P2010NSE2HHC - QorIQ P2010 800MHz e500v2 SoC | NXP
Teilenummer: P2010NSE2HHC ✓ AktivP2010NSE2HHC Übersicht
An SoC (System-on-Chip) is an integrated circuit that consolidates CPU, memory controllers, and peripheral interfaces into a single silicon device, eliminating the multi-chip overhead typical of legacy processor-plus-coprocessor designs. The QorIQ P2010/P2020 family is NXP's communications-platform evolution of the PowerQUICC line, designed for high performance per watt in single- and dual-core networking, industrial control, and embedded computing applications. The series scales from a single-core 533 MHz P1011 to a dual-core 1.33 GHz P2020 while sharing one common pinout footprint.
Key features include the e500v2 32-bit core with double-precision FPU, hardware ECC on the DDR2/DDR3 controller with up to 32-bit addressing, an integrated SEC security engine accelerating AES, 3DES, and SHA-1/2, four GbE ports, two PCIe controllers, two SRIO interfaces, USB 2.0 with PHY, and the Enhanced Local Bus Controller (eLBC). The 800 MHz core frequency is targeted at mainstream wired/wireless infrastructure, factory automation, and defense/aerospace subsystems.
The P2010NSE2HHC operates across 0 to 125 C junction temperature per the NXP datasheet, making it suitable for thermally demanding industrial enclosures and outdoor telecom equipment. The TEPBGA II package exposes a thermal pad on the top side for direct heatsink attachment, while the 31x31 mm body accommodates 689 balls on a 1 mm pitch for high-density PCB layouts.
Typical applications include industrial Ethernet switches, ruggedized military routers, factory automation controllers, and multi-protocol industrial gateways where deterministic real-time performance and long product lifecycles are required. The integrated SEC engine and ECC-protected memory also suit secure payment terminals and railway signaling.
When designing with this device, follow NXP reference-design power-sequencing guidelines and ensure the exposed-pad thermal interface carries sufficient copper pour or an attached heatsink to keep junction temperature in spec under worst-case operating loads.
Drop-in-Alternativen für P2010NSE2HHC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P2010NSE2HHC (gleiche Bauform und Footprint) – abweichend in USB, Package, RoHS Status, Core Count, Operating Temperature.
P2010NSE2MHC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P2020NSE2MHC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1011NSE2HFC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P2020NSE2HFC
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →P1011NSE2HHB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P2010NSE2HHC Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Part Family | QorIQ P2 (P2010/P2020) |
| Processor Type | PowerPC e500v2 |
| Core Count | 1 (single-core) |
| Data Path Width | 32-bit |
| Core Frequency | 800 MHz |
| Betriebstemperatur | 0 C to +125 C |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Gigabit Ethernet (multiple ports) |
| PCIe | Yes (PCI Express) |
| Serial RapidIO (SRIO) | Yes |
| USB | Yes (USB 2.0 with PHY) |
| Security Engine (SEC) | Yes (AES / 3DES / SHA) |
| Gehäuse | 689-TEPBGA II (31x31 mm) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | RoHS Compliant |
| Lead Free Status | Lead Free |
| Packaging | Tray |
| Silicon Revision | Rev 2.1 |
P2010NSE2HHC 689-tepbga ii (31x31 mm) Pinbelegungsleitfaden
Pinbelegung für P2010NSE2HHC (689-tepbga ii (31x31 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P2010NSE2HHC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P2010NSE2HHC ist geeignet für 6 Anwendungs: Industrial Ethernet Switch, Ruggedized Industrial Router, Factory Automation Controller, Defense and Aerospace Subsystem, Multi-Protocol Industrial Gateway, Secure Payment Terminal.
Industrial Ethernet Switch
The P2010NSE2HHC's integrated multiple Gigabit Ethernet ports with hardware QoS queueing make it well matched for managed industrial Ethernet switches running protocols such as PROFINET, EtherNet/IP, and Modbus TCP. At 800 MHz the e500v2 core can service wire-speed L2 forwarding on 4 GbE ports while leaving headroom for PTP and network management tasks. The DDR2/DDR3 controller with ECC supports long uptime under industrial temperature stress, and the 689-TEPBGA II package fits the larger DIN-rail-mounted switch enclosures. Designers typically pair it with NXP VSC8512 PHYs and an external SerDes reference clock for full port density in ring-topology switches.
Empfohlen
Ruggedized Industrial Router
The P2010NSE2HHC integrates PCI Express, Serial RapidIO, USB 2.0, and the SEC crypto engine on a single die, removing multiple bridge chips typically required for cellular and wireless industrial routers. The integrated SEC accelerator offloads AES-128 for IPsec VPN tunnels, and the 0 C to +125 C operating range tolerates outdoor cabinet environments. With DDR3 ECC the platform meets NEBS-style vibration and shock requirements on a fanless thermal design. Recommended reference implementations pair the SoC with NXP T1040 family silicon for parallel packet-path processing or with Qualcomm LTE modems for cellular backhaul.
Empfohlen
Factory Automation Controller
The P2010NSE2HHC is suitable for a PLC-class factory automation controller that needs deterministic motion control and multi-protocol machine communication. The e500v2 core at 800 MHz can execute real-time Linux or VxWorks with sub-millisecond cycle times for stepper and servo control loops. The integrated USB 2.0 host enables local HMI panel attachment, while the SRIO interface provides deterministic machine-to-machine communication for high-speed sensor arrays. Factory automation controllers value the long lifecycle and long-term silicon guarantee NXP provides for industrial sockets, typically 10+ years of support.
Empfohlen
Defense and Aerospace Subsystem
Built around Power Architecture heritage trusted by defense contractors, the P2010NSE2HHC serves avionics and ground-vehicle subsystems where mil-spec reliability, serial RapidIO, and rugged BGA packaging are required. The 689-TEPBGA II package supports extended temperature screening at 0 to +125 C, with conformal coating compatibility, and the SEC engine provides hardware-accelerated Type-1-compatible crypto for sensitive command-link encryption. Mission computers, tactical-radio gateways, and unmanned-vehicle controllers routinely use this part on VPX or VME backplane cards.
Empfohlen
Multi-Protocol Industrial Gateway
The P2010NSE2HHC's mix of GbE, PCIe, SRIO, USB, and SEC makes it ideal for industrial gateways that bridge PROFINET, EtherCAT, Modbus TCP, and proprietary automation protocols to cloud or IT infrastructure. The 800 MHz core can run container-isolated protocol stacks concurrently while the SEC engine secures MQTT or HTTPS traffic. Reference designs connect the SoC to NXP LS1046A through SRIO for higher-layer cloud-edge compute, or to a single GbE uplink for leaner deployments.
Empfohlen
Secure Payment Terminal
The P2010NSE2HHC's hardware SEC engine plus the need for PCI-PTS-grade tamper detection push the part into secure payment terminal designs. The integrated AES/3DES/SHA engine handles PIN-block encryption and EMV authentication without dedicated crypto co-processors, while the DDR3 ECC path protects against fault injection on the key tables. The 689-TEPBGA II thermally enhanced package allows fanless operation inside the locked enclosure required by PCI-PTS. Recommended pairings include external secure elements such as TDA8007 or Maxim's DeepCover secure microcontrollers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P2010NSE2HHC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P2010NSE2MHC | P2020NSE2MHC | P1011NSE2HFC | ||
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | ||
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) |
| Core Count | 1 (single-core) | 1 (single-core) | 2 (dual-core) | 1 (single-core) | 2 (dual-core) | 1 (single-core) |
| Core Frequency | 800 MHz | 800 MHz | 1.0-1.33 GHz | 800 MHz | 1.0-1.2 GHz | 800 MHz |
| Operating Temperature | 0 C to +125 C | -40 C to +125 C | -40 C to +125 C | 0 C to +125 C | 0 C to +105 C | 0 C to +105 C |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| PCIe | Yes (PCI Express) | Yes | Yes | Yes (reduced lanes) | Yes | Yes (reduced lanes) |
| SEC Crypto Engine | Yes (AES / 3DES / SHA) | Yes | Yes | Yes | Yes | Yes |
| Silicon Revision | Rev 2.1 | Rev 2.1 | Rev 2.1 | Rev 1.x | Rev 1.x | Rev 1.x |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Most balanced cost/perf tier in the QorIQ P2 family (vs. P1011NSE2HFC)
- Single-core, lower thermal envelope vs dual-core (vs. P2020NSE2MHC)
- Latest silicon revision captures all errata fixes (vs. P2020NSE2HFC (Rev 1.x))
Designhinweise
Estimated: at 800 MHz core and full I/O bandwidth, the P2010NSE2HHC may dissipate on the order of 5-9 W under worst-case workload. The 689-TEPBGA II package exposes a top-side thermal pad intended for direct heatsink attachment. Designers must use a thermal interface material rated for at least 4 W/mK conductivity and add a finned heatsink or chassis-cold-wall contact to hold Tj within the 0 to +125 C spec in fanless deployments. Reference NXP application note AN4393 for layout pad-pattern guidelines.
Per NXP layout guidelines for QorIQ P2, use a high-density interconnect (HDI) PCB with stacked micro-vias to escape the 689-ball grid. The DDR3 controller requires matched-length traces within 25 mil tolerance between byte groups; a 4-layer or 6-layer stackup with dedicated ground and supply planes reduces EMI. Series resistors on SRIO and PCIe signals should be placed close to the SoC balls, not at the connector. See AN4224 for routing examples.
Estimated: the P2010NSE2HHC needs a multi-rail power supply delivering 1.0 V core, 1.5 V DDR3, 2.5 V USB PHY, 3.3 V I/O, and an RF AUX supply. Plan for a combined 8 A peak on the core rail using a buck regulator with PMBus telemetry and voltage-positioning. Use NXP's power-sequencing recommendations: core voltage must come up before I/O to avoid latch-up, and any PVREGs follow the boot ROM monitoring. Reference NXP reference designs use the MP5461 or similar multi-output PMIC.
Common pitfalls: (1) forgetting to populate the e500v2 JTAG pull-up resistors, causing debug-port silence during bring-up; (2) leaving the CFG_RC pin floating, which lets the SERDES reference clock mode float; (3) routing eLBC signals across plane splits and creating noise on external bus transactions; (4) exceeding the maximum toggling load on the Global Utilities clock domain. Always read the latest NXP device errata (P2_2.1_ERRATA) before committing the schematic to layout.
Compliance-Informationen
RoHS Compliant and Lead Free per chipdig.com part attributes. Industrial-temperature (0 to +125 C) but not AEC-Q100 automotive qualified. Halogen free per NXP product environmental compliance statements.
