MPC860SRVR66D4 vs MPC860ENVR66D4 Vergleich
Detaillierter Direktvergleich von MPC860SRVR66D4 von NXP Semiconductors und MPC860ENVR66D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC860ENVR66D4 - 66MHz PowerQUICC MPU, 357-BBGA | NXP
MPC860ENVR66D4 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC860SRVR66D4 | MPC860ENVR66D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $89,75 | $48,85 |
| Processor Type | MPC8xx PowerQUICC | MPC8xx PowerQUICC, 32-Bit |
| Core Architecture | PowerPC 32-bit | PowerPC Embedded |
| Number of Cores | 1 | 1 |
| Clock Speed | 66 MHz | — |
| Operating Voltage | 3.3 V (5 V tolerant I/O) | — |
| Instruction Cache | 4 Kbyte | 4 KB |
| Data Cache | 4 Kbyte | 4 KB |
| MMU | Yes | Yes (integrated) |
| Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/SPI/I2C) | — |
| Multiply-Accumulate (MAC) Unit | Yes | — |
| JTAG / Debug | IEEE 1149.1 compliant | — |
| Betriebstemperatur | -40C to +95C | [DATA_NEEDED: operating temperature range] |
| Gehäuse / Bauform | 357-PBGA (25 mm x 25 mm) | 357-PBGA (25x25 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Packaging (Shipping) | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS-Status | RoHS Compliant | Compliant |
| Core Clock Speed | — | 66 MHz |
| Betriebsversorgungsspannung | — | 3.3 V |
| Communications Processor Module (CPM) | — | Yes (SCC/SMC/SPI/I2C) |
| Ethernet MAC | — | Dual 10/100 Mbps (Fast Ethernet) |
| Lead Free | — | Yes |
| Packaging | — | Tray |
| Process Technology | — | 0.32 um CMOS |