PIC32MZ1024EFE100-E/GJX - 200MHz 1MB Flash MCU | Microchip
Teilenummer: PIC32MZ1024EFE100-E/GJX ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.94 | $8,94 |
| 10 | $8.05 | $80,50 |
| 100 | $7.16 | $716,00 |
| 500 | $6.27 | $3.135,00 |
| 1.000 | $5.38 | $5.380,00 |
PIC32MZ1024EFE100-E/GJX Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals. The PIC32MZ EF family belongs to the broader MIPS32 architecture lineage, now part of Microchip's portfolio, and targets high-performance embedded connectivity. Within Microchip's taxonomy, this part sits at Microcontroller > 32-bit MCU > PIC32 > PIC32MZ EF family. Synonyms in the field include MCU, embedded controller, and host processor. The EF family is distinguished by an integrated FPU and DSP-enhanced core with four 64-bit accumulators, single-cycle MAC, saturating and fractional math.
Key features of the PIC32MZ1024EFE100-E/GJX include 200 MHz CPU operation with 330 DMIPS, 1 MB dual-panel Live-Update Flash enabling in-field firmware upgrades without downtime, 256 KB SRAM (vs 512 KB on the top-tier EF devices), and HS USB, Ethernet, CAN, and multiple serial interfaces. The device integrates 12-bit ADC modules, analog comparators, and a graphics-compatible parallel master port for HMI applications. The 100-TFBGA package at 7x7 mm provides high-density I/O for designs requiring extensive connectivity.
Architecturally, the device uses the MIPS Warrior M-class core with IEEE 754-compliant FPU. Dual-panel Flash allows firmware to run from one panel while the other is being reprogrammed, enabling fail-safe Live-Update firmware upgrades. The part is AEC-Q100 qualified, supporting automotive operating temperature range -40C to +125C (the 'E' suffix denotes -40C to +125C extended temperature).
Typical applications include industrial IoT gateways, automotive body and infotainment controllers, HMI/graphical displays, motor control drives, and connected sensor hubs. The combination of large Flash, Ethernet, and HS USB makes it a strong fit for connected industrial equipment requiring secure, field-upgradable firmware.
When designing with this part, ensure adequate decoupling on all VDD/VSS pairs (typically 100 nF ceramic per pair) and route the HS USB differential pair with 90 ohm differential impedance. Plan Flash bank selection in software to leverage the Live-Update feature, which requires reserving one panel as the backup image.
This page synthesizes distributor pricing from DigiKey, Mouser, and LCSC, parametric drop-in alternatives within the PIC32MZ EF family, and practical design notes beyond the manufacturer datasheet.
Drop-in-Alternativen für PIC32MZ1024EFE100-E/GJX – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFE100-E/GJX (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, FPU, Operating Temperature, ADC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFE100-I/GJX
✅ Drop-In✓ Auf Lager
$2.78 / Stück
Datenblatt ansehen →PIC32MZ1024EFG100-E/GJX
✅ Drop-In✓ Auf Lager
$9.98 / Stück
Datenblatt ansehen →PIC32MZ1024ECH100-I/PF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$8.74 / Stück
Datenblatt ansehen →PIC32MZ1024EFK100-I/GJX
✅ Drop-In✓ Auf Lager
$5.41 / Stück
Datenblatt ansehen →PIC32MZ0512EFK100-E/GJX
✅ Drop-In✓ Auf Lager
$9.65 / Stück
Datenblatt ansehen →PIC32MZ1024EFE100-E/GJX Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M-Class (MIPS Warrior) |
| CPU Core | 32-bit Single-core |
| Maximum CPU Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754-compliant (integrated) |
| DSP Extensions | 4x 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| Program Flash Memory | 1 MB (1M x 8), Dual-Panel Live-Update |
| SRAM | 256 KB |
| Operating Voltage | 3.3 V typical (2.0V-3.6V core range) |
| Betriebstemperatur | -40C to +125C (extended, -E suffix) |
| Gehäuse | 100-pin TFBGA (7x7 mm) |
| Montageart | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| RoHS-Status | Compliant |
PIC32MZ1024EFE100-E/GJX 100-pin tfbga (7x7 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ1024EFE100-E/GJX (100-pin tfbga (7x7 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ1024EFE100-E/GJX.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ1024EFE100-E/GJX ist geeignet für 6 Anwendungs: Industrial IoT Gateway, Automotive Body Controller, HMI and Graphical Display Controller, Motor Control Drive, Connected Sensor Hub, USB Peripheral Device Controller.
Industrial IoT Gateway
The PIC32MZ1024EFE100-E/GJX is well-suited for industrial IoT gateways thanks to its integrated 10/100 Ethernet MAC, HS USB 2.0, CAN 2.0B, and multiple UART/SPI/I2C interfaces in a single chip. Its 200 MHz MIPS Warrior core with FPU runs MQTT, Modbus TCP, or proprietary protocols while processing sensor data with 330 DMIPS of headroom. The 1 MB dual-panel Flash enables fail-safe firmware upgrades over the air, critical for deployed gateways. The automotive-grade -40C to +125C temperature range ensures operation in factory floors and outdoor enclosures without thermal derating.
Empfohlen
Automotive Body Controller
The PIC32MZ1024EFE100-E/GJX's AEC-Q100 qualification and extended -40C to +125C operating range make it a strong fit for automotive body and chassis controllers. The CAN 2.0B interface connects directly to vehicle CAN buses for body control modules, lighting, and door/window management. The 200 MHz MIPS core with DSP extensions handles motor control loops for seat positioning and mirror adjustment. The 100-TFBGA compact package fits space-constrained under-dash locations. Hardware cryptographic accelerators support secure firmware boot.
Empfohlen
HMI and Graphical Display Controller
The PIC32MZ1024EFE100-E/GJX drives small to medium graphical TFT displays via its integrated Parallel Master Port (PMP) at up to 252 MHz family speeds. The FPU accelerates 2D rendering operations, and the 256 KB SRAM holds framebuffers for QVGA/WQVGA displays. The HS USB interface supports touch screen data from USB-capable touch controllers. The 1 MB Flash stores GUI assets, fonts, and multilingual strings. The automotive temperature grade allows deployment in dashboard and industrial operator panels.
Empfohlen
Motor Control Drive
The PIC32MZ1024EFE100-E/GJX executes field-oriented control (FOC) algorithms for brushless DC and permanent magnet motors using its DSP-enhanced core with 64-bit accumulators and single-cycle MAC. The high-resolution PWM modules and 12-bit ADC modules at 200 MHz core speeds close current loops in under 5 microseconds. The 1 MB Flash stores multi-motor profiles, while the 256 KB SRAM handles real-time control variables. The automotive temperature grade suits traction motor and e-bike applications.
Empfohlen
Connected Sensor Hub
The PIC32MZ1024EFE100-E/GJX aggregates data from multiple sensor types (temperature, pressure, motion) via its I2C, SPI, and UART interfaces, processes them with the 200 MHz MIPS core, and forwards aggregated data over Ethernet or USB. The 256 KB SRAM buffers sensor bursts before transmission. The dual-panel Flash enables safe OTA firmware updates in remote sensor installations. AEC-Q100 qualification supports under-hood and outdoor sensor deployments.
Empfohlen
USB Peripheral Device Controller
The PIC32MZ1024EFE100-E/GJX's integrated HS USB 2.0 controller with host, device, and OTG capability makes it ideal for USB peripherals such as data loggers, programmable instruments, and industrial test equipment. The 200 MHz MIPS core handles USB protocol stack and application logic simultaneously. The 1 MB Flash stores firmware with room for USB class drivers (CDC, HID, MSC, Vendor). The compact 100-TFBGA package fits dongle-style form factors.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFE100-E/GJX – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFE100-I/GJX | PIC32MZ1024EFG100-E/GJX | PIC32MZ1024EFK100-I/GJX | PIC32MZ0512EFK100-E/GJX |
|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB / 2 MB options | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 512 KB | 512 KB |
| Temperature Grade | -40C to +125C (AEC-Q100) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (AEC-Q100) |
| Live-Update Flash | Yes (Dual-panel) | Yes (Dual-panel) | Yes (Dual-panel) | Yes (Dual-panel) | Yes (Dual-panel) |
| FPU | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) |
Wichtigste Unterscheidungsmerkmale
- Automotive AEC-Q100 qualification with -40C to +125C extended temperature (vs. PIC32MZ1024EFE100-I/GJX)
- Dual-panel Live-Update Flash for fail-safe OTA firmware upgrades (vs. PIC32MX575F512L)
- Integrated FPU with DSP-enhanced core for floating-point and signal processing (vs. PIC32MX570F512LT-I/GJX)
Designhinweise
The PIC32MZ1024EFE100-E/GJX operates from a single 3.3V supply with separate core voltage rails generated internally. Place 100 nF decoupling capacitors as close as possible to every VDD/VSS pin pair, plus a 10 uF bulk capacitor near the package. Estimated: at 200 MHz active current draw reaches approximately 80-100 mA, requiring the bulk capacitor to handle transient load steps. Use a low-impedance ground plane to minimize supply noise.
The 100-TFBGA package requires microvia technology for fan-out; standard 0.1 mm pitch BGAs are within mainstream PCB fabrication capabilities. Use 0.4 mm via-in-pad or dog-bone fan-out with 0.2 mm/8 mil trace and space. Escape the inner ball rows through microvias to inner signal layers. The 7x7 mm package is small enough for 4-layer PCB designs without HDI technology, but 6-layer designs improve signal integrity for HS USB and Ethernet differential pairs.
Route the HS USB D+/D- differential pair with 90 ohm differential impedance, matching trace length within 150 mil. The Ethernet RMII/RGMII signals to an external PHY must also be length-matched. Place the 25 MHz or 24 MHz crystal within 5 mm of the OSC1/OSC2 pins with short, symmetric traces and a ground guard ring. Keep switching signals away from the analog AVSS/AVDD rails to minimize ADC noise coupling.
The dual-panel Live-Update Flash feature requires careful firmware design to avoid bricking: one panel must always hold a known-good bootloader that can recover the other. Do not rely on the panel-switch mid-application; use the Flash swap mechanism only during controlled boot sequences. Always connect unused I/O pins to defined logic levels (not floating) to minimize current draw and ESD susceptibility. Configure unused peripherals to their lowest-power state to meet quiescent current targets.
Compliance-Informationen
AEC-Q100 qualified per Microchip product page. RoHS and REACH compliant per Microchip environmental documentation. Lead-free and Pb-free terminal finish (matte tin). Halogen-free status not explicitly listed in verified data.