MPC860ENVR80D4 - 80MHz PowerQUICC MPU, 357-PBGA | NXP
Teilenummer: MPC860ENVR80D4 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $146.1 | $146,10 |
| 10 | $138.8 | $1.388,00 |
| 100 | $124.18 | $12.418,00 |
| 500 | $109.57 | $54.785,00 |
| 1.000 | $102.27 | $102.270,00 |
MPC860ENVR80D4 Übersicht
A microprocessor (MPU) is a CPU-centric integrated circuit that executes system-level instruction streams and is paired externally with memory and peripherals. The MPC8xx family belongs to the PowerQUICC line of integrated communications processors, which sits between general-purpose CPUs (e.g., PowerPC, ARM) and dedicated network processors. Variants in the family differ in clock speed, peripheral mix (number of SCCs/SMCs), and temperature grade; designers typically choose among them to balance throughput against power and cost.
Key features include a 32-bit PowerPC core, integrated 10 Mbps Ethernet MAC, four SCC (Serial Communication Controller) channels, two SMC (Serial Management Controller) channels, a DRAM controller with FPM/EDO/page-mode support, four 16-bit timers, and a JTAG/debug port. The device operates from a 3.3 V supply and is offered in commercial-grade temperature ranges. The 357-PBGA 25x25 mm package provides dense interconnect for board designs where BGA assembly is already in use.
The architecture combines an integer pipeline PowerPC core, separate instruction and data caches, a system interface unit for bus arbitration, and the dedicated CPM that handles DMA-driven serial communications independently of the CPU. The CPM's RISC engine runs dedicated microcode to perform HDLC framing, UART encoding, and Ethernet MAC operations, freeing the host CPU for higher-layer protocol and management tasks.
Typical applications include SOHO/branch-office routers, ISDN/DSL modem gateways, legacy industrial control routers, protocol bridges (HDLC/PPP/X.25), telecom line cards, and embedded serial-management controllers. The 80 MHz CPU with the CPM's offload engines is well matched to WAN-edge and protocol-conversion designs.
When designing with this device, allocate adequate PCB layers for the 357-ball BGA and provide matched-impedance routing for the Ethernet MII/RMII traces. Decoupling must follow Freescale/NXP recommendations: place 0.1 uF ceramic capacitors at multiple VDD/VCC pins with a bulk 10-47 uF tantalum or polymer capacitor near the package.
This page synthesizes distributor stock, lifecycle data, drop-in alternatives, comparison parameters, and practical design notes that are not consolidated in any single manufacturer datasheet.
Drop-in-Alternativen für MPC860ENVR80D4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC860ENVR80D4 (gleiche Bauform und Footprint) – abweichend in Number of Cores, Core Architecture, Manufacturer, Package / Case, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC860ENZQ80D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860PVR80D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860DTZQ50D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860DTCZQ50D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC855TVR80D4
✅ Drop-In✓ Auf Lager
$64.5 / Stück
Datenblatt ansehen →TSPC860SRVZPU80C1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860ENVR80D4 Grenzwerte & elektrische Eigenschaften
| Part Number | MPC860ENVR80D4 |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Core Processor | MPC8xx PowerQUICC, 32-bit PowerPC |
| Number of Cores | 1 Core, 32-Bit |
| Speed (CPU Clock) | 80 MHz |
| Co-Processor / DSP | Communications Processor Module (CPM) |
| Versorgungsspannung | 3.3 V |
| Ethernet | 10 Mbps (MII/RMII MAC) |
| Serial Communication Controllers (SCC) | 4 channels |
| Serial Management Controllers (SMC) | 2 channels |
| RAM Controllers | DRAM (FPM/EDO page-mode) |
| Timers | 4 x 16-bit |
| Graphics Acceleration | No |
| Gehäuse / Bauform | 357-Ball PBGA (25x25 mm) |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS-Status | RoHS Compliant |
| Part Status | Not For New Designs |
MPC860ENVR80D4 357-ball pbga (25x25 mm) Pinbelegungsleitfaden
Pinbelegung für MPC860ENVR80D4 (357-ball pbga (25x25 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC860ENVR80D4.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC860ENVR80D4 ist geeignet für 6 Anwendungs: SOHO / Branch-Office Routers, ISDN / DSL Modem Gateways, Protocol Bridges (HDLC / PPP / X.25), Telecom Line Cards, Industrial Control Routers, Legacy Embedded Serial Controllers.
SOHO / Branch-Office Routers
The MPC860ENVR80D4 fits SOHO and branch-office routers because its PowerQUICC architecture pairs an 80 MHz PowerPC core with the dedicated CPM that handles Ethernet MAC and serial channel framing in hardware. In this application the MPU is the central control plane: the PowerPC core runs the routing/management stack while the offload CPM handles PPP, HDLC, and 10 Mbps Ethernet encapsulation without CPU cycles. With 4 SCC and 2 SMC channels, multiple WAN links and serial management interfaces run concurrently; the integrated DRAM controller removes the need for an external memory controller IC. The 357-PBGA package keeps the board footprint compact enough for desktop/SOHO enclosures while supporting the multi-rail decoupling scheme typical of high-density routing designs.
Empfohlen
ISDN / DSL Modem Gateways
The MPC860ENVR80D4 serves as the central processor in ISDN and DSL modem gateways, where its PowerQUICC integration directly maps onto the multi-channel serial architecture required for DSL framing. The CPM's RISC microcoded engines handle HDLC and transparent bit-stuffing at line rate, leaving the 80 MHz PowerPC core free to run PPPoE, PPPoA, and IP routing stacks. With 4 SCCs, the gateway can support one DSL link and multiple ISDN B-channels simultaneously, plus an Ethernet LAN port. The 3.3 V supply simplifies interface to DSL front-end ICs that operate from the same rail, reducing regulator count and BOM cost in consumer-grade CPE.
Empfohlen
Protocol Bridges (HDLC / PPP / X.25)
The MPC860ENVR80D4 is well suited to legacy protocol bridges that convert HDLC, PPP, X.25, and V.120 framed traffic between disparate physical interfaces. The CPM's dedicated microcoded engines implement HDLC bit-stuffing and CRC without CPU intervention, allowing the bridge to sustain full-duplex line rates on multiple channels in parallel. The PowerPC core's 80 MHz instruction throughput handles higher-layer state machines and address translation. Industrial protocol bridges for SCADA, energy management, and telco inter-office trunks rely on this same architecture. The 357-PBGA footprint is well matched to industrial card designs where BGA reliability and 25 mm pitch are already standard.
Empfohlen
Telecom Line Cards
The MPC860ENVR80D4 powers telecom line cards by combining the CPU, CPM, and DRAM controller into a single chip that sits at the heart of T1/E1, ISDN-PRI, and channelized backplane designs. Each SCC runs an HDLC/SDLC channel carrying PCM voice or signaling traffic, while the dedicated CPM architecture aggregates multiple streams without host intervention. The 80 MHz PowerPC core is fast enough for on-card protocol processing, including SS7 message handling or R2/MFC signaling. The 357-PBGA package provides the multi-rail decoupling structure telecom OEMs require for strict EN 55022 EMI margins, plus the BGA's low-parasitic inductance suits high-speed serial and backplane interfaces.
Empfohlen
Industrial Control Routers
Industrial control routers and serial-to-Ethernet gateways benefit from the MPC860ENVR80D4's ruggedized integration: one chip supplies the CPU, the multi-protocol serial engine, the Ethernet MAC, and the DRAM controller. The CPM handles Modbus RTU, DNP3, and proprietary SCADA protocols via the SCC/SMC channels, while the 80 MHz PowerPC core runs routing/IP stacks and the management agent. Hardware watchdog and JTAG/COP debug ports simplify field service in deployment. The -40 to +85 C industrial temperature variants of the same PowerQUICC family share the 357-PBGA footprint, allowing a single PCB design to accept either commercial or extended-grade silicon via BOM swap.
Empfohlen
Legacy Embedded Serial Controllers
The MPC860ENVR80D4 is widely deployed as a legacy embedded serial controller in industrial automation, instrumentation, and rack-mount telecommunications equipment. Its PowerPC core, CPM, Ethernet MAC, and DRAM controller are integrated in a single 357-PBGA, allowing embedded designs to remove external peripherals and shrink the BOM. The CPM's flexible microcoded serial engines implement UART, HDLC, Bisync, transparent, and V.14 modes, supporting any combination of RS-232, RS-485, and synchronous serial interfaces. The watchdog timer and JTAG/COP block simplify firmware development, field service, and long-life maintenance cycles typical of industrial embedded platforms.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC860ENVR80D4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC860ENZQ80D4 | MPC860PVR80D4 | MPC860DTZQ50D4 | MPC860DTCZQ50D4 | MPC855TVR80D4 | TSPC860SRVZPU80C1 |
|---|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| CPU Clock Speed | 80 MHz | 80 MHz | 80 MHz | 50 MHz | 50 MHz | 80 MHz | 80 MHz |
| Sub-Family | MPC860EN (Enhanced Networking) | MPC860EN (Enhanced Networking) | MPC860P (base) | MPC860DT (lower-speed) | MPC860DT (lower-speed) | MPC855T | TSPC860 (industrial) |
| Ethernet MAC | 10 Mbps | 10 Mbps | 10 Mbps | 10 Mbps | 10 Mbps | 10 Mbps | 10 Mbps |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS / Lead Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
Wichtigste Unterscheidungsmerkmale
- Enhanced Networking sub-family with highest SCC count (vs. MPC860PVR80D4)
- Same-family identity at 80 MHz versus 50 MHz speed grade (vs. MPC860DTZQ50D4)
- Sole Ethernet-equipped sub-variant on the 357-PBGA (vs. MPC855TVR80D4)
Designhinweise
The 357-PBGA at 1.27 mm pitch requires a multi-layer PCB stack-up (minimum 4 layers, 6 preferred) with buried or laser-drilled micro-vias for fanout. NXP recommends matched-impedance routing for the MII bus (typically 50 ohm single-ended); keep Ethernet traces as short as possible and avoid layer transitions. Decouple each VDD/VCC pin pair with a 0.1 uF X7R ceramic, plus one 10 uF X5R or 22 uF tantalum polymer bulk capacitor placed within 1 cm of the BGA. Maintain a continuous ground plane beneath the device; stitching vias every 3-5 mm along the BGA edge reduce ground bounce on the parallel DRAM bus. Expected: this stack-up enables stable operation at 80 MHz CPU / 50 MHz bus without signal-integrity issues.
At 80 MHz with full CPM activity, the MPC860ENVR80D4 can dissipate up to 1.2 W typical and 2.0 W worst case (compute as 0.85 W CPU + 0.4 W CPM under 100% bus utilization). The 357-PBGA junction-to-ambient thermal resistance theta_JA is approximately 25-30 C/W on a 4-layer JEDEC test board (estimated), so the temperature rise without airflow reaches 30-60 C above ambient. For sealed enclosures or high ambient (>50 C) scenarios, add forced-air cooling or large copper pours on top/bottom inner layers directly under the BGA. Estimated: at 1.5 W dissipation, junction temperature rise is approximately 45 C on a typical 4-layer board; thermal design margin should keep Tj below +100 C for industrial environments.
Three common pitfalls appear repeatedly in MPC860 designs: (1) omitting the external bus-termination resistors on the DRAM address/data bus, leading to reflections at 50 MHz and intermittent boot failures; (2) failing to configure the PLL MODCK pins correctly at reset, which can latch the part into a low-frequency mode or halt; (3) not connecting unused SCC/SMC pins per the datasheet - some unconnected inputs can oscillate and inject noise into the analog PLL supply. Follow the MPC860 hardware design guide's reference schematic exactly. Also note that the DRY PACK / Moisture Sensitivity Level is MSL3 (per JEDEC J-STD-020) and the part must be dry-bag storage with reflow within the floor-life window once opened. Bake per JEDEC J-STD-033 before assembly if floor-life is exceeded.
Compliance-Informationen
RoHS compliant and lead-free per chipdig and Freescale/NXP product page. Halogen-free reported compliant on GlobalSpec datasheet overview. AEC-Q100 not applicable (telecom/industrial-grade MPU, not automotive). REACH and conflict-mineral statement: not surfaced in verified web data.
