I/O configuration - several MPC852T signals are sampled at reset to set bus width and boot source, and incorrect strapping resistors will leave the part non-functional with no obvious error.
Compliance-Informationen
RoHS non-compliant per verified distributor data - BGA solder balls contain lead. AEC-Q100 not applicable (telecom/industrial MPU, not automotive-grade). REACH and conflict-minerals status not provided in the verified web data.