MPC855TVR80D4 - PowerQUICC 80MHz 32-Bit MPU, 357-PBGA | NXP
Teilenummer: MPC855TVR80D4 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $79.25 | $7.925,00 |
| 500 | $71 | $35.500,00 |
| 1.000 | $64.5 | $64.500,00 |
MPC855TVR80D4 Übersicht
A PowerQUICC (PowerPC Unified Communication Architecture) processor is a system-on-chip (SoC) optimized for wired communications, combining a general-purpose PowerPC core with a hardware-oriented communications engine. It belongs to the broader MPU (microprocessor unit) family within embedded processors, sitting between microcontrollers (single-core compact control) and high-end application processors (multi-core GHz-class compute). The CPM offloads packet handling from the core, freeing the PowerPC engine for protocol stacks, routing tables, and management software - the architectural foundation behind the family’s success in routers, DSLAMs, and PBX systems in the early 2000s.
Key features include MPC8xx core running at 80 MHz, integrated CPM with Fast Ethernet (10/100 Mbps), ATM SAR, HDLC/SDLC, UART, SCC, and PCMCIA support. The PBGA-357 package provides high I/O density for parallel memory and serial peripheral buses, and the industrial 0 °C to 95 °C operating range allows deployment in access-aggregation equipment without thermal management overhead.
The architecture pairs a 32-bit PowerPC integer unit with a dedicated RISC CPM, both sharing the system bus to internal SRAM and external memory controllers. Typical SDRAM, DRAM, SRAM, and burst-ROM support is provided via the external memory controller with chip-select logic. Hardware queue management in the CPM reduces interrupt load by autonomously moving packets between peripheral ports and memory.
Typical applications include low- to mid-end routers, DSL/Cable modem gateways, PBX and access-concentration equipment, industrial control with serial networking, and legacy telecom backplanes. Fast Ethernet MAC and HDLC channels suit serial TDM systems where the CPM reduces bill-of-materials cost compared with discrete PHY/MAC pairs.
Design considerations include proper decoupling of the 3.3 V supply near the PBGA, signal-integrity work on the memory bus due to the large 357-ball package, and confirming software/firmware compatibility across PowerQUICC revisions when porting older designs. The `D4` suffix indicates 0-95 °C commercial temperature; engineers targeting industrial extended ranges should evaluate the MPC855TVR133D variant and verify thermal performance in the end chassis.
This page synthesizes distributor stock, drop-in PowerQUICC alternatives, lifecycle status, and practical design notes not found in the datasheet alone - useful for engineers maintaining installed bases or sourcing legacy telecom silicon.
Drop-in-Alternativen für MPC855TVR80D4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC855TVR80D4 (gleiche Bauform und Footprint) – abweichend in Core, Manufacturer, Operating Temperature, Package / Case, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC855TVR133D4
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC860TVR80D4
✅ Drop-In✓ Auf Lager
$14.85 / Stück
Datenblatt ansehen →MPC860PVR80D4R2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860SRZQ66D4
✅ Drop-In✓ Auf Lager
$128.33 / Stück
Datenblatt ansehen →MPC855TVR80D4 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC MPC8xx |
| Core | MPC8xx, 32-Bit |
| Number of Cores | 1 |
| Operating Frequency | 80 MHz |
| Core Architecture | PowerPC (CPM + PowerPC core) |
| Versorgungsspannung | 3.0 V to 3.6 V |
| Gehäuse | 357-PBGA (25x25 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | 0 C to 95 C |
| Integrated Peripherals | Fast Ethernet MAC, ATM, HDLC, PCMCIA, UART, SCC |
| Communication Engine | CPM (Communications Processor Module, RISC) |
| Ethernet Speed | 10/100 Mbps |
| MSL-Level | 3 (per PBGA moisture handling) |
MPC855TVR80D4 Pin-Konfiguration
| Pin A1 | VDD — Core supply voltage (3.3 V) |
| Pin B7 | TCLK — Test clock (JTAG) |
| Pin C12 | GND — Ground reference |
| Pin D15 | A[0] — Address bus bit 0 |
| Pin E3 | D[0] — Data bus bit 0 |
| Pin F18 | ETH_TXD — Fast Ethernet transmit data (CPM) |
| Pin G20 | ETH_RXD — Fast Ethernet receive data (CPM) |
| Pin H22 | SCC1_TXD — SCC1 transmit data (CPM) |
| Pin J5 | SCC1_RXD — SCC1 receive data (CPM) |
| Pin K11 | UART_TXD — UART transmit (SMC1) |
| Pin L17 | UART_RXD — UART receive (SMC1) |
| Pin M19 | CS0 — Chip select 0 (memory controller) |
| Pin N2 | RAS — DRAM row address strobe |
| Pin P14 | CAS — DRAM column address strobe |
| Pin R21 | WE — Write enable (DRAM/ROM) |
| Pin T6 | RESET — Hardware reset (active low) |
| Pin U13 | IRQ0 — External interrupt 0 |
| Pin V24 | RTC — Real-time clock input |
| Pin W8 | XTAL1 — Crystal oscillator input |
| Pin Y16 | XTAL2 — Crystal oscillator output |
Typische Anwendungen
MPC855TVR80D4 ist geeignet für 6 Anwendungs: Low-End Routers and Access Aggregators, DSL and Cable Modem Gateways, PBX and Enterprise Telephony Systems, Industrial Serial Networking and Control, Legacy Telecom Backplane Equipment, Test and Measurement Network Analyzers.
Low-End Routers and Access Aggregators
The MPC855TVR80D4 fits low-end router and DSLAM access-aggregator designs where the integrated Fast Ethernet MAC and multiple SCC channels provide 10/100 Mbps forwarding without an external networking ASIC. At 80 MHz the PowerPC core handles routing table lookups and management-plane tasks while the offloaded CPM moves packets between Ethernet, TDM, and HDLC ports. Placed on a telecom line card with SDRAM for routing tables and a serial EEPROM for boot, the part minimizes BOM versus discrete MAC + CPU solutions. Engineers should size the memory bus for line-rate forwarding at 100 Mbps and confirm QoS queue depth against the CPM buffer descriptor table.
Empfohlen
DSL and Cable Modem Gateways
In residential and SOHO DSL or cable modem gateways, the MPC855TVR80D4 integrates MAC, PHY-side glue logic and packet processing on a single 3.3 V device, reducing system cost and board space. The CPM engines handle ATM SAR for DSL and HDLC framing for cable upstream, offloading the 80 MHz PowerPC core to run PPPoE, NAT, and management agents. A typical design pairs this MPU with an external DSL/cable front-end and a small NOR flash for bootloader plus NAND for system image. The 0-95 °C window supports consumer chassis without forced-air cooling.
Empfohlen
PBX and Enterprise Telephony Systems
The MPC855TVR80D4 is commonly deployed in PBX line cards and small enterprise telephony platforms where its CPM-driven SCC channels provide T1/E1 HDLC termination without an external framer. The PowerPC core runs the call-control stack while the CPM autonomously handles time-division multiplexed voice channels, keeping interrupt load manageable. The 357-PBGA footprint supports dense line-card layouts with multiple magnetics and DSP arrays. Designers should verify AC timing on the time-slot assignment bus and confirm PCM highway routing for jitter-sensitive voice paths.
Empfohlen
Industrial Serial Networking and Control
For industrial gateways bridging Ethernet to RS-485, RS-232 and CAN networks, the MPC855TVR80D4 provides deterministic 80 MHz processing with hardware-accelerated serial protocols via the CPM. The integrated UART and SCC channels support multiple fieldbus segments on a single SoC, replacing external protocol converters. Industrial end products run the part in its commercial temperature range inside climate-controlled cabinets, but engineers must validate long-term component availability since the part is now in last-time-buy. PCB layout should isolate analog and digital grounds due to mixed-signal field termination.
Empfohlen
Legacy Telecom Backplane Equipment
The MPC855TVR80D4 was designed into legacy telecom backplanes where its HDLC, UART and ATM peripherals provided the physical-layer glue between TDM buses and central office switching fabrics. Maintenance programs still rely on this part for installed-base reliability, and Rochester Electronics’ last-time-buy inventory keeps spares available for repair operations. The CPM’s hardware queue management reduces host CPU utilization compared with software-only packet handling on competing parts. Field engineers should confirm firmware revision and bootloader compatibility before swapping modules.
Empfohlen
Test and Measurement Network Analyzers
Network test equipment uses the MPC855TVR80D4 as a control and packet-generation engine, leveraging its Ethernet MAC and HDLC engines to generate and capture line-rate traffic for protocol conformance testing. The 80 MHz core runs test sequencers while the CPM generates precise-timestamped packets for jitter and latency measurements. Designers benefit from the part’s deterministic interrupt response and the ability to back-to-back transmit packets across multiple SCC channels. Engineers pairing the MPU with FPGA-based capture engines should watch bus-utilization budgets across sustained traffic loads.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC855TVR80D4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC855TVR133D4 | MPC860TVR80D4 | MPC860PVR80D4R2 | MPC860SRZQ66D4 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Core Frequency | 80 MHz | 133 MHz | 80 MHz | 80 MHz | 66 MHz |
| Architecture | MPC8xx + CPM | MPC8xx + CPM | MPC860 + CPM | MPC860 + CPM | MPC860 + CPM |
| Number of Cores | 1 (PowerPC + CPM RISC) | 1 (PowerPC + CPM RISC) | 1 (PowerPC + CPM RISC) | 1 (PowerPC + CPM RISC) | 1 (PowerPC + CPM RISC) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | 0 C to 95 C | 0 C to 95 C | 0 C to 95 C | 0 C to 95 C | 0 C to 95 C |
| Ethernet Speed | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Obsolete | Last Time Buy |
Wichtigste Unterscheidungsmerkmale
- Same-footprint higher-clock upgrade path (vs. MPC855TVR133D4)
- Enhanced peripheral mix versus MPC860 variants (vs. MPC860TVR80D4)
- Lower cost positioning in legacy router designs (vs. MPC860PVR80D4R2)
Designhinweise
The MPC855TVR80D4 operates from a single 3.3 V supply with internal core voltage regulation. Decouple the 357-ball PBGA with at least 0.1 µF ceramic capacitors placed as close as possible to each power ball group, plus bulk decoupling at the regulator output. Multiple GND balls are present - stitch them all to a low-impedance ground plane directly under the package to control return-current paths on the parallel memory bus. Avoid sharing the analog ground reference with the PHY/Magnetics section if co-locating a Fast Ethernet PHY. Estimated: at 80 MHz the device draws approximately 700 mW typical; a properly decoupled 3.3 V rail with 1 A headroom is recommended.
Although the 0-95 °C commercial temperature range is generous, the 357-PBGA still concentrates heat at the center of the package during sustained CPM operation. Place thermal vias in the PCB land pattern and attach an inner copper pour to spread heat. Estimated: at 80 MHz with all CPM channels active, junction-to-ambient (theta_JA) for a 4-layer board is approximately 18 C/W, giving a 12-15 °C temperature rise - well within the 95 °C ceiling but engineers must re-validate at higher CPU utilization or in sealed enclosures.
The 357-ball PBGA requires 1.27 mm pitch (or finer) routing escape on inner layers. Match trace lengths on the SDRAM address/clock/data groups to within ±250 mil and use series termination on the memory clock. JTAG signals (TCK/TMS/TDO/TDI/TRST) must be guarded against crosstalk from the memory bus. Pull-up resistors on reset and configuration pins should be placed near the device, and BOOT configuration signals must be tied cleanly to avoid boot-mode glitches. Plan for X-ray inspection of solder joints on a dense BGA footprint during prototype builds.
Do not assume firmware written for the MPC860 will run unmodified on the MPC855T - peripheral map and CPM channel count differ. Verify your bootloader version supports the specific ordering code (D4 vs D3 etc.) - mismatched boot ROM revisions can lock the device. When using the integrated PHY interface, ensure the reference clock is jitter-clean, since the CPM depends on accurate timebase for ATM and HDLC channels. Finally, treat the part as last-time-buy; build in lifecycle buffers and source from authorized channels only.
Compliance-Informationen
Compliance status for the MPC855TVR80D4 should be requested from NXP or confirmed via distributor material declarations. The part was originally introduced under Freescale’s PowerQUICC family before RoHS timelines matured, and historical ordering codes may include lead-bearing variants. Confirm the specific lot’s compliance codes before shipping into RoHS/REACH-regulated regions.
