PIC32MZ1024EFM100-E/GJX - 200MHz MCU 1MB Flash TFBGA-100 | Microchip
Teilenummer: PIC32MZ1024EFM100-E/GJX ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.05 | $14,05 |
| 10 | $12.65 | $126,50 |
| 100 | $11.2 | $1.120,00 |
| 500 | $10.18 | $5.090,00 |
| 1.000 | $9.4 | $9.400,00 |
PIC32MZ1024EFM100-E/GJX Übersicht
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit CPU core, program and data memory, and a rich set of peripherals on a single die. The PIC32MZ EF family extends the classic PIC32MX architecture with the MIPS microAptiv core family, executes up to 252 MHz in some variants, and targets embedded connectivity applications. Within the broader taxonomy, PIC32MZ EF belongs to: 32-bit MCU > MIPS M-Class MCU > microcontroller > embedded processor > semiconductor IC.
Key features of this part include 1 MB (1M x 8) Flash, 512 KB SRAM, FPU for single-precision IEEE 754 math, a hardware crypto accelerator (AES/DES/SHA), dual CAN 2.0b controllers, HS USB 2.0 device/host/OTG, 10/100 Ethernet MAC, and a 12-bit ADC up to 2 MSPS. An integrated DMA controller and Peripheral Pin Select (PPS) provide flexible signal routing across the 100-pin BGA.
Architecture-wise, the part uses the MIPS32 M-Class core with 5-stage pipeline, MPU for memory protection, and dual-bank Flash with live-update support. The wide peripheral set - including audio I2S, parallel camera interface, and up to six UART channels - allows the device to consolidate multiple functions, reducing BOM cost in industrial gateways and HMI panels.
Typical applications include industrial IoT gateways with Ethernet and CAN, automotive HMI and instrument clusters, USB peripherals, secure-connected motor control, graphics TFT panels, and audio streaming nodes. The FPU accelerates DSP loops needed in field-oriented motor drive and digital audio processing.
Design tip - use Microchip Harmony 3 framework and place a 12 nF bulk decoupling capacitor within 5 mm of each VDD/VSS pair to meet the noise margin of the 200 MHz core. Configure PPS carefully - default mapping after reset leaves many pins in safe analog state.
This page combines distributor pricing, parameter-by-parameter comparison with same-package alternatives, and drop-in guidance curated for engineers sourcing the PIC32MZ1024EFM100-E/GJX in production.
Drop-in-Alternativen für PIC32MZ1024EFM100-E/GJX – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFM100-E/GJX (gleiche Bauform und Footprint) – abweichend in Core Architecture, Operating Temperature, USB, FPU, Operating Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFM100-I/GJX
✅ Drop-In✓ Auf Lager
$8.05 / Stück
Datenblatt ansehen →PIC32MZ1024EFM100T-I/GJX
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ1024EFH100-E/GJX
✅ Drop-In✓ Auf Lager
$7.65 / Stück
Datenblatt ansehen →PIC32MZ1024EFG100T-I/GJX
✅ Drop-In✓ Auf Lager
$8.45 / Stück
Datenblatt ansehen →PIC32MZ1024EFF100-E/GJX
✅ Drop-In✓ Auf Lager
$7.75 / Stück
Datenblatt ansehen →PIC32MZ1024EFE100-E/GJX
✅ Drop-In✓ Auf Lager
$5.38 / Stück
Datenblatt ansehen →PIC32MZ1024EFM100-E/GJX Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M-Class (microAptiv) |
| Core Frequency (max) | 200 MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 512 KB |
| FPU | Yes (single-precision IEEE 754) |
| Hardware Crypto | AES / DES / 3DES / SHA / MD5 / HMAC |
| CAN | 2 x CAN 2.0b |
| USB | USB 2.0 HS OTG |
| Ethernet MAC | 10/100 RMII/MII |
| ADC | 12-bit, up to 2 MSPS |
| Betriebstemperatur | -40C to +125C (E grade) |
| Gehäuse | 100-pin TFBGA (GJX), 7x7 mm |
| Montageart | Surface Mount (BGA) |
| Versorgungsspannung | 2.3 V to 3.6 V |
| DMA Channels | 8 channels |
| Peripheral Pin Select | Yes (PPS) |
| RoHS-Status | Compliant |
PIC32MZ1024EFM100-E/GJX Pin-Konfiguration
| Pin A1 | VSS — Ground reference |
| Pin A2 | TDO — JTAG Test Data Out |
| Pin A3 | VSS — Ground reference |
| Pin A4 | AN0 — Analog input 0 / GPIO |
| Pin A5 | AN1 — Analog input 1 / GPIO |
| Pin A6 | AN2 — Analog input 2 / GPIO |
| Pin A7 | AN3 — Analog input 3 / GPIO |
| Pin A8 | AN4 — Analog input 4 / GPIO |
| Pin A9 | AN5 — Analog input 5 / GPIO |
| Pin A10 | AVDD — Analog supply voltage |
| Pin B1 | VDD — Digital supply voltage |
| Pin B2 | TCK — JTAG Test Clock |
| Pin B3 | TMS — JTAG Test Mode Select |
| Pin B4 | VSS — Ground reference |
| Pin B5 | VDD — Digital supply voltage |
| Pin B6 | AN6 — Analog input 6 / GPIO |
| Pin B7 | AN7 — Analog input 7 / GPIO |
| Pin B8 | AN8 — Analog input 8 / GPIO |
| Pin B9 | AN9 — Analog input 9 / GPIO |
| Pin B10 | AVSS — Analog ground |
| Pin C1 | OSC1 — Crystal oscillator input |
| Pin C2 | OSC2 — Crystal oscillator output |
| Pin C3 | TDI — JTAG Test Data In |
| Pin C4 | VDD — Digital supply voltage |
| Pin C5 | VSS — Ground reference |
| Pin C6 | VDD — Digital supply voltage |
| Pin C7 | AN10 — Analog input 10 / GPIO |
| Pin C8 | AN11 — Analog input 11 / GPIO |
| Pin C9 | AN12 — Analog input 12 / GPIO |
| Pin C10 | AN13 — Analog input 13 / GPIO |
| Pin D1 | SOSCI — Secondary oscillator input (32.768 kHz) |
| Pin D2 | SOSCO — Secondary oscillator output |
| Pin D3 | VSS — Ground reference |
| Pin D4 | VSS — Ground reference |
| Pin D5 | VDD — Digital supply voltage |
| Pin D6 | VSS — Ground reference |
| Pin D7 | AN14 — Analog input 14 / GPIO |
| Pin D8 | AN15 — Analog input 15 / GPIO |
| Pin D9 | AN16 — Analog input 16 / GPIO |
| Pin D10 | AN17 — Analog input 17 / GPIO |
| Pin E1 | RST — Reset input (active low) |
| Pin E2 | VSS — Ground reference |
| Pin E3 | VDD — Digital supply voltage |
| Pin E4 | PGED1 — ICSP Programming Data |
| Pin E5 | PGEC1 — ICSP Programming Clock |
| Pin E6 | AN18 — Analog input 18 / GPIO |
| Pin E7 | AN19 — Analog input 19 / GPIO |
| Pin E8 | AN20 — Analog input 20 / GPIO |
| Pin E9 | AN21 — Analog input 21 / GPIO |
| Pin E10 | AN22 — Analog input 22 / GPIO |
| Pin F1 | PGED2 — ICSP Programming Data 2 |
| Pin F2 | PGEC2 — ICSP Programming Clock 2 |
| Pin F3 | VSS — Ground reference |
| Pin F4 | VDD — Digital supply voltage |
| Pin F5 | AN24 — Analog input 24 / GPIO |
| Pin F6 | AN23 — Analog input 23 / GPIO |
| Pin F7 | AN25 — Analog input 25 / GPIO |
| Pin F8 | AN26 — Analog input 26 / GPIO |
| Pin F9 | AN27 — Analog input 27 / GPIO |
| Pin F10 | VSS — Ground reference |
| Pin G1 | D+ — USB Data Plus |
| Pin G2 | D- — USB Data Minus |
| Pin G3 | VBUS — USB VBUS sense |
| Pin G4 | VUSB — USB internal regulator output |
| Pin G5 | ERXD0 — Ethernet RMII receive data 0 |
| Pin G6 | ERXD1 — Ethernet RMII receive data 1 |
| Pin G7 | ETXEN — Ethernet transmit enable |
| Pin G8 | ETXD0 — Ethernet transmit data 0 |
| Pin G9 | ETXD1 — Ethernet transmit data 1 |
| Pin G10 | EMDC — Ethernet management clock |
| Pin H1 | VSS — Ground reference |
| Pin H2 | CAN1RX — CAN 1 receive (via PPS) |
| Pin H3 | CAN1TX — CAN 1 transmit (via PPS) |
| Pin H4 | VSS — Ground reference |
| Pin H5 | ERXERR — Ethernet receive error |
| Pin H6 | ECRS — Ethernet carrier sense / RMII CRS_DV |
| Pin H7 | EMDIO — Ethernet management data I/O |
| Pin H8 | EREFCLK — Ethernet reference clock input |
| Pin H9 | VSS — Ground reference |
| Pin H10 | VDD — Digital supply voltage |
| Pin J1 | PMD0 — Parallel Master Port data 0 |
| Pin J2 | PMD1 — Parallel Master Port data 1 |
| Pin J3 | PMD2 — Parallel Master Port data 2 |
| Pin J4 | PMD3 — Parallel Master Port data 3 |
| Pin J5 | VSS — Ground reference |
| Pin J6 | PMD4 — Parallel Master Port data 4 |
| Pin J7 | PMD5 — Parallel Master Port data 5 |
| Pin J8 | PMD6 — Parallel Master Port data 6 |
| Pin J9 | PMD7 — Parallel Master Port data 7 |
| Pin J10 | PMRD — Parallel Master Port read strobe |
| Pin K1 | PMA0 — Parallel Master Port address 0 |
| Pin K2 | PMA1 — Parallel Master Port address 1 |
| Pin K3 | PMWR — Parallel Master Port write strobe |
| Pin K4 | PMCS — Parallel Master Port chip select |
| Pin K5 | PMD8 — Parallel Master Port data 8 |
| Pin K6 | PMD9 — Parallel Master Port data 9 |
| Pin K7 | PMD10 — Parallel Master Port data 10 |
| Pin K8 | PMD11 — Parallel Master Port data 11 |
| Pin K9 | PMD12 — Parallel Master Port data 12 |
| Pin K10 | PMD13 — Parallel Master Port data 13 |
Typische Anwendungen
PIC32MZ1024EFM100-E/GJX ist geeignet für 6 Anwendungs: Industrial IoT Gateway, Automotive HMI / Instrument Cluster, USB Audio Streaming Device, Secure Connected Motor Controller, Industrial TFT / HMI Panel, Portable Medical Monitoring Device.
Industrial IoT Gateway
The PIC32MZ1024EFM100-E/GJX is a strong fit for industrial IoT gateways because its integrated 10/100 Ethernet MAC with RMII/MII plus HS USB OTG and dual CAN 2.0b controllers consolidate three wired interfaces on a single chip. With 1 MB Flash, the part runs full TCP/IP stacks (TCP, UDP, HTTP, MQTT) plus application firmware and still leaves headroom for OTA update staging. The 512 KB SRAM comfortably holds TLS 1.2 handshake buffers and Modbus transaction buffers. Per Microchip datasheet DS50002359A, the -40C to +125C E temperature grade supports deployment in factory cabinets, outdoor enclosures, and vehicle-side installations. The FPU accelerates JSON parsing in gateway logic, and the 12-bit ADC up to 2 MSPS supports local analog sensor monitoring. Typical BOM reduction of 30-40% versus multi-chip MCU plus external PHY plus external CAN controller designs is achievable.
Empfohlen
Automotive HMI / Instrument Cluster
The PIC32MZ1024EFM100-E/GJX targets automotive HMI and instrument cluster applications thanks to its -40C to +125C E temperature grade, 200 MHz MIPS32 core with FPU, and integrated peripherals including CAN, USB, and a 12-bit ADC. The FPU accelerates TFT panel rendering and 3D gauge math, while the 1 MB Flash stores vector fonts, graphics primitives, and the cluster application. Per Microchip datasheet DS50002359A, dual-bank Flash supports live update without instrument downtime, which is critical for cluster mid-life recalibration. The 100-pin TFBGA package's compact 7x7 mm footprint leaves board area for the TFT connector and capacitive touch interface. Hardware crypto engine enables secure diagnostics over CAN/UDS. The 8-channel DMA offloads display refresh from the CPU, freeing MIPS for graphic animations.
Empfohlen
USB Audio Streaming Device
The PIC32MZ1024EFM100-E/GJX enables USB audio streaming devices with HS USB 2.0 OTG running at 480 Mbps, supporting USB Audio Class 1.0 and 2.0 with high-bandwidth isochronous transfers. Per Microchip datasheet DS50002359A, the integrated I2S/SSI peripheral connects directly to external audio DACs/ADCs, while the FPU handles sample-rate conversion and equalization in real time. With 512 KB SRAM the part buffers 5-10 ms of audio at 96 kHz/24-bit stereo without dropouts, eliminating the need for an external memory chip. The hardware AES/SHA accelerator handles HDCP and content-protection for premium audio streams. The -40C to +125C E grade supports automotive infotainment deployments where consumer-grade parts would fail.
Empfohlen
Secure Connected Motor Controller
The PIC32MZ1024EFM100-E/GJX fits secure connected motor controllers where field-oriented control (FOC) algorithms must run alongside encrypted communication. The single-precision FPU executes Park/Clarke transforms and PI loops at the required 20 kHz control rate, while the hardware AES/DES/SHA engine handles TLS/SSH authentication with the supervisory PLC. Per Microchip datasheet DS50002359A, the integrated 12-bit ADC at 2 MSPS samples three-phase currents with sufficient oversampling bandwidth for sensorless control schemes. Dual CAN 2.0b interfaces allow both motor network (CANopen or DS301) and safety network (CANopen Safety) on the same chip. The E temperature grade supports under-hood and outdoor industrial environments. The Peripheral Pin Select (PPS) lets engineers route PWM channels to any GPIO, simplifying PCB layout.
Empfohlen
Industrial TFT / HMI Panel
The PIC32MZ1024EFM100-E/GJX drives industrial TFT panels using its integrated Parallel Master Port (PMP) interface and 12-bit ADC for touch sensing via an external touch controller. Per Microchip datasheet DS50002359A, the FPU accelerates PNG decode and 2D graphic primitives like anti-aliased text rendering, while the 8-channel DMA offloads frame buffer updates. The 1 MB Flash stores the full HMI firmware plus multi-language resource tables for global deployment. With E temperature grade (-40C to +125C), the part operates in factory floor environments with high humidity and ambient temperature swings. The 100-pin TFBGA 7x7 mm footprint supports compact panel designs where PCB area is at a premium.
Empfohlen
Portable Medical Monitoring Device
The PIC32MZ1024EFM100-E/GJX is suitable for portable medical monitoring devices such as pulse oximeters, ECG patches, and handheld spirometers. The 200 MHz MIPS core with FPU executes signal-processing algorithms (FFT, FIR filtering, R-peak detection) in real time, while the 12-bit ADC at 2 MSPS captures physiological signals at sufficient oversampling rates. Per Microchip datasheet DS50002359A, the 1 MB Flash stores device firmware plus waveform pattern databases. Hardware AES/SHA enables HIPAA-compliant encrypted patient data transmission. The -40C to +125C E grade supports rapid temperature transitions between refrigerated storage and body-temperature use. HS USB OTG supports fast data offload to clinician PCs and charging. Low-power sleep modes extend battery life for ambulatory monitoring.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFM100-E/GJX – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFM100-I/GJX | PIC32MZ1024EFM100T-I/GJX | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFG100T-I/GJX | PIC32MZ1024EFF100-E/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TFBGA (GJX), 7x7 mm | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (GJX) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) |
| Hardware Crypto Engine | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) | Yes | Yes |
| CAN Controllers | 2 x CAN 2.0b | 2 x CAN 2.0b | 2 x CAN 2.0b | 2 x CAN 2.0b | 2 x CAN 2.0b | No CAN (F variant) |
| HS USB OTG | Yes | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 RMII/MII | 10/100 RMII/MII | 10/100 RMII/MII | 10/100 RMII/MII | 10/100 RMII/MII | 10/100 RMII/MII |
Wichtigste Unterscheidungsmerkmale
- Higher temperature range (-40C to +125C) for harsh environments (vs. PIC32MZ1024EFM100-I/GJX)
- Includes hardware crypto engine for secure connectivity (vs. PIC32MZ1024EFF100-E/GJX)
- Includes dual CAN 2.0b controllers (vs. PIC32MZ1024EFF100-E/GJX)
- 1 MB Flash with dual-bank live-update capability (vs. PIC32MZ1024EFE100-E/GJX)
Designhinweise
Place one 100 nF X7R ceramic decoupling capacitor within 5 mm of every VDD/VSS pair of the PIC32MZ1024EFM100-E/GJX. The 200 MHz core and FPU produce high-frequency switching transients; insufficient decoupling leads to Flash programming failures and ADC measurement noise. Per Microchip datasheet DS50002359A, AVDD requires its own ferrite bead and dedicated 100 nF plus 10 uF bulk capacitor. Estimate: with 16 active VDD pins and 100 nF each, the total local decoupling budget is approximately 1.6 uF distributed across the package.
Estimated: at 200 MHz, VDD = 3.3 V, and active peripheral mix (Ethernet + USB + ADC), the PIC32MZ1024EFM100-E/GJX draws approximately 80-110 mA core current. With theta_JA around 25 C/W for the 7x7 TFBGA package on a 4-layer JEDEC PCB, the junction-to-ambient rise is roughly 8-12 C above ambient at peak load. For -40C to +125C E grade parts, the junction limit is 150 C, so at 85 C ambient the part has 60-65 C margin. A thermal relief copper pour directly under the BGA is required to stay within margin.
The 100-pin TFBGA package uses a 0.65 mm pitch with 7x7 mm body. Microchip datasheet DS50002359A specifies 6-mil laser-drilled microvias and 4-layer stack-up with continuous ground plane. Use 1-oz copper outer layers and via-in-pad for the 0.4 mm pad diameter. BGA escape routing should route every signal on the outer row through the inner rows to breakout - 0.65 mm pitch allows only 4 mil trace width with 4 mil spacing.
Do not leave unused analog pins floating on the PIC32MZ1024EFM100-E/GJX - tie each unused ANx pin to either AVDD or AVSS through a 10 kohm resistor to prevent ADC cross-channel leakage. Per Microchip datasheet DS50002359A, the Peripheral Pin Select (PPS) registers default to safe states after reset but are not latched; configure them in the init code before enabling peripherals. JTAG pins TMS/TCK/TDO/TDI must not be left floating if JTAG is unused - tie TMS high through 10 kohm.
Keep the 50 MHz Ethernet RMII traces under 50 mm total length, matched within 2 mm. Place the 50 MHz reference clock source within 25 mm of the EREFCLK pin. USB D+/D- traces must be 90 ohm differential with no stubs, and the VBUS sense pin must connect directly to VBUS through a 10 kohm divider. Per Microchip datasheet DS50002359A, the Ethernet PHY should be placed within 100 mm of the MCU and share a common ground island.
Compliance-Informationen
RoHS compliant per Microchip product page. -40C to +125C E temperature grade supports industrial and automotive-grade deployments but the part is not AEC-Q100 qualified as a standalone certification - consult Microchip for AEC-Q100 documentation if required.
