P2010NSE2HHC - QorIQ P2010 800MHz e500v2 SoC | NXP
N.º da peça: P2010NSE2HHC ✓ AtivoP2010NSE2HHC Visão geral
An SoC (System-on-Chip) is an integrated circuit that consolidates CPU, memory controllers, and peripheral interfaces into a single silicon device, eliminating the multi-chip overhead typical of legacy processor-plus-coprocessor designs. The QorIQ P2010/P2020 family is NXP's communications-platform evolution of the PowerQUICC line, designed for high performance per watt in single- and dual-core networking, industrial control, and embedded computing applications. The series scales from a single-core 533 MHz P1011 to a dual-core 1.33 GHz P2020 while sharing one common pinout footprint.
Key features include the e500v2 32-bit core with double-precision FPU, hardware ECC on the DDR2/DDR3 controller with up to 32-bit addressing, an integrated SEC security engine accelerating AES, 3DES, and SHA-1/2, four GbE ports, two PCIe controllers, two SRIO interfaces, USB 2.0 with PHY, and the Enhanced Local Bus Controller (eLBC). The 800 MHz core frequency is targeted at mainstream wired/wireless infrastructure, factory automation, and defense/aerospace subsystems.
The P2010NSE2HHC operates across 0 to 125 C junction temperature per the NXP datasheet, making it suitable for thermally demanding industrial enclosures and outdoor telecom equipment. The TEPBGA II package exposes a thermal pad on the top side for direct heatsink attachment, while the 31x31 mm body accommodates 689 balls on a 1 mm pitch for high-density PCB layouts.
Typical applications include industrial Ethernet switches, ruggedized military routers, factory automation controllers, and multi-protocol industrial gateways where deterministic real-time performance and long product lifecycles are required. The integrated SEC engine and ECC-protected memory also suit secure payment terminals and railway signaling.
When designing with this device, follow NXP reference-design power-sequencing guidelines and ensure the exposed-pad thermal interface carries sufficient copper pour or an attached heatsink to keep junction temperature in spec under worst-case operating loads.
Alternativas drop-in para P2010NSE2HHC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P2010NSE2HHC (mesmo formato e footprint) — diferindo em USB, Package, RoHS Status, Core Count, Operating Temperature.
P2010NSE2MHC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2020NSE2MHC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1011NSE2HFC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2020NSE2HFC
✅ Drop-InConsulte o preço
Ver ficha técnica →P1011NSE2HHB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2010NSE2HHC Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Part Family | QorIQ P2 (P2010/P2020) |
| Processor Type | PowerPC e500v2 |
| Core Count | 1 (single-core) |
| Data Path Width | 32-bit |
| Core Frequency | 800 MHz |
| Temperatura de operação | 0 C to +125 C |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Gigabit Ethernet (multiple ports) |
| PCIe | Yes (PCI Express) |
| Serial RapidIO (SRIO) | Yes |
| USB | Yes (USB 2.0 with PHY) |
| Security Engine (SEC) | Yes (AES / 3DES / SHA) |
| Encapsulamento | 689-TEPBGA II (31x31 mm) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | RoHS Compliant |
| Lead Free Status | Lead Free |
| Packaging | Tray |
| Silicon Revision | Rev 2.1 |
Guia de Configuração de Pinos do P2010NSE2HHC 689-tepbga ii (31x31 mm)
Configuração de pinos para P2010NSE2HHC (pacote 689-tepbga ii (31x31 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P2010NSE2HHC.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P2010NSE2HHC é adequado para 6 aplicaçãos: Industrial Ethernet Switch, Ruggedized Industrial Router, Factory Automation Controller, Defense and Aerospace Subsystem, Multi-Protocol Industrial Gateway, Secure Payment Terminal.
Industrial Ethernet Switch
The P2010NSE2HHC's integrated multiple Gigabit Ethernet ports with hardware QoS queueing make it well matched for managed industrial Ethernet switches running protocols such as PROFINET, EtherNet/IP, and Modbus TCP. At 800 MHz the e500v2 core can service wire-speed L2 forwarding on 4 GbE ports while leaving headroom for PTP and network management tasks. The DDR2/DDR3 controller with ECC supports long uptime under industrial temperature stress, and the 689-TEPBGA II package fits the larger DIN-rail-mounted switch enclosures. Designers typically pair it with NXP VSC8512 PHYs and an external SerDes reference clock for full port density in ring-topology switches.
Recomendado
Ruggedized Industrial Router
The P2010NSE2HHC integrates PCI Express, Serial RapidIO, USB 2.0, and the SEC crypto engine on a single die, removing multiple bridge chips typically required for cellular and wireless industrial routers. The integrated SEC accelerator offloads AES-128 for IPsec VPN tunnels, and the 0 C to +125 C operating range tolerates outdoor cabinet environments. With DDR3 ECC the platform meets NEBS-style vibration and shock requirements on a fanless thermal design. Recommended reference implementations pair the SoC with NXP T1040 family silicon for parallel packet-path processing or with Qualcomm LTE modems for cellular backhaul.
Recomendado
Factory Automation Controller
The P2010NSE2HHC is suitable for a PLC-class factory automation controller that needs deterministic motion control and multi-protocol machine communication. The e500v2 core at 800 MHz can execute real-time Linux or VxWorks with sub-millisecond cycle times for stepper and servo control loops. The integrated USB 2.0 host enables local HMI panel attachment, while the SRIO interface provides deterministic machine-to-machine communication for high-speed sensor arrays. Factory automation controllers value the long lifecycle and long-term silicon guarantee NXP provides for industrial sockets, typically 10+ years of support.
Recomendado
Defense and Aerospace Subsystem
Built around Power Architecture heritage trusted by defense contractors, the P2010NSE2HHC serves avionics and ground-vehicle subsystems where mil-spec reliability, serial RapidIO, and rugged BGA packaging are required. The 689-TEPBGA II package supports extended temperature screening at 0 to +125 C, with conformal coating compatibility, and the SEC engine provides hardware-accelerated Type-1-compatible crypto for sensitive command-link encryption. Mission computers, tactical-radio gateways, and unmanned-vehicle controllers routinely use this part on VPX or VME backplane cards.
Recomendado
Multi-Protocol Industrial Gateway
The P2010NSE2HHC's mix of GbE, PCIe, SRIO, USB, and SEC makes it ideal for industrial gateways that bridge PROFINET, EtherCAT, Modbus TCP, and proprietary automation protocols to cloud or IT infrastructure. The 800 MHz core can run container-isolated protocol stacks concurrently while the SEC engine secures MQTT or HTTPS traffic. Reference designs connect the SoC to NXP LS1046A through SRIO for higher-layer cloud-edge compute, or to a single GbE uplink for leaner deployments.
Recomendado
Secure Payment Terminal
The P2010NSE2HHC's hardware SEC engine plus the need for PCI-PTS-grade tamper detection push the part into secure payment terminal designs. The integrated AES/3DES/SHA engine handles PIN-block encryption and EMV authentication without dedicated crypto co-processors, while the DDR3 ECC path protects against fault injection on the key tables. The 689-TEPBGA II thermally enhanced package allows fanless operation inside the locked enclosure required by PCI-PTS. Recommended pairings include external secure elements such as TDA8007 or Maxim's DeepCover secure microcontrollers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P2010NSE2HHC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P2010NSE2MHC | P2020NSE2MHC | P1011NSE2HFC | ||
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | ||
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) |
| Core Count | 1 (single-core) | 1 (single-core) | 2 (dual-core) | 1 (single-core) | 2 (dual-core) | 1 (single-core) |
| Core Frequency | 800 MHz | 800 MHz | 1.0-1.33 GHz | 800 MHz | 1.0-1.2 GHz | 800 MHz |
| Operating Temperature | 0 C to +125 C | -40 C to +125 C | -40 C to +125 C | 0 C to +125 C | 0 C to +105 C | 0 C to +105 C |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| PCIe | Yes (PCI Express) | Yes | Yes | Yes (reduced lanes) | Yes | Yes (reduced lanes) |
| SEC Crypto Engine | Yes (AES / 3DES / SHA) | Yes | Yes | Yes | Yes | Yes |
| Silicon Revision | Rev 2.1 | Rev 2.1 | Rev 2.1 | Rev 1.x | Rev 1.x | Rev 1.x |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
Principais diferenciais
- Most balanced cost/perf tier in the QorIQ P2 family (vs P1011NSE2HFC)
- Single-core, lower thermal envelope vs dual-core (vs P2020NSE2MHC)
- Latest silicon revision captures all errata fixes (vs P2020NSE2HFC (Rev 1.x))
Notas de projeto
Estimated: at 800 MHz core and full I/O bandwidth, the P2010NSE2HHC may dissipate on the order of 5-9 W under worst-case workload. The 689-TEPBGA II package exposes a top-side thermal pad intended for direct heatsink attachment. Designers must use a thermal interface material rated for at least 4 W/mK conductivity and add a finned heatsink or chassis-cold-wall contact to hold Tj within the 0 to +125 C spec in fanless deployments. Reference NXP application note AN4393 for layout pad-pattern guidelines.
Per NXP layout guidelines for QorIQ P2, use a high-density interconnect (HDI) PCB with stacked micro-vias to escape the 689-ball grid. The DDR3 controller requires matched-length traces within 25 mil tolerance between byte groups; a 4-layer or 6-layer stackup with dedicated ground and supply planes reduces EMI. Series resistors on SRIO and PCIe signals should be placed close to the SoC balls, not at the connector. See AN4224 for routing examples.
Estimated: the P2010NSE2HHC needs a multi-rail power supply delivering 1.0 V core, 1.5 V DDR3, 2.5 V USB PHY, 3.3 V I/O, and an RF AUX supply. Plan for a combined 8 A peak on the core rail using a buck regulator with PMBus telemetry and voltage-positioning. Use NXP's power-sequencing recommendations: core voltage must come up before I/O to avoid latch-up, and any PVREGs follow the boot ROM monitoring. Reference NXP reference designs use the MP5461 or similar multi-output PMIC.
Common pitfalls: (1) forgetting to populate the e500v2 JTAG pull-up resistors, causing debug-port silence during bring-up; (2) leaving the CFG_RC pin floating, which lets the SERDES reference clock mode float; (3) routing eLBC signals across plane splits and creating noise on external bus transactions; (4) exceeding the maximum toggling load on the Global Utilities clock domain. Always read the latest NXP device errata (P2_2.1_ERRATA) before committing the schematic to layout.
Informações de conformidade
RoHS Compliant and Lead Free per chipdig.com part attributes. Industrial-temperature (0 to +125 C) but not AEC-Q100 automotive qualified. Halogen free per NXP product environmental compliance statements.
