PIC32MZ1024EFM100-I/GJX - 200MHz 32-bit MCU 1MB Flash TFBGA-100 | Microchip
Teilenummer: PIC32MZ1024EFM100-I/GJX ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.92 | $119,20 |
| 100 | $10.45 | $1.045,00 |
| 500 | $9.2 | $4.600,00 |
| 1.000 | $8.05 | $8.050,00 |
PIC32MZ1024EFM100-I/GJX Übersicht
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on one die. The PIC32MZ EF family belongs to the broader taxonomy of embedded 32-bit microcontrollers -> microcontrollers -> integrated circuits -> semiconductors. The MIPS32 M-Class core used here delivers 330 DMIPS, with single-cycle MAC, four 64-bit accumulators, and IEEE 754-compliant single/double-precision floating-point hardware that accelerates DSP and signal-processing workloads.
Key features include 200 MHz core speed with dual-panel Flash for zero-wait-state execution, 1 MB Flash and 512 KB SRAM, an integrated crypto engine (AES, DES, SHA, RNG), dual CAN 2.0b controllers, Hi-Speed USB 2.0 (host/device/OTG), Ethernet MAC, 10/100 Ethernet MAC with RMII/MII interfaces, multiple UART/SPI/I2C peripherals, a 12-bit ADC at up to 18 Msps, and dedicated graphics/HMI peripherals including a graphics controller and parallel master port. The device also exposes up to 78 GPIO lines, two I2S/SPI audio interfaces, an SQI (Serial Quad Interface) for external Flash expansion, and a 16-channel DMA controller.
Architecturally, the PIC32MZ EF combines an enhanced MIPS M-class core with dual-bank Flash to eliminate fetch stalls during erase/program operations, ensuring deterministic interrupt latency. The integrated FPU is fully IEEE 754 compliant, which removes the need for software emulation of floating-point math in control loops and sensor-fusion code. The on-chip crypto accelerator offloads AES/SHA workload, freeing CPU cycles for application code.
Typical applications include industrial automation controllers, IoT edge nodes with TLS-secured connectivity, automotive infotainment/HMI clusters (consumer-grade temperature range), Ethernet-enabled motor control inverters, and graphic-touchscreen HMI panels. The 7x7 mm TFBGA package supports compact layouts where board area is at a premium. Designers using this MCU typically pair it with an external PHY for Ethernet, a SPI NOR Flash for data logging, and a 2.4 GHz wireless transceiver such as the Microchip ATWINC3400 for Wi-Fi.
When designing with this device, pay close attention to decoupling: place a 100 nF X7R capacitor within 2 mm of every VDD/VDDIO pin pair, and add bulk 4.7 uF tantalum capacitors near the package perimeter to suppress switching transients. The crypto engine requires random seed initialization via the RNG and properly configured PRNG libraries from Microchip's MPLAB Harmony framework. Industrial users should verify the -I (Industrial) temperature grade suits their ambient range; automotive AEC-Q100 customers should look at the EFG/ECG family variants instead.
Drop-in-Alternativen für PIC32MZ1024EFM100-I/GJX – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFM100-I/GJX (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, USB, Ethernet, FPU.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFM100-E/GJX
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Datenblatt ansehen →PIC32MZ1024EFM100-I/GJX Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M-Class (PIC32MZ) |
| Core Frequency (max) | 200 MHz (252 MHz family max) |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754 single/double precision, hardware |
| DSP | Single-cycle MAC, four 64-bit accumulators |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Supply Voltage (VDD) | 2.1 V to 3.6 V |
| Betriebstemperatur | -40C to +85C (Industrial, -I suffix) |
| Gehäuse | 100-TFBGA (7x7 mm) |
| Montageart | Surface Mount (BGA) |
| Crypto Engine | AES, DES, SHA, hardware RNG |
| CAN | 2x CAN 2.0b |
| Ethernet | 10/100 MAC with RMII/MII |
| USB | Hi-Speed USB 2.0 Host/Device/OTG |
| ADC | 12-bit, up to 18 Msps |
| GPIO | up to 78 lines |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
PIC32MZ1024EFM100-I/GJX 100-tfbga (7x7 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ1024EFM100-I/GJX (100-tfbga (7x7 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ1024EFM100-I/GJX.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ1024EFM100-I/GJX ist geeignet für 7 Anwendungs: Industrial Automation Controller, IoT Edge Node with TLS Security, Automotive Infotainment HMI Cluster, Ethernet-Enabled Motor Drive Inverter, Medical Point-of-Care Diagnostic Device, Graphics Touchscreen HMI Panel, Smart Home IoT Gateway.
Industrial Automation Controller
The PIC32MZ1024EFM100-I/GJX's 200 MHz MIPS M-class core delivers 330 DMIPS with hardware FPU, enabling deterministic execution of industrial control loops at 1 kHz sample rates. Its dual CAN 2.0b ports provide robust industrial networking (CANopen, DeviceNet) while 1 MB Flash stores complex ladder-logic or IEC 61131-3 runtimes. The 100-TFBGA 7x7 mm package fits compact PLC modules, and the -40 to +85C industrial range tolerates cabinet ambient temperatures. Pair with the MCP2515 CAN transceiver or LAN8720A Ethernet PHY for full connectivity.
Empfohlen
IoT Edge Node with TLS Security
The integrated crypto engine (AES-128/256, SHA-256, hardware RNG) accelerates TLS 1.2/1.3 handshakes, making the PIC32MZ1024EFM100-I/GJX ideal for IoT gateways that must authenticate to AWS IoT Core or Azure IoT Hub. The 200 MHz core sustains MQTT message throughput above 5k msg/s, while 512 KB SRAM buffers TLS session state without external memory expansion. Hi-Speed USB 2.0 enables field firmware updates, and the 100-TFBGA footprint suits small-form-factor sensor hubs. Pair with the ATWINC3400 Wi-Fi module for wireless connectivity.
Empfohlen
Automotive Infotainment HMI Cluster
The PIC32MZ1024EFM100-I/GJX drives color TFT displays via its parallel master port while the 200 MHz core runs graphics libraries from MPLAB Harmony at 60 fps. 1 MB Flash holds frame buffers, fonts, and multilingual UI assets; 512 KB SRAM supports double-buffered rendering. The 12-bit 18 Msps ADC digitizes analog gauges and backlight dimming feedback. Note that the -I grade suits non-safety automotive infotainment only; for AEC-Q100 dashboard applications use the PIC32MZ EFH1xx family with -Q grade ordering code.
Empfohlen
Ethernet-Enabled Motor Drive Inverter
Field-oriented control (FOC) of 3-phase PMSM motors requires deterministic 10-20 kHz PWM loops with floating-point math - exactly what the PIC32MZ1024EFM100-I/GJX's hardware FPU delivers at 200 MHz. The dual-panel Flash supports zero-wait-state execution during concurrent ADC sampling, while 1 MB Flash stores 50+ motor parameter sets. The integrated Ethernet MAC and CAN enable Industry 4.0 connectivity (EtherCAT via software stack, CANopen DS402). Pair with the MCP8026 BLDC gate driver or PIC32MK motor-control variant if tighter motor-control peripherals are needed.
Empfohlen
Medical Point-of-Care Diagnostic Device
The PIC32MZ1024EFM100-I/GJX's hardware FPU and 12-bit 18 Msps ADC suit portable blood-glucose, hemoglobin, or immunoassay analyzers requiring precise signal conditioning. 1 MB Flash stores calibration curves and patient-record buffers; the integrated crypto engine enables HIPAA-compliant encrypted data transmission. Hi-Speed USB supports direct-to-PC data sync. Note that medical devices require additional regulatory validation - this consumer-grade MCU is suitable for wellness/non-life-support instruments. Pair with the MCP3911 24-bit sigma-delta ADC for high-precision measurement front-ends.
Empfohlen
Graphics Touchscreen HMI Panel
The PIC32MZ1024EFM100-I/GJX drives QVGA/WVGA touchscreens via the parallel master port at 30+ fps while running concurrent communication stacks (Modbus TCP, MQTT, HTTP). 1 MB Flash holds full-page UI assets, while 512 KB SRAM supports touch event queues and rendering buffers. The 10/100 Ethernet MAC enables network-attached HMI panels for SCADA systems. Pair with the FT5x06 capacitive touch controller and a 4.3-inch TFT for industrial operator panels.
Empfohlen
Smart Home IoT Gateway
The PIC32MZ1024EFM100-I/GJX aggregates multiple wireless protocols (Wi-Fi, Bluetooth, LoRa, Zigbee) into a single home-edge gateway. The 200 MHz MIPS core runs MQTT bridges and local-rule engines while the crypto engine authenticates each cloud message. 1 MB Flash stores gateway firmware, and the SQI interface expands to 16 MB external Flash for log retention. Pair with the SAM R34 LoRa transceiver for sub-GHz sensor networks.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFM100-I/GJX – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFM100-E/GJX | PIC32MZ1024EFH100-I/GJX | PIC32MZ1024EFF100-I/GJX | PIC32MZ1024EFG100-I/GJX |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7) | 100-TFBGA (7x7) | 100-TFBGA (7x7) | 100-TFBGA (7x7) | 100-TFBGA (7x7) |
| Core Frequency (max) | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
| Crypto Engine | Yes (AES/DES/SHA/RNG) | Yes (AES/DES/SHA/RNG) | No (graphics/HMI variant) | Yes | Yes |
| GPIO (max) | 78 | 78 | 78 | 78 | 78 |
| Qty-1 Price (USD, approx) | 12.85 | 13.40 | 13.10 | 12.65 | 12.55 |
Wichtigste Unterscheidungsmerkmale
- Integrated crypto engine vs EFH100 variant (vs. PIC32MZ1024EFH100-I/GJX)
- Extended temperature option on same package (vs. PIC32MZ1024EFM100-E/GJX)
- Industrial temperature grade standard vs Automotive Q-grade (vs. PIC32MZ1024EFH100-I/PT)
Designhinweise
Place a 100 nF X7R 0402-size decoupling capacitor within 2 mm of every VDD and VDDIO pin pair on the PIC32MZ1024EFM100-I/GJX. Add four 4.7 uF X5R bulk capacitors near the package perimeter. The 100-TFBGA package requires via-in-pad (VIPPO) processing with filled and plated-over microvias for proper BGA escape routing; standard NSMD pads with 0.4 mm diameter are recommended. Maintain 50 ohm controlled impedance on high-speed traces (Ethernet, USB) using 4-layer stack-up with continuous reference plane.
The PIC32MZ1024EFM100-I/GJX TFBGA-100 package has a theta_JA of approximately 33 C/W on a 4-layer JEDEC test board. At 200 MHz full-load operation with all peripherals enabled, internal dissipation typically reaches 0.5-0.7 W. Estimated junction temperature rise above ambient: 0.7 W x 33 C/W = ~23 C, well within the +85C ambient limit. In enclosed enclosures without airflow, derate ambient to 65C. The exposed die pad under the BGA should be soldered to a flooded thermal pad on the PCB for heat spreading.
Three common pitfalls when designing with the PIC32MZ1024EFM100-I/GJX: (1) Skipping the PRNG initialization from MPLAB Harmony's crypto library causes the AES engine to emit identical output - always call CRYPT_RNG_Initialize() first. (2) Configuring I/O pins for analog peripherals without clearing the corresponding ANSEL bit results in digital input buffer contention. (3) Running Flash self-programming without enabling dual-panel mode forces code-execution stalls. Refer to Section 7 "Memory Organization" of the family datasheet for boot configuration word programming.
The 100-TFBGA 7x7 mm package has only 0.65 mm ball pitch, requiring microvia fan-out. Route Ethernet RMII traces as 50 ohm single-ended with maximum 25 mm length and matched within 2 mm of each other. The USB DP/DM differential pair requires 90 ohm differential impedance with no more than 4 vias. Place a common-mode choke (such as ACM2012) on USB DP/DM near the connector. The 12-bit ADC analog traces should be isolated from digital switching signals with a guard ring tied to AGND.
Power sequencing on the PIC32MZ1024EFM100-I/GJX: VDD must ramp before VDDA, or both must be tied to the same 3.3V rail. The POR circuit requires a minimum 10 ms stabilization period. For battery-backed RTC operation, connect a coin cell (CR2032) directly to the VBAT pin; the internal RTC switchover is automatic. Total active current at 200 MHz with all peripherals running is approximately 95 mA; add a 200 mA-rated LDO such as MCP1826 for headroom.
Compliance-Informationen
RoHS and REACH compliant per Microchip product environmental compliance documentation. Not AEC-Q100 qualified - for automotive applications, look at the PIC32MZ EF family Q-grade variants with explicit ordering code suffix. Industrial -I temperature grade is -40C to +85C only.