Microchip Technology

PIC32MZ2025DAK169-I/HF - 200MHz 32-bit MCU, 2MB Flash, 169-LFBGA | Microchip

부품 번호: PIC32MZ2025DAK169-I/HF ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.8V nominal (core) Vdss 169-LFBGA (11x11 mm) Package 200 MHz Speed 2 MB (2M x 8) Memory
시작가 $5.86 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-04
볼륨 가격
수량 단가 합계
1 $8.42 $8.42
10 $7.58 $75.80
100 $6.85 $685.00
500 $6.21 $3,105.00
1,000 $5.86 $5,860.00
ℹ️ 모든 가격은 USD 기준입니다

PIC32MZ2025DAK169-I/HF 개요

The Microchip Technology PIC32MZ2025DAK169-I/HF is a high-performance 32-bit MIPS32 microAptiv PIC microcontroller running at 200 MHz, featuring 2 MB of Flash, 640 KB of SRAM, and an integrated graphics controller with dedicated graphics processor, designed for graphical user-interface (GUI) applications. It is housed in a 169-ball LFBGA package measuring 11x11 mm, supports 1.8V core operation, and includes HS USB, Ethernet, CAN, and DDR2 DRAM controller (32 MB or 128 MB externally addressable). The device also integrates a 12-bit 18 MSPS ADC with up to 45 analog inputs.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and programmable peripherals into one package. The PIC32MZ DAK family sits in the high-end graphics tier of Microchip's 32-bit portfolio, positioned between general-purpose MCUs and microprocessors (MPUs). It is purpose-built for embedded HMI designs that need rich graphics without the complexity of running a full Linux stack on an MPU.

Key features of the PIC32MZ2025DAK169-I/HF include: 32 KB instruction cache and 32 KB data cache for predictable real-time performance, a 200 MHz core with 330 DMIPS throughput, a TFT LCD controller with dedicated DMA for low-CPU-overhead display refresh, and a 32-bit external DDR2 memory interface for large frame buffers. The integrated graphics processor accelerates primitives, alpha blending, color conversion, and image scaling, offloading tasks that would otherwise consume significant MIPS.

Architecturally, the part uses the MIPS32 microAptiv core with DSP and microMIPS support, giving designers an instruction-efficient RISC pipeline. The combination of hardware graphics acceleration, large on-chip memory, and high-speed connectivity (HS USB, Ethernet, CAN) makes it a strong fit for self-contained industrial and consumer HMIs.

Typical applications include industrial control HMI panels, home appliance graphical interfaces, automotive instrument clusters, medical device UIs, and IoT gateways with local displays. It is also suitable for building automation touch panels and point-of-sale terminals.

When designing with this MCU, pay careful attention to PCB layout for the 169-ball BGA - via-in-pad is typically required and DDR2 routing must follow matched-length rules. Power sequencing for the 1.8V core rail and DDR2 termination must follow the datasheet guidelines to avoid POR issues. Programming is supported by MPLAB X IDE with the Harmony v3 framework.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers and procurement teams with a single source for engineering decisions on the PIC32MZ2025DAK169-I/HF.

드롭인 대체품: PIC32MZ2025DAK169-I/HF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ2025DAK169-I/HF (동일 폼 팩터 및 풋프린트) — 차이점: USB, Graphics Controller, CAN, Core Architecture, Operating Temperature.

Microchip Technology
USB: 1x USB 2.0 Full-Speed + 1x USB 2.0 Hi-Speed (HS USB)
Graphics Controller: Integrated 2D GPU + LCD controller
CAN: 2x CAN 2.0b
Microchip Technology
USB: Hi-Speed USB 2.0
Graphics Controller: Integrated TFT LCD controller + 2D GPU
CAN: Yes (CAN 2.0B)
Microchip Technology
USB: Hi-Speed USB 2.0
Graphics Controller: Integrated (LCD controller + GPU)
CAN: 2x CAN modules
Microchip Technology
USB: Hi-Speed USB
Graphics Controller: Integrated (parallel RGB TFT up to WXGA)
CAN: Yes
Microchip Technology
USB: Hi-Speed USB with on-chip transceiver
Graphics Controller: Integrated
Core Architecture: MIPS32 microAptiv
Microchip Technology
USB: High-Speed USB 2.0
Graphics Controller: Integrated, with Graphics Processor
CAN: Yes (CAN 2.0B)
Microchip Technology
USB: Hi-Speed USB (HS USB)
CAN: Yes (integrated)
Core Architecture: MIPS32 microAptiv

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

PIC32MZ2025DAK169T-I/HF

✅ 드롭인
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv · Single-core · 200 MHz · 2 MB (2M x 8) · 640 KB · DDR2 DRAM controller (up to 128 MB addressable) · Integrated, with Graphics Processor · 12-bit, 18 MSPS, up to 45 analog inputs

✓ 재고 있음

$10.65 / 개

데이터시트 보기 →

PIC32MZ2025DAK169-V/HF

✅ 드롭인
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv · Single-core · 200 MHz · 2 MB (2M x 8) · 640 KB · Yes (cache-based MCU) · 12-bit, 18 MSPS, up to 45 analog inputs · Integrated

✓ 재고 있음

$7.94 / 개

데이터시트 보기 →

PIC32MZ1025DAK169-I/HF

✅ 드롭인
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv (PIC32MZ DAK) · 1 (Single-core) · 200 MHz · 1 MB (1M x 8) · 256 KB (DAK sub-family) · EBI for DDR2 DRAM (up to 32 MB K variant) · 12-bit, up to 18 MSPS, up to 45 analog inputs · Integrated 2D GPU + LCD controller

✓ 재고 있음

$10.95 / 개

데이터시트 보기 →

PIC32MZ2025DAB169T-I/HF

✅ 드롭인 ⚠️ 사양 미검증
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv · PIC32MZ DA · 32-bit · 200 MHz · 2 MB (2M x 8) · 640 KB · 169-LFBGA (11x11 mm) · 3.3 V

✓ 재고 있음

$12.62 / 개

데이터시트 보기 →

PIC32MZ2025DAA169-I/HF

✅ 드롭인 ⚠️ 사양 미검증
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv · 32-bit RISC · 200 MHz · 330 DMIPS / 3.28 CoreMark/MHz · 2 MB · 640 KB · Up to 128 MB DDR2 DRAM (externally addressable) · Integrated (LCD controller + GPU)

✓ 재고 있음

$12.8 / 개

데이터시트 보기 →

PIC32MZ1064DAB169-I/HF

✅ 드롭인 ⚠️ 사양 미검증
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv (32-bit) · PIC32MZ Graphics (DA) · 200 MHz · 1 MB (1M x 8) · 640 KB · Up to 128 MB DDR2 DRAM addressable · 1.7 V to 3.6 V · 12-bit, 18 MSPS, up to 45 analog inputs

✓ 재고 있음

$12.4 / 개

데이터시트 보기 →

PIC32MZ2025DAK169-I/HF 최대 정격 & 전기적 특성

Core Architecture MIPS32 microAptiv with microMIPS and DSP extensions
Core Frequency 200 MHz
DMIPS 330 DMIPS
Program Flash 2 MB (2M x 8)
SRAM 640 KB
Instruction Cache 32 KB
Data Cache 32 KB
Operating Voltage 1.8V nominal (core)
ADC 12-bit, 18 MSPS, up to 45 analog inputs
Graphics Controller Integrated TFT LCD controller + graphics processor
External Memory Interface DDR2 controller, 32-bit, up to 128 MB addressable
USB Hi-Speed USB 2.0 (host/device/OTG)
Ethernet 10/100 Mbps MAC
CAN CAN 2.0B controller
패키지 169-LFBGA (11x11 mm)
실장 유형 Surface Mount (BGA)
동작 온도 -40C to +85C (Industrial)
RoHS 상태 Compliant
Programming MPLAB X IDE, MPLAB Harmony v3

PIC32MZ2025DAK169-I/HF 169-lfbga (11x11 mm) 핀 구성 가이드

PIC32MZ2025DAK169-I/HF(169-lfbga (11x11 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

PIC32MZ2025DAK169-I/HF의 169-lfbga (11x11 mm) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ2025DAK169-I/HF.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

PIC32MZ2025DAK169-I/HF 적합 용도: 6 애플리케이션s: Industrial HMI Control Panel, Home Appliance Graphical Interface, Automotive Instrument Cluster Display, Medical Device User Interface, Building Automation Touch Panel, Point-of-Sale Terminal Display.

🏭

Industrial HMI Control Panel

The PIC32MZ2025DAK169-I/HF is ideal for industrial HMI control panels because its integrated TFT LCD controller and dedicated graphics processor offload rendering of buttons, gauges, and trend graphs from the CPU, leaving the 200 MHz MIPS core available for Modbus/TCP, EtherNet/IP, and real-time control loops. With 2 MB Flash and 640 KB SRAM, the device stores multilingual UI assets, custom fonts, and bitmaps without external memory, while the 32-bit DDR2 controller (up to 128 MB addressable) enables smooth full-screen animations at 24-bit color depth. The 12-bit 18 MSPS ADC handles analog sensor inputs from temperature, pressure, and flow transducers. Designers typically pair this MCU with a 4.3- to 7-inch WVGA TFT display.

🏠

Home Appliance Graphical Interface

For high-end home appliances such as smart ovens, washing machines, and induction cooktops, the PIC32MZ2025DAK169-I/HF delivers the graphics performance required for animated cooking profiles, recipe animations, and capacitive-touch knob indicators. The hardware graphics processor accelerates alpha-blended icons and color conversion, enabling smooth 60 fps UI updates without burdening the main CPU. The HS USB 2.0 interface supports firmware updates from a USB stick, while Ethernet enables IoT cloud connectivity. Its industrial temperature rating (-40C to +85C) handles the thermal environment of appliance enclosures, and 2 MB Flash stores complex multilingual firmware.

🚗

Automotive Instrument Cluster Display

The PIC32MZ2025DAK169-I/HF is suited for two-wheeler, agricultural, and recreational vehicle instrument clusters where its integrated graphics controller drives a TFT panel showing speedometer, tachometer, fuel level, and warning indicators with smooth needle animations. The dedicated graphics processor accelerates primitive rendering and alpha blending, freeing the 200 MHz core for CAN bus message handling, sensor fusion, and indicator logic. The 12-bit 18 MSPS ADC samples up to 45 analog inputs simultaneously, supporting multiple analog sensors. DDR2 memory (up to 128 MB externally addressable) enables cinematic startup animations and detailed map backgrounds. Designers should consider the -V/HF variant for harsher automotive thermal profiles.

💊

Medical Device User Interface

Medical devices such as infusion pumps, patient monitors, and diagnostic analyzers benefit from the PIC32MZ2025DAK169-I/HF's deterministic 200 MHz MIPS core and integrated graphics for clear, real-time waveform and numeric displays. The hardware graphics processor accelerates trend graphs and alarm indicators without CPU overhead, critical for medical-grade latency requirements. With 2 MB Flash, firmware can store calibration tables, patient profiles, and multi-language UI strings on-chip. The 12-bit 18 MSPS ADC digitizes sensor signals with adequate resolution for vital-sign monitoring. Ethernet and HS USB enable integration with hospital information systems and bedside connectivity modules.

🧩

Building Automation Touch Panel

For building automation touch panels controlling lighting, HVAC, and access, the PIC32MZ2025DAK169-I/HF provides the processing headroom for smooth capacitive-touch response and animated floor-plan graphics. The 640 KB on-chip SRAM accommodates touch-coordinate buffers and rendering layers, while the 2 MB Flash stores zone configuration, custom icons, and protocol stacks for BACnet, Modbus, or KNX gateways. The Ethernet MAC and HS USB support commissioning via PC and over-the-air updates. Designers can pair the MCU with a 5-inch or 7-inch 800x480 TFT display for room-control stations.

🖥️

Point-of-Sale Terminal Display

POS terminals use the PIC32MZ2025DAK169-I/HF to drive the customer-facing or operator-facing TFT display with transaction amounts, QR codes, and promotional animations. The hardware graphics processor accelerates QR code rendering and animated transition effects that differentiate modern POS designs. The integrated Ethernet MAC supports IP-based payment terminals and cloud sync, while HS USB connects to receipt printers and barcode scanners. The 2 MB Flash stores the firmware, fonts, and graphics assets, and the 12-bit ADC reads battery voltage or thermal sensors. Designers benefit from a single-chip solution that replaces separate MCU + external graphics controller designs.

What is the core architecture and clock speed of PIC32MZ2025DAK169-I/HF?
The PIC32MZ2025DAK169-I/HF integrates a MIPS32 microAptiv core running at 200 MHz, delivering 330 DMIPS throughput. According to Microchip's product page, this core includes microMIPS instruction compression and DSP extensions, enabling a compact code footprint for graphics-intensive applications.
How much Flash and SRAM does PIC32MZ2025DAK169-I/HF have?
The PIC32MZ2025DAK169-I/HF provides 2 MB of in-system programmable Flash and 640 KB of SRAM, with an additional 32 KB instruction cache and 32 KB data cache. Microchip's product page specifies that the SRAM can be used as a frame buffer or data memory for graphical workloads.
What package does PIC32MZ2025DAK169-I/HF use?
The PIC32MZ2025DAK169-I/HF comes in a 169-ball LFBGA (Low-profile Fine-pitch Ball Grid Array) package measuring 11x11 mm. Per the Microchip product page, this BGA requires via-in-pad PCB construction for reliable assembly and supports the high pin count needed for DDR2, graphics, and connectivity peripherals.
Does PIC32MZ2025DAK169-I/HF support external DDR2 memory?
Yes. The PIC32MZ2025DAK169-I/HF integrates a 32-bit DDR2 memory controller capable of addressing up to 128 MB externally. The Microchip product page confirms that this is critical for GUI applications needing large frame buffers beyond the internal 640 KB SRAM.
Where to buy PIC32MZ2025DAK169-I/HF online?
The PIC32MZ2025DAK169-I/HF is in stock at DigiKey, Mouser, and LCSC as of 2026-10-04. LCSC lists a starting price of $5.8637 per unit; DigiKey lists tape-and-reel stock ready for immediate shipment. All are franchised distributors offering original Microchip parts.
What is the price of PIC32MZ2025DAK169-I/HF?
As of 2026-10-04, the LCSC listing for PIC32MZ2025DAK169-I/HF starts at $5.8637 for single-unit purchases, with volume pricing available at 10, 100, 500, and 1000-piece breaks through franchised distributors. Prices at DigiKey track similarly with current stock availability.
What is the lead time for PIC32MZ2025DAK169-I/HF?
The PIC32MZ2025DAK169-I/HF is currently in production with lead time typically 8-12 weeks from Microchip factory, though franchised distributors like DigiKey and LCSC show in-stock inventory as of 2026-10-04, enabling immediate shipment for prototype and small-volume orders.
PIC32MZ2025DAK169-I/HF vs PIC32MZ2025DAH169 - which is better for graphics?
Both parts share the same 200 MHz core, 2 MB Flash, and 640 KB SRAM, and both integrate the same graphics controller and DDR2 interface. The -DAK variant specifies the 169-LFBGA 11x11 mm package, while the -DAH variant uses a different pinout/package. Choose based on PCB mechanical constraints rather than graphics capability.
PIC32MZ2025DAK169-I/HF vs PIC32MZ1025DAK169-I/HF - what is the difference?
The '2025' and '1025' prefixes indicate Flash density: the 2025 has 2 MB Flash while the 1025 has 1 MB Flash. According to the Microchip product page, both share the same 169-LFBGA package, 200 MHz core, and graphics features, making the 1025 a pin-compatible drop-in alternative when 1 MB Flash suffices.
When should I choose PIC32MZ2025DAK169-I/HF over PIC32MX alternatives?
Choose PIC32MZ2025DAK169-I/HF when your design requires an integrated graphics controller, DDR2 frame buffer support, HS USB, and 200 MHz CPU performance for GUI workloads. For simpler non-graphical 32-bit designs, PIC32MX parts offer lower cost but lack the dedicated graphics processor.
What is the best drop-in replacement for PIC32MZ2025DAK169-I/HF?
The best drop-in replacement is PIC32MZ2025DAK169T-I/HF (tape-and-reel packaging variant of the same die), followed by PIC32MZ1025DAK169-I/HF when 1 MB Flash is acceptable. Both share the 169-LFBGA 11x11 mm package and pinout, providing identical functional compatibility on the same PCB footprint.
Where to download PIC32MZ2025DAK169-I/HF datasheet PDF?
The official PIC32MZ2025DAK169-I/HF datasheet is available from Microchip's product page at microchip.com/en-us/product/PIC32MZ2025DAK169. According to the Microchip documentation, the datasheet covers electrical characteristics, pinout, peripheral configuration, and programming information for the entire PIC32MZ Graphics DA family.
Where to find PIC32MZ2025DAK169-I/HF pinout?
The PIC32MZ2025DAK169-I/HF pinout for the 169-LFBGA package is documented in the family datasheet available from Microchip's product page. The pin assignment table maps each of the 169 balls to functions including GPIO, peripheral inputs/outputs, DDR2 interface, USB, Ethernet, and analog inputs.
Is PIC32MZ2025DAK169-I/HF the same as PIC32MZ2025DAK169-V/HF?
No. The -I/HF suffix indicates the industrial temperature range (-40C to +85C), while the -V/HF suffix indicates an extended or different qualification per Microchip's ordering code convention. Both share the same 169-LFBGA package and die, but they are distinct ordering part numbers with separate qualification profiles.
What are the key specifications of PIC32MZ2025DAK169-I/HF that engineers should know?
The PIC32MZ2025DAK169-I/HF is a 200 MHz MIPS32 microAptiv MCU with 2 MB Flash, 640 KB SRAM, integrated graphics controller + graphics processor, DDR2 controller (up to 128 MB), HS USB, Ethernet, CAN, and a 12-bit 18 MSPS ADC. It is housed in a 169-LFBGA 11x11 mm package and operates from 1.8V core. This dense spec set makes it a self-contained MPU-class graphics platform for embedded HMI designs.

엔지니어링 참조 데이터: PIC32MZ2025DAK169-I/HF — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose PIC32MZ2025DAK169-I/HF when your design needs integrated hardware graphics acceleration, DDR2 frame buffer support, and a 169-LFBGA compact footprint for industrial HMI panels. Choose PIC32MZ1025DAK169-I/HF if your firmware fits in 1 MB Flash and you want a cost-optimized drop-in. Choose PIC32MZ2025DAK169-V/HF for harsher thermal environments per Microchip's ordering code conventions. For non-graphical 32-bit designs, PIC32MX parts offer lower cost but lack the dedicated graphics processor. All DAK-family variants share the same 169-LFBGA 11x11 mm footprint, enabling PCB reuse across product tiers.

대체품과의 비교

파라미터 이 제품 PIC32MZ2025DAK169T-I/HF PIC32MZ2025DAK169-V/HF PIC32MZ1025DAK169-I/HF PIC32MZ2025DAB169T-I/HF PIC32MZ2025DAA169-I/HF PIC32MZ1064DAB169-I/HF
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 169-LFBGA (11x11 mm) 169-LFBGA (11x11 mm) - same 169-LFBGA (11x11 mm) - same 169-LFBGA (11x11 mm) - same 169-LFBGA (11x11 mm) - same 169-LFBGA (11x11 mm) - same 169-LFBGA (11x11 mm) - same
Core Frequency 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
Flash 2 MB 2 MB 2 MB 1 MB (-50%) 2 MB 2 MB 2 MB
Graphics Processor Yes (integrated) Yes Yes Yes Yes Yes Yes
DDR2 Controller Yes (up to 128 MB) Yes Yes Yes Yes Yes Yes
Temperature Grade Industrial (-40C to +85C) Industrial (-40C to +85C) Extended per Microchip ordering code Industrial (-40C to +85C) Industrial (-40C to +85C) Industrial (-40C to +85C) Industrial (-40C to +85C)

주요 차별점

  • Integrated hardware graphics processor offloads rendering from CPU (vs PIC32MX795F512LT-80I/PT)
  • DDR2 memory controller supports up to 128 MB external frame buffer (vs PIC32MZ1025DAK169-I/HF)
  • Same-family pin-compatible tape-and-reel variant available (vs PIC32MZ2025DAK169T-I/HF)

설계 노트

The 169-LFBGA package requires via-in-pad (VIP) PCB construction for reliable assembly and electrical performance, especially for the high-speed DDR2 interface. Per Microchip layout guidelines, follow the land pattern and via diameter recommendations in the package drawing; do not substitute dog-bone fan-outs unless the DDR2 timing budget permits. Matched-length routing of DDR2 signals is critical - keep length matching within 25 mils for clock, DQS, and DQ groups to avoid setup/hold violations at 200 MHz.

Power sequencing of the 1.8V core rail relative to the DDR2 termination voltage must follow the datasheet guidelines to avoid power-on-reset (POR) issues or latch-up. Use a dedicated LDO or DC-DC regulator for the MCU core, and decouple with 100 nF ceramic capacitors as close as possible to each power pin pair. Bulk decoupling of 10 uF ceramic + 22 uF tantalum is recommended at the regulator output.

Keep the TFT LCD data and sync traces short and routed over a continuous ground plane to minimize EMI and crosstalk. The 12-bit ADC analog inputs are sensitive to digital switching noise - separate analog and digital ground planes and join them at a single point near the MCU GND pin. The USB D+/D- traces require 90 ohm differential impedance; route them first and avoid vias on these signals.

Although the LFBGA package has reasonable thermal dissipation through its ground balls, sustained operation at 200 MHz with DDR2 + graphics acceleration can produce noticeable junction temperature rise. Provide an unbroken ground copper pour beneath the BGA, and consider thermal vias under the central ball grid to conduct heat to an internal ground plane or backside copper layer. The industrial -40C to +85C rating covers typical appliance and industrial environments.

Do not assume all 169-LFBGA variants of the PIC32MZ DA family share identical ball-out - the DAK, DAL, DAR, DAS suffixes denote different peripheral mixes and ball assignments even at the same pin count. Always cross-check the specific datasheet pin table for the exact ordering code. Also, the DDR2 controller requires careful ZQ calibration resistor selection (typically 240 ohm to ground) and proper termination voltage (VTT = VDDQ/2) - incorrect values cause intermittent memory errors under load.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40C to +85C). AEC-Q100 not applicable for this industrial-grade part - Microchip offers automotive-qualified variants in other families.

데이터 검증일: 2026-10-04 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

Microchip Technology PIC32MZ2025DAK169 PIC32MZ2025DAK169-I/HF PIC32MZ1025DAK169 PIC32MX795F512LT MIPS32 microAptiv microMIPS DSP extension 32-bit microcontroller MCU TFT LCD controller graphics processor DDR2 controller Hi-Speed USB Ethernet MAC CAN 2.0B 12-bit ADC 169-LFBGA BGA surface mount RoHS REACH MPLAB X IDE MPLAB Harmony industrial HMI
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