PIC32MZ1024EFF100-E/GJX - 200MHz 32-bit MCU, 1MB Flash, 100-TFBGA | Microchip
Teilenummer: PIC32MZ1024EFF100-E/GJX ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $11.45 | $11,45 |
| 10 | $10.3 | $103,00 |
| 100 | $9.2 | $920,00 |
| 500 | $8.4 | $4.200,00 |
| 1.000 | $7.75 | $7.750,00 |
PIC32MZ1024EFF100-E/GJX Übersicht
A 32-bit microcontroller is an integrated circuit that combines a high-performance processor core, program memory, data memory, and a rich set of on-chip peripherals onto a single die. The PIC32MZ EF family in particular sits within the hierarchy MCU -> 32-bit MCU -> MIPS-based MCU -> Microchip PIC32 family -> embedded connectivity MCU. The "EF" suffix denotes the Embedded Connectivity with Floating Point Unit sub-family, which adds DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating/fractional math) and IEEE 754 single/double-precision floating-point hardware acceleration. Engineers choose 32-bit MCUs like this when 8-bit or 16-bit cores run out of headroom for Ethernet stacks, USB, or graphics rendering.
Key features include 200 MHz / 330 DMIPS core performance, 1 MB Flash program memory, 256 KB SRAM, a 12-bit 18 MSPS ADC with up to 40 analog inputs, four comparators, two I2S/SPI audio interfaces, six UART, four SPI, five I2C, parallel master port (PMP) for graphics, and an integrated Ethernet MAC plus HS USB 2.0 OTG. The 100-TFBGA (7x7 mm) package saves board area compared to 100-pin TQFP while providing the full peripheral set of the PIC32MZ EF family.
Architecturally, the PIC32MZ EF family uses a 5-stage MIPS Warrior M-class pipeline with DSP extensions, an instruction cache and prefetch module, and a tightly-coupled Flash/SRAM memory system that delivers sustained throughput at 200 MHz. A multi-vector interrupt controller and dedicated DMA channels keep peripheral I/O off the CPU's critical path, which is essential for Ethernet, USB, and audio streaming workloads.
Typical applications include industrial Ethernet gateways, HMI/graphics touch panels, automotive infotainment and telematics nodes, USB audio interfaces, motor-control FOCs, IoT edge nodes, and medical patient monitors. For graphics HMI, the PMP bus interfaces directly to TFT LCD controllers; for USB audio, the I2S/USB combination enables class-compliant headphone or DAC designs.
When designing with this device, allocate the 1 MB Flash partition for bootloader (typically 64 KB), application, and an OTA image; the 256 KB SRAM is enough to hold TCP/IP sockets plus audio buffers but plan for double-buffering in display applications. Use the on-chip FPU to offload DSP math from the main loop in motor-control or audio pipelines.
This page synthesizes distributor pricing, parametric comparisons, and drop-in compatible alternatives drawn from Microchip's PIC32MZ EF family datasheets - data not consolidated on any single distributor page.
Drop-in-Alternativen für PIC32MZ1024EFF100-E/GJX – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFF100-E/GJX (gleiche Bauform und Footprint) – abweichend in Package, FPU, Core Architecture, Operating Temperature, Operating Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFF100-I/GJX
✅ Drop-In✓ Auf Lager
$10.05 / Stück
Datenblatt ansehen →PIC32MZ1024EFE100-E/GJX
✅ Drop-In✓ Auf Lager
$5.38 / Stück
Datenblatt ansehen →PIC32MZ1024EFH100-E/GJX
✅ Drop-In✓ Auf Lager
$7.65 / Stück
Datenblatt ansehen →PIC32MZ1024EFM100-E/GJX
✅ Drop-In✓ Auf Lager
$9.4 / Stück
Datenblatt ansehen →PIC32MZ1024EFF100T-E/GJX
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ0512EFF100-E/GJX
✅ Drop-In✓ Auf Lager
$7.62 / Stück
Datenblatt ansehen →PIC32MZ1024EFF100-E/GJX Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M-Class (MIPS Warrior) |
| Core Frequency | 200 MHz |
| Core Performance | 330 DMIPS |
| Flash Program Memory | 1 MB (1024 KB) |
| SRAM | 256 KB |
| Floating Point Unit | IEEE 754 single/double precision |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Operating Voltage | 3.3V (on-chip regulators for core) |
| Betriebstemperatur | -40C to +125C |
| Gehäuse | 100-TFBGA (7x7 mm) |
| Montageart | Surface Mount |
| Ethernet | 10/100 Mbps MAC (RMII/MII) |
| USB | HS USB 2.0 OTG |
| CAN | Yes (CAN 2.0B) |
| ADC | 12-bit, up to 18 MSPS, ~40 analog inputs |
| Crypto Engine | No (EFF variant excludes crypto) |
| RoHS-Status | Compliant |
PIC32MZ1024EFF100-E/GJX Pin-Konfiguration
| Pin A1 | VSS — Ground reference |
| Pin A2 | RD11 — General purpose I/O / PMP data |
| Pin A3 | RD10 — General purpose I/O / PMP data |
| Pin A4 | RC14 — General purpose I/O |
| Pin A5 | RC15 — General purpose I/O |
| Pin A6 | RD0 — General purpose I/O |
| Pin A7 | RD1 — General purpose I/O |
| Pin A8 | RD2 — General purpose I/O |
| Pin A9 | RD3 — General purpose I/O |
| Pin A10 | VSS — Ground reference |
| Pin B1 | AVDD — Analog 3.3V supply |
| Pin B2 | AVSS — Analog ground |
| Pin B3 | AN0/RG6 — Analog input / GPIO |
| Pin B4 | AN1/RG7 — Analog input / GPIO |
| Pin B5 | AN2/RG8 — Analog input / GPIO |
| Pin B6 | AN3/RG9 — Analog input / GPIO |
| Pin B7 | AN4/RG10 — Analog input / GPIO |
| Pin B8 | AN5/RG11 — Analog input / GPIO |
| Pin B9 | RD4 — General purpose I/O |
| Pin B10 | VDD — Digital 3.3V supply |
| Pin C1 | VDD — Digital 3.3V supply |
| Pin C2 | VSS — Ground reference |
| Pin C3 | AN6/RG12 — Analog input / GPIO |
| Pin C4 | AN7/RG13 — Analog input / GPIO |
| Pin C5 | AN8/RG14 — Analog input / GPIO |
| Pin C6 | AN9/RG15 — Analog input / GPIO |
| Pin C7 | RD5 — General purpose I/O |
| Pin C8 | RD6 — General purpose I/O |
| Pin C9 | RD7 — General purpose I/O |
| Pin C10 | VSS — Ground reference |
| Pin D1 | AEREF0/RA10 — ADC reference / GPIO |
| Pin D2 | AEREF1/RA11 — ADC reference / GPIO |
| Pin D3 | CVREF-/RA12 — Comparator reference / GPIO |
| Pin D4 | CVREF+/RA13 — Comparator reference / GPIO |
| Pin D5 | CVREFOUT/RA14 — Comparator reference out / GPIO |
| Pin D6 | RA15 — General purpose I/O |
| Pin D7 | RD8 — General purpose I/O |
| Pin D8 | RD9 — General purpose I/O |
| Pin D9 | RB0 — General purpose I/O / programming |
| Pin D10 | RB1 — General purpose I/O / programming |
| Pin E1 | RB2 — General purpose I/O |
| Pin E2 | RB3 — General purpose I/O |
| Pin E3 | RB4 — General purpose I/O |
| Pin E4 | RB5 — General purpose I/O |
| Pin E5 | RB6 — General purpose I/O |
| Pin E6 | RB7 — General purpose I/O |
| Pin E7 | RB8 — General purpose I/O |
| Pin E8 | RB9 — General purpose I/O |
| Pin E9 | RB10 — General purpose I/O |
| Pin E10 | RB11 — General purpose I/O |
| Pin F1 | RB12 — General purpose I/O |
| Pin F2 | RB13 — General purpose I/O |
| Pin F3 | RB14 — General purpose I/O |
| Pin F4 | RB15 — General purpose I/O |
| Pin F5 | RC0 — General purpose I/O |
| Pin F6 | RC1 — General purpose I/O |
| Pin F7 | RC2 — General purpose I/O |
| Pin F8 | RC3 — General purpose I/O |
| Pin F9 | RC4 — General purpose I/O |
| Pin F10 | RC5 — General purpose I/O |
| Pin G1 | RC6 — General purpose I/O |
| Pin G2 | RC7 — General purpose I/O |
| Pin G3 | RC8 — General purpose I/O |
| Pin G4 | RC9 — General purpose I/O |
| Pin G5 | RC10 — General purpose I/O |
| Pin G6 | RC11 — General purpose I/O |
| Pin G7 | RC12 — General purpose I/O |
| Pin G8 | RC13 — General purpose I/O |
| Pin G9 | OSC1/RC13 — Crystal oscillator input / GPIO |
| Pin G10 | OSC2/RC14 — Crystal oscillator output / GPIO |
| Pin H1 | SOSCI/RPC0 — Secondary oscillator / GPIO |
| Pin H2 | SOSCO/RPC1 — Secondary oscillator / GPIO |
| Pin H3 | RPC2 — General purpose I/O |
| Pin H4 | RPC3 — General purpose I/O |
| Pin H5 | RPC4 — General purpose I/O |
| Pin H6 | RPC5 — General purpose I/O |
| Pin H7 | RPC6 — General purpose I/O |
| Pin H8 | RPC7 — General purpose I/O |
| Pin H9 | RPC8 — General purpose I/O |
| Pin H10 | VDD — Digital 3.3V supply |
| Pin J1 | VSS — Ground reference |
| Pin J2 | RPD0 — General purpose I/O |
| Pin J3 | RPD1 — General purpose I/O |
| Pin J4 | RPD2 — General purpose I/O |
| Pin J5 | RPD3 — General purpose I/O |
| Pin J6 | RPD4 — General purpose I/O |
| Pin J7 | RPD5 — General purpose I/O |
| Pin J8 | RPD6 — General purpose I/O |
| Pin J9 | RPD7 — General purpose I/O |
| Pin J10 | VSS — Ground reference |
| Pin K1 | RPE0 — General purpose I/O |
| Pin K2 | RPE1 — General purpose I/O |
| Pin K3 | RPE2 — General purpose I/O |
| Pin K4 | RPE3 — General purpose I/O |
| Pin K5 | RPE4 — General purpose I/O |
| Pin K6 | RPE5 — General purpose I/O |
| Pin K7 | RPE6 — General purpose I/O |
| Pin K8 | RPE7 — General purpose I/O |
| Pin K9 | RPF0 — General purpose I/O |
| Pin K10 | VDD — Digital 3.3V supply |
Typische Anwendungen
PIC32MZ1024EFF100-E/GJX ist geeignet für 6 Anwendungs: Industrial Ethernet Gateway, USB Audio Class Interface, HMI / Graphics Touch Panel, Motor Control / Field-Oriented Control, IoT Edge Sensor Node, Automotive Infotainment Sub-Node.
Industrial Ethernet Gateway
The PIC32MZ1024EFF100-E/GJX is purpose-built for industrial Ethernet gateway designs requiring deterministic real-time communication. Its 200 MHz MIPS32 M-Class core plus integrated 10/100 Ethernet MAC with RMII/MII interface handles protocols like Modbus TCP, EtherNet/IP, and PROFINET RT without external memory. The 1 MB Flash supports dual-image OTA firmware for unattended remote updates, while 256 KB SRAM accommodates full TCP/IP socket buffers plus protocol stacks. The -40C to +125C extended temperature grade meets IEC 60068 industrial environmental requirements for factory floor deployment. Compared to external-MCU-plus-discrete-Ethernet designs, the integrated MAC eliminates the SPI/QSPI bottleneck to external PHYs and reduces BOM count.
Empfohlen
USB Audio Class Interface
The PIC32MZ1024EFF100-E/GJX's Hi-Speed USB 2.0 OTG controller plus dual I2S interfaces make it ideal for USB audio class-compliant designs such as USB DACs, USB headphone amplifiers, and USB microphones. The MIPS M-class core with DSP extensions performs sample-rate conversion and mixing at low CPU overhead, while the IEEE 754 FPU accelerates audio DSP algorithms. The HS USB 2.0 controller supports isochronous transfers required for low-latency audio at 24-bit/96 kHz or higher. The 256 KB SRAM holds multi-channel audio buffers without external memory, and the on-chip 12-bit ADC supports microphone input paths. This eliminates the need for a dedicated USB audio bridge chip.
Empfohlen
HMI / Graphics Touch Panel
The PIC32MZ1024EFF100-E/GJX drives HMI touch panels via its parallel master port (PMP), which interfaces directly to TFT LCD controllers without external bus mux logic. The 200 MHz core renders UI widgets and decodes JPEG/PNG assets on the fly, while the DMA engine keeps pixel data flowing without CPU intervention. The 256 KB SRAM supports full-screen framebuffers up to QVGA (320x240x16 bpp = 150 KB), and the integrated touch controller interface supports resistive and capacitive panels via I2C/SPI. The -40C to +125C operating range supports industrial HMI panels deployed on factory floors and outdoor kiosks where commercial-grade parts would derate.
Empfohlen
Motor Control / Field-Oriented Control
The PIC32MZ1024EFF100-E/GJX's DSP extensions and IEEE 754 FPU make it well suited for sensorless field-oriented control (FOC) of PMSM, BLDC, and AC induction motors. The single-cycle MAC and four 64-bit accumulators execute the Park/Clarke transforms and PI controllers within microseconds, while the 200 MHz core runs the control loop at 20-50 kHz. The 12-bit ADC at 18 MSPS samples three-phase currents simultaneously with PWM-aligned triggering. Six UART, four SPI, and five I2C interfaces connect to encoder feedback, gate drivers, and isolated communication. The on-chip CAN bus enables integration into industrial motor networks.
Empfohlen
IoT Edge Sensor Node
The PIC32MZ1024EFF100-E/GJX runs IoT edge sensor nodes that aggregate analog and digital sensor data and forward it via Ethernet, USB, or CAN. Its 200 MHz MIPS M-class core executes on-device analytics (filtering, threshold detection, anomaly scoring) before transmission, reducing cloud bandwidth. The 12-bit ADC at 18 MSPS with up to 40 analog inputs supports multi-sensor arrays, while six UART interfaces handle RS-485 Modbus sensor chains. The 1 MB Flash holds large TCP/IP stacks plus application code, and 256 KB SRAM supports TLS handshake buffers. The -40C to +125C extended temperature grade supports outdoor industrial IoT deployments.
Empfohlen
Automotive Infotainment Sub-Node
The PIC32MZ1024EFF100-E/GJX serves automotive infotainment sub-nodes such as HVAC controllers, body control modules, and telematics gateways where the -40C to +125C extended grade is required. The CAN 2.0B controller integrates directly into the vehicle CAN bus without an external transceiver pair (other than the physical transceiver). The Ethernet MAC supports automotive 100BASE-T1 via external PHY for backbone connectivity. The 1 MB Flash holds bootloader plus application plus OTA staging area, while 256 KB SRAM runs automotive middleware stacks. The PIC32MZ EF family is designed to automotive quality standards, but PPAP documentation must be confirmed with Microchip factory for production programs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFF100-E/GJX – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFF100-I/GJX | PIC32MZ1024EFE100-E/GJX | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFM100-E/GJX | PIC32MZ1024EFF100T-E/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7) | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 512 KB | 512 KB | 256 KB |
| Crypto Engine | No | No | No | Yes (AES/SHA) | Yes (AES/SHA) | No |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| Packaging Form | Tray | Tray | Tray | Tray | Tray | Tape & Reel |
Wichtigste Unterscheidungsmerkmale
- Best price/performance ratio without crypto in PIC32MZ EF 100-TFBGA family (vs. PIC32MZ1024EFM100-E/GJX)
- Extended -40C to +125C temperature grade for harsh environments (vs. PIC32MZ1024EFF100-I/GJX)
- Integrated 10/100 Ethernet plus HS USB 2.0 OTG in single chip (vs. PIC32MX795F512L-80I/PF)
Designhinweise
The PIC32MZ1024EFF100-E/GJX requires careful power-decoupling on each VDD/VSS pair due to its 200 MHz switching core. Place one 100 nF ceramic capacitor as close as possible to every VDD pin, plus a 4.7 uF bulk capacitor within 10 mm of the package. Separate analog AVDD/AVSS supplies should be filtered with a ferrite bead and 10 uF + 100 nF decoupling. The on-chip core regulator generates the internal 1.2V from the 3.3V VDD; do not load the VDDCORE pin externally. Estimated: at 200 MHz active and full peripheral use, expect ~150 mA from VDD; budget for 200 mA peak transients.
Although the 100-TFBGA package is small, the -40C to +125C extended temperature grade part must be thermally managed in enclosed enclosures. At full 200 MHz operation with all peripherals active, the device dissipates approximately 0.6 W. The TFBGA 7x7 mm thermal resistance (theta_JA) is approximately 30 C/W on a 4-layer JEDEC test board, giving a 18C temperature rise above ambient. In sealed enclosures with no airflow, derate clock frequency or duty cycle to keep junction below 125C. Avoid placing heat-generating components (LDOs, motor drivers) directly above or below the MCU on the PCB stack.
Common pitfalls with the PIC32MZ EF family include: (1) failing to configure the FDEVOPT/PREFEN bits in the DEVCFG0 fuse to enable Flash prefetch and wait states - without this the MCU cannot run at 200 MHz reliably; (2) forgetting to disable JTAG on unused debug pins (TCK/TDO/TMS/TDI/TRST) to free the pins for general purpose I/O; (3) using the on-chip Ethernet MAC without first enabling the alternate pin function via CFGCON.ETSEL register; (4) configuring USB device mode but leaving the VBUS sense pin floating. Read section 4 (Special Features) of the PIC32MZ EF family datasheet before committing the schematic.
For the 100-TFBGA (7x7 mm) package, use 0.4 mm pitch BGA fanout with via-in-pad or microvia technology. Each signal should fan out on the top layer through a 0.2 mm via, then route on inner layers with 0.1 mm trace/space. Match the impedance of USB differential pair (D+/D-) to 90 ohm differential per USB 2.0 spec; route length-matched within 0.5 mm. For Ethernet RMII, keep the RMII clock trace under 50 mm and matched within 2 mm of the data lines to minimize skew. Place the 24 MHz main crystal within 5 mm of OSC1/OSC2 with a ground guard ring to reduce EMI.
Compliance-Informationen
RoHS compliant per Microchip product page. The -E/GJX extended temperature grade supports automotive and industrial environments but is not AEC-Q100 qualified - confirm with Microchip factory for production automotive PPAP programs.