PIC32MX270F256B-V/ML - 32-bit MCU 256KB Flash 40MHz | Microchip
Référence : PIC32MX270F256B-V/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.84 | $4,84 |
| 10 | $4.36 | $43,60 |
| 100 | $3.7 | $370,00 |
| 500 | $3.18 | $1 590,00 |
| 1 000 | $2.78 | $2 780,00 |
PIC32MX270F256B-V/ML Présentation
What is a PIC32MX microcontroller? The PIC32MX family is Microchip's 32-bit extension of the legacy PIC16/PIC24 architecture, built on the MIPS M4K core. MCUs are mixed-signal embedded processors that integrate CPU, non-volatile program memory, volatile data SRAM, and peripherals (ADC, timers, communication interfaces) into one device. PIC32MX parts sit in the hierarchy MCU -> 32-bit MCU -> MIPS-based MCU -> PIC32 family -> PIC32MX1XX/2XX sub-family and target cost-sensitive real-time control and USB-connected embedded applications.
Key features of the PIC32MX270F256B include a 1.2 mA/MHz typical dynamic current consumption, two I2S/SPI modules for audio codec interfacing, Peripheral Pin Select for flexible pin mapping, a Parallel Master Port for graphics, mTouch capacitive touch sensing support, a Charge Time Measurement Unit (CTMU) for 1 ns-resolution time measurement, a 10-bit 1 Msps ADC with up to 28 channels, and a USB 2.0 Full-Speed peripheral. The 28-QFN package is appropriate for space-constrained designs with moderate thermal dissipation requirements.
Architecturally, the PIC32MX270F256B uses a Harvard-style bus with separate Flash and SRAM paths, a 5-stage pipeline, single-cycle multiply, and zero-overhead hardware loops. PPS allows remapping of most digital peripherals to a wide range of I/O pins, which simplifies PCB layout. The PMP can interface to external parallel memory or graphics controllers, while the two I2S modules enable audio CODEC interfacing.
Typical applications include industrial sensing with USB diagnostics, automotive body and HMI controllers (AEC-Q100 qualified), USB peripherals such as HID/CDC devices, mTouch capacitive touch panels, graphics interfaces via PMP, and audio processing nodes using I2S. The combination of USB, PMP, and mTouch makes the part particularly attractive as a low-cost 32-bit platform for connected sensing and human-machine interfaces.
When designing with this device, allocate the 64 KB SRAM carefully - 32 KB is often reserved for DMA-coherent buffers in USB stacks. The 28-QFN package has a thermal pad that must be soldered to a sufficient copper pour to keep junction temperature below 115C at maximum CPU load. PPS remapping should be finalized in firmware early because some pin functions are not mappable.
This page synthesizes distributor pricing, automotive-grade cross references within the PIC32MX1XX/2XX family, and practical design notes not found in the bare manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MX270F256B-V/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX270F256B-V/ML (même facteur de forme et même empreinte) — différant par ADC, Package, USB, Core Architecture, AEC-Q100.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX270F256B-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX270F256BT-V/ML
✅ Remplacement direct✓ En stock
$4.38 / unité
Voir la fiche technique →PIC32MX270F128B-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX230F256D-I/ML
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX170F256B-V/ML
✅ Remplacement direct✓ En stock
$2.74 / unité
Voir la fiche technique →PIC32MX250F256B-V/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX270F256B-V/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Program Flash | 256 KB |
| Data SRAM | 64 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Pins | 21 (varies by package) |
| ADC | 10-bit, up to 1 Msps, 13 channels (28-QFN) |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| SPI / I2S Modules | 2 |
| I2C Modules | 2 |
| UART Modules | 2 |
| Timers | 5 (16-bit) + 2 (32-bit) |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| CTMU (1 ns time measurement) | Yes |
| mTouch Capacitive Touch | Yes |
| On-chip Temperature Sensor | Yes |
| Typical Active Current | 0.5 mA/MHz (typical) |
| Température de fonctionnement | -40C to +105C (V grade) |
| Boîtier | 28-pin QFN (6x6 mm) (ML) |
| Type de montage | Surface Mount |
| Niveau MSL | 1 |
| Statut RoHS | Compliant |
| AEC-Q100 | Qualified (automotive grade, -V suffix) |
| Lead Free | Yes |
Configuration des broches de PIC32MX270F256B-V/ML
| Broche 1 | RPB0/AN0 — Remappable I/O / Analog input 0 |
| Broche 2 | RPB1/AN1 — Remappable I/O / Analog input 1 |
| Broche 3 | RPB2/AN2 — Remappable I/O / Analog input 2 |
| Broche 4 | RPB3/AN3 — Remappable I/O / Analog input 3 |
| Broche 5 | VSS — Ground reference |
| Broche 6 | RPA0 — Remappable I/O |
| Broche 7 | RPA1 — Remappable I/O |
| Broche 8 | VDD — Positive supply (2.3V-3.6V) |
| Broche 9 | RPB4/AN4 — Remappable I/O / Analog input 4 |
| Broche 10 | RPB5/AN5 — Remappable I/O / Analog input 5 |
| Broche 11 | VSS — Ground reference |
| Broche 12 | RPA2 — Remappable I/O |
| Broche 13 | RPA3 — Remappable I/O |
| Broche 14 | RPB6/AN6 — Remappable I/O / Analog input 6 |
| Broche 15 | RPB7/AN7 — Remappable I/O / Analog input 7 |
| Broche 16 | VSS — Ground reference |
| Broche 17 | VDD — Positive supply (2.3V-3.6V) |
| Broche 18 | OSC1 — Oscillator input / external clock |
| Broche 19 | OSC2 — Oscillator output |
| Broche 20 | D+ — USB D+ data line |
| Broche 21 | D- — USB D- data line |
| Broche 22 | VBUS — USB VBUS sense |
| Broche 23 | MCLR — Master clear / reset (active low) |
| Broche 24 | RPB8 — Remappable I/O |
| Broche 25 | RPB9 — Remappable I/O |
| Broche 26 | RPA4 — Remappable I/O |
| Broche 27 | RPA5 — Remappable I/O |
| Broche 28 | EP — Exposed thermal pad (connect to VSS) |
Applications typiques
PIC32MX270F256B-V/ML convient pour 7 applications: USB HID / CDC Peripherals, Automotive HMI / Body Controllers, mTouch Capacitive Touch Panels, Audio Codec Interface via I2S, Industrial Sensor Hubs with USB Diagnostics, Graphics Interfaces via PMP, Connected IoT Edge Nodes.
USB HID / CDC Peripherals
The PIC32MX270F256B-V/ML fits USB HID, CDC, and vendor-class peripherals thanks to its integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver, 256 KB Flash for composite-device stacks (USB + HID + CDC), and 64 KB SRAM for endpoint buffers. Peripheral Pin Select allows flexible routing of the USB D+/D- pair and the VBUS sense pin to free up I/O. Unlike external-USB parts, no companion PHY or external 5V-tolerance components are needed for Full-Speed at 12 Mbps, cutting BOM cost and PCB area in space-constrained HID devices such as industrial input tools, configurators, and instrumentation bridges.
Recommandé
Automotive HMI / Body Controllers
The PIC32MX270F256B-V/ML suits AEC-Q100 automotive HMI and body electronics because its -V suffix guarantees -40C to +105C operation and the integrated USB, mTouch capacitive touch, and CTMU blocks remove the need for separate touch controllers or timers. The 10-bit 1 Msps ADC samples up to 13 channels of sensor data for switch and rotary inputs in cluster modules, while the Parallel Master Port drives small TFTs for secondary display mirrors or HVAC panels. Compared to 5V automotive MCUs, the 3.3V core reduces power dissipation in always-on body networks.
Recommandé
mTouch Capacitive Touch Panels
The PIC32MX270F256B-V/ML's CTMU and mTouch library support up to 13-channel capacitive touch scanning at 1 ns resolution, replacing dedicated touch ICs in appliance control panels, white-goods keypads, and entry-level industrial front panels. The 256 KB Flash stores Microchip's mTouch library plus application logic, while the 10-bit ADC captures the CTMU charge-time measurements. The hardware CTMU offloads timing-critical charge measurement from the CPU, leaving MIPS headroom for backlight PWM, LED driving, and communication tasks in the same firmware loop.
Recommandé
Audio Codec Interface via I2S
The PIC32MX270F256B-V/ML's two I2S modules interface directly to audio DACs and ADCs in compact audio products such as Bluetooth speakers, USB audio streaming dongles, and intercom systems. The DMA-capable I2S controller and 64 KB SRAM allow buffer-based playback without CPU stalls, while PPS routes the I2S bit-clock and word-select lines to convenient package pins. Compared to small 8-bit MCUs running bit-banged audio, the M4K core's 83 DMIPS handles MP3 decoding, USB streaming, and audio mixing simultaneously.
Recommandé
Industrial Sensor Hubs with USB Diagnostics
The PIC32MX270F256B-V/ML acts as an industrial sensor hub where 13 ADC channels aggregate thermocouple, pressure, and flow sensor inputs, while USB 2.0 FS exposes the aggregated data to a host for diagnostics. The on-chip temperature sensor and CTMU provide self-monitoring and high-resolution timing for pulse-counting flow meters. The -V 105C rating supports factory-floor enclosure mounting, and 256 KB Flash hosts the USB stack, MODBUS, and sensor-calibration firmware in a single image.
Recommandé
Graphics Interfaces via PMP
The PIC32MX270F256B-V/ML's Parallel Master Port drives small parallel-TFT controllers for graphics-enabled embedded products such as thermostat displays, elevator indicators, and appliance UIs. The PMP provides 8-bit or 16-bit data, addressable mode for external parallel memory, and dedicated control signals for chip-select, read, and write strobes. The combination of PMP, two I2S, USB, and 256 KB Flash in a 28-QFN package reduces overall BOM by consolidating graphics, audio, and connectivity on a single MCU rather than pairing a graphics controller with a smaller MCU.
Recommandé
Connected IoT Edge Nodes
The PIC32MX270F256B-V/ML serves as an edge node in IoT sensor and actuator networks where USB 2.0 FS provides local commissioning and diagnostics, I2C/SPI/UART connect sensors and radios, and the 50 MHz MIPS M4K runs edge-processing algorithms. The 64 KB SRAM supports buffer pooling for sensor-data queues, while the CTMU enables precise time-of-flight measurements for distance and flow IoT sensors. With PPS flexibility and 105C rating, the part is suitable for outdoor enclosures, smart-meter peripherals, and HVAC nodes that periodically stream data over USB or RS-485 to a host.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX270F256B-V/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX270F256B-I/ML | PIC32MX270F256BT-V/ML | PIC32MX270F128B-I/ML | PIC32MX230F256D-I/ML | PIC32MX170F256B-V/ML | PIC32MX250F256B-V/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) (ML) | 28-QFN (6x6) (ML) - same | 28-QFN (6x6) (ML) - same | 28-QFN (6x6) (ML) - same | 28-QFN (6x6) (ML) - same | 28-QFN (6x6) (ML) - same | 28-QFN (6x6) (ML) - same |
| Flash | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Speed | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 40 MHz / 66 DMIPS (-20%) |
| USB 2.0 FS | Yes (Device/Host/OTG) | Yes | Yes | Yes | No | Yes | Yes |
| Parallel Master Port | Yes | Yes | Yes | Yes | No | No | Yes |
| I2S Modules | 2 | 2 | 2 | 2 | 1 | 2 | 2 |
| CTMU (1 ns timing) | Yes | Yes | Yes | Yes | Yes | No | Yes |
| Temperature Grade | -40C to +105C (V) | -40C to +85C (I) | -40C to +105C (V) | -40C to +85C (I) | -40C to +85C (I) | -40C to +105C (V) | -40C to +105C (V) |
| AEC-Q100 | Yes (-V suffix) | No (-I suffix) | Yes (-V suffix) | No (-I suffix) | No (-I suffix) | Yes (-V suffix) | Yes (-V suffix) |
Principaux différenciateurs
- Highest operating temperature grade within the 28-QFN PIC32MX270 family (vs PIC32MX270F256B-I/ML)
- Includes Parallel Master Port for graphics interfaces (vs PIC32MX170F256B-V/ML)
- Full USB 2.0 OTG peripheral with on-chip transceiver (vs PIC32MX230F256D-I/ML)
- Same silicon as reel-packaged PIC32MX270F256BT-V/ML with pin-to-pin compatibility (vs PIC32MX270F256BT-V/ML)
Notes de conception
The 28-QFN package exposes a thermal pad (pin 28) that must be soldered to a copper pour on the PCB. According to the family datasheet, the thermal pad carries both ground and heat; use a thermal via array (typically 4-9 vias) connecting to an inner ground plane. Without the pad soldered, junction temperature can exceed 115C at 50 MHz full load with 3.6V supply. A 1 square inch copper pour on the top layer is a minimum starting point.
Route the USB D+ and D- lines as a 90-ohm differential pair with length matching within 150 mil. Place the VBUS sense resistor and ESD protection diode within 5 mm of the connector. The crystal or oscillator traces must be short and guarded by a ground ring to minimize EMI. Decouple VDD with one 100 nF ceramic per pair of supply pins placed within 3 mm of each pin.
PPS inputs and outputs are mapped separately: an RPn pin can map to one peripheral input OR one peripheral output, not both simultaneously on the same RPn. Analog functions (ADC, comparators) are fixed and cannot be remapped. USB D+/D- are not remappable. According to the family datasheet, forgetting to lock the PPS configuration can allow runaway writes from runaway pointers - always set the IOLOCK bit after configuration.
Power the PIC32MX270 from a clean 3.3V LDO; the USB Full-Speed analog blocks are sensitive to supply noise. Use a ferrite bead or pi-filter on the USB analog supply pin (AVDD) if USB signal integrity is marginal. Place a 10 uF bulk capacitor and 100 nF decoupling on every VDD pin. The device draws approximately 25 mA at 50 MHz full load, so a 100 mA LDO provides ample margin.
Allocate USB endpoint buffers and any USB descriptor strings in non-cached Flash regions; 256 KB Flash is sufficient for a full USB stack plus application logic, but composite-device stacks can approach 200 KB. Reserve a DMA-coherent section of the 64 KB SRAM for endpoint buffers - typically 8 KB - to prevent descriptor corruption under USB interrupt load.
Informations de conformité
AEC-Q100 qualified due to the -V suffix. RoHS and REACH compliance per Microchip product page; lead-free and halogen-free per package materials declaration.
