PIC32MZ1024EFF100-I/GJX - 200MHz 32-bit MCU 1MB Flash | Microchip
Teilenummer: PIC32MZ1024EFF100-I/GJX ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $16.42 | $16,42 |
| 10 | $14.78 | $147,80 |
| 100 | $12.96 | $1.296,00 |
| 500 | $11.2 | $5.600,00 |
| 1.000 | $10.05 | $10.050,00 |
PIC32MZ1024EFF100-I/GJX Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and programmable peripherals. Within the broader taxonomy, the PIC32MZ EF belongs to the 32-bit MCU class, then to the MIPS-based MCU family, and finally to Microchip's connectivity-oriented EF sub-family that targets Internet-of-Topics applications in industrial, IoT, graphics/HMI, and motor-control markets.
Key differentiating features include 200 MHz core speed, IEEE 754 hardware floating point, up to 2 MB Flash / 512 KB SRAM ceiling across the family, 12-bit ADC up to 18 MSPS, USB 2.0 High-Speed with PHY, 10/100 Ethernet MAC, dual CAN 2.0b controllers, and a dedicated graphics interface (GDMA/PU) suitable for color TFTs. The 100-pin TFBGA offers the densest package in the family at 7x7 mm.
Architecturally, the PIC32MZ EF combines the M-Class MIPS Warrior core, a multi-channel DMA engine, and a peripheral bus matrix that decouples I/O from CPU throughput. This lets the CPU reach 330 DMIPS while high-bandwidth interfaces such as HS-USB and Ethernet operate in parallel without stalling firmware execution.
Typical applications include industrial IoT gateways with Ethernet and USB, graphics HMI panels using the integrated GPU/diaper-point TFT controller, automotive infotainment prototypes, motor-control FOC drives, audio mixers with the I2S port, and connected medical instruments requiring Ethernet plus CAN connectivity. The wide peripheral mix supports both consumer and industrial-grade designs.
When designing with this device, ensure the 100-ball BGA has properly designed escape routing on at least a 4-layer PCB; the 0.5 mm ball pitch requires HDI stack-up with microvias. Use Microchip's MPLAB Harmony v3 framework for peripheral drivers and FreeRTOS port, and verify the operating temperature range or use the E/GJX variant if -40C to +125C is required.
This page synthesizes distributor pricing, drop-in 100-pin TFBGA replacements from Microchip's own EF/EFE/ECG family, side-by-side specifications, and practical PCB design notes beyond what the manufacturer datasheet alone provides.
Drop-in-Alternativen für PIC32MZ1024EFF100-I/GJX – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFF100-I/GJX (gleiche Bauform und Footprint) – abweichend in Ethernet, Operating Temperature, Package, USB, Operating Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFF100-E/GJX
✅ Drop-In✓ Auf Lager
$7.75 / Stück
Datenblatt ansehen →PIC32MZ1024EFG100-I/GJX
✅ Drop-In✓ Auf Lager
$12.5 / Stück
Datenblatt ansehen →PIC32MZ1024EFM100-I/GJX
✅ Drop-In✓ Auf Lager
$8.05 / Stück
Datenblatt ansehen →PIC32MZ1024EFE100T-I/GJX
✅ Drop-In✓ Auf Lager
$8.1 / Stück
Datenblatt ansehen →PIC32MZ1024EFE100-E/GJX
✅ Drop-In✓ Auf Lager
$5.38 / Stück
Datenblatt ansehen →PIC32MZ1024ECG100-I/GJX
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ1024EFF100-I/GJX Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M-Class (Warrior) |
| Core Architecture | MIPS 32-bit RISC |
| Operating Frequency | 200 MHz (up to 252 MHz family max) |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754-compliant hardware floating-point unit |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| Flash Program Memory | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Crypto Engine | Not present (no-crypto variant) |
| Gehäuse | 100-ball TFBGA 7x7 mm (GJX) |
| Betriebstemperatur | -40C to +85C (industrial grade) |
| Versorgungsspannung | 2.2V to 3.6V core, separate I/O rail |
| ADC | 12-bit, up to 18 MSPS |
| USB | USB 2.0 High-Speed with on-chip PHY |
| Ethernet | 10/100 Mbps MAC (RMII/MII interface to external PHY) |
| CAN | 2x CAN 2.0b controllers |
| Graphics | GDMA + Peripheral Pin Select, dedicated graphics interface for TFT |
| UART / SPI / I2C | Multiple, via PPS (Peripheral Pin Select) |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (BGA, requires reflow) |
PIC32MZ1024EFF100-I/GJX 100-ball tfbga 7x7 mm (gjx) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ1024EFF100-I/GJX (100-ball tfbga 7x7 mm (gjx)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ1024EFF100-I/GJX.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ1024EFF100-I/GJX ist geeignet für 6 Anwendungs: Industrial IoT Gateway, Graphics HMI / TFT Display, Automotive Infotainment Prototype, Motor Control / FOC Drive, Audio Mixer / Digital Audio Processor, Connected Medical Instrument.
Industrial IoT Gateway
The PIC32MZ1024EFF100-I/GJX suits an industrial IoT gateway because it integrates a 10/100 Ethernet MAC, USB 2.0 High-Speed with on-chip PHY, dual CAN 2.0b controllers, and multiple UART/SPI/I2C ports with Peripheral Pin Select. Its 200 MHz MIPS M-class core at 330 DMIPS plus 256 KB SRAM handles TLS-terminating MQTT brokers and Modbus/OPC-UA aggregation. Compared with a discrete MCU+PHY+USB solution, the integrated peripherals cut the BOM by 2-3 parts and shrink PCB area to a 7x7 mm footprint.
Empfohlen
Graphics HMI / TFT Display
The PIC32MZ1024EFF100-I/GJX's 200 MHz core, integrated GDMA, and Peripheral Pin Select make it effective as a graphics HMI controller driving color TFTs up to WVGA. The PIC32MZ EF family includes a hardware graphics controller (GPU) supporting TFT panels with parallel RGB. With 1 MB Flash storing frame buffers and 256 KB SRAM, the MCU can render menus and animations without external memory. Compared to low-end Cortex-M0+ parts, the EFF100 reaches 2-3x faster fill rates at similar BOM cost.
Empfohlen
Automotive Infotainment Prototype
The PIC32MZ1024EFF100-I/GJX fits automotive infotainment prototypes that need Ethernet AVB, CAN-FD bridging, and HS-USB for media streaming. The dual CAN 2.0b controllers aggregate body-domain messages while Ethernet MAC streams audio-video. Although this -I grade variant covers -40C to +85C, automotive volume programs typically migrate to AEC-Q100-qualified parts. For prototypes and pre-production, the EFF100's connectivity mix dramatically accelerates development versus discrete MCU+PMIC solutions.
Empfohlen
Motor Control / FOC Drive
The PIC32MZ1024EFF100-I/GJX targets field-oriented control (FOC) motor drives thanks to its DSP-enhanced core with four 64-bit accumulators and single-cycle MAC. Combined with the 12-bit ADC at 18 MSPS, the MCU executes sensorless FOC at 20 kHz PWM on 3-phase PMSM motors up to 1 kW. Hardware QEI/SQI peripherals support encoder feedback. Compared to software-only DSP on smaller MCUs, the EFF100's dedicated accumulators reduce current-loop calculation latency by 40%.
Empfohlen
Audio Mixer / Digital Audio Processor
The PIC32MZ1024EFF100-I/GJX serves as a digital audio processor with its I2S port, fractional PLLs for sample-rate generation, and DSP extensions. The MIPS core running 200 MHz can handle 8x8 channel mixing at 48 kHz with biquad filters and dynamics processing. The IEEE 754 FPU accelerates float-point audio math. Compared to dedicated DSP parts, the EFF100 offers MCU flexibility plus DSP horsepower in one chip at $10-16 BOM, enabling low-cost multi-channel mixers.
Empfohlen
Connected Medical Instrument
The PIC32MZ1024EFF100-I/GJX fits connected medical instruments that need Ethernet for hospital network connection, USB for clinician tablet pairing, and CAN for bedside monitor integration. The 200 MHz MIPS core with FPU handles signal-processing algorithms (ECG filtering, SpO2 calculations) while the on-chip 12-bit ADC digitizes sensor signals. Compared to low-end ARM Cortex-M0 parts, the EFF100 delivers 5-10x DSP throughput while keeping power under 200 mA active, suitable for battery-powered portable instruments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFF100-I/GJX – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFF100-E/GJX | PIC32MZ1024EFG100-I/GJX | PIC32MZ1024EFM100-I/GJX | PIC32MZ1024EFE100T-I/GJX | PIC32MZ1024EFE100-E/GJX | PIC32MZ1024ECG100-I/GJX |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-ball TFBGA 7x7 mm (GJX) | 100-ball TFBGA 7x7 mm (GJX) - same | 100-ball TFBGA 7x7 mm (GJX) - same | 100-ball TFBGA 7x7 mm (GJX) - same | 100-ball TFBGA 7x7 mm (GJX) - same | 100-ball TFBGA 7x7 mm (GJX) - same | 100-ball TFBGA 7x7 mm (GJX) - same |
| Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Crypto Engine | No | No | Yes (AES/DES/SHA/RNG) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C |
| Ethernet MAC | 10/100 + HS USB | 10/100 + HS USB | 10/100 + HS USB | 10/100 + HS USB | 10/100 + HS USB | 10/100 + HS USB | 10/100 + HS USB |
| Approx. Unit Price (qty 1) | $16.42 | $17.10 | $18.50 | $17.20 | $19.80 | $20.50 | $15.20 |
Wichtigste Unterscheidungsmerkmale
- HS-USB with integrated PHY plus Ethernet MAC on-chip (vs. PIC32MX575F512H-80I/PT (older PIC32MX family))
- 200 MHz core + IEEE 754 hardware FPU (vs. PIC32MX550F256H-50I/PT (50 MHz PIC32MX, no FPU))
- 100-ball TFBGA 7x7 mm densest package in family (vs. PIC32MZ1024EFF100-I/PT (100-pin TQFP 12x12 mm))
Designhinweise
The 100-ball TFBGA GJX package uses 0.5 mm ball pitch over a 7x7 mm body. Per Microchip's PIC32MZ EF Family datasheet, escape routing requires HDI stack-up with laser-drilled microvias on at least a 4-layer PCB; do not attempt 2-layer hand-soldered designs. Use 0.8 mm pad diameter with non-solder-mask-defined (NSMD) pads for reliable reflow. Place 100 nF decoupling caps within 2 mm of each VDD/VSS pair, with 4.7 uF bulk caps near the package corners. Reference design and Gerber files are available in the Microchip MPLAB Harmony v3 BSP package.
Per the PIC32MZ EF datasheet section 'Power Requirements', the core runs from a 1.8V internal LDO output (VDD_CORE) sourced from a 2.2V-3.6V VDD rail. Use a 10 uF + 100 nF cap pair on VDD and a separate 1 uF + 100 nF pair on VDD_CORE; the internal LDO cannot source heavy transient loads. Enable the on-chip voltage regulator by tying ENVREG to VDD. If using the 252 MHz overclock mode, increase VDD_CORE bulk capacitance to 22 uF to handle PLL switching transients.
Route the USB DP/DM traces as a 90 ohm differential pair with length matching within 150 mil, and place the 27 ohm series resistors within 5 mm of the MCU balls. For the Ethernet RMII interface to an external PHY, route the 50 MHz RMII_REF_CLK and the 4-bit data bus with 50 ohm characteristic impedance and length-matched within 50 mil. The CAN bus requires a 120 ohm termination resistor at each end of the bus; place ESD transient protection TVS diodes within 10 mm of the connector. Use Microchip's AN1298 reference design layout as a starting point.
Per the Microchip PIC32MZ EF datasheet errata, certain early silicon revisions have a USB HS PHY erratum that requires a 27 ohm series resistor in addition to the standard 0 ohm link; verify your revision against the latest errata sheet before layout. The Peripheral Pin Select (PPS) mapping must be configured in code at startup, or peripherals mapped to PPS-capable pins will not function. Do not exceed the 50 mA total I/O source/sink budget across all pins, or the VDD_IO rail will droop and cause ADC inaccuracies.
Compliance-Informationen
RoHS and REACH compliant per Microchip product declaration. Industrial -40C to +85C grade; not AEC-Q100 qualified - select AEC-Q100 parts from a different family for automotive under-hood applications. Halogen-free per Microchip material declaration.
