RTAX250S-CG624E - 250K-Gate Rad-Tolerant FPGA | Microchip
Teilenummer: RTAX250S-CG624E ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
RTAX250S-CG624E Übersicht
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space, where conventional commercial silicon suffers single-event upsets (SEUs), latch-up, and total ionizing dose (TID) degradation. Within the power and processing hierarchy of a spacecraft avionics system, the RTAX-S family sits at the payload and platform logic layer, replacing multiple rad-hard ASICs and discrete glue logic with a single-chip, live-at-power-up programmable device.
Key differentiating features include SEU-hardened flip-flops that eliminate the need for triple modular redundancy (TMR) in many designs, immunity to single-event upsets up to a specified linear energy transfer threshold, and SEU rates below 10-10 errors per bit-day. The one-time-programmable antifuse fabric gives the device true single-chip form factor, live-at-power-up operation, and low static power consumption - critical for orbit-limited spacecraft power budgets. Core operation is at 1.5V on 0.15 um CMOS technology.
The RTAX250S architecture provides CLB combinatorial delays as low as 0.930 ns at the -1 speed grade, supporting system clocks in the hundreds of megahertz. Design flow prototyping is enabled by Microchip application note AC170, which maps RTAX-S designs onto commercial Axcelerator devices using extender circuit boards; Aldec ACT-H3K-CG624 adaptor boards also emulate the CG624 footprint using ProASIC3E flash technology for reprogrammable validation before committing antifuse programming.
Typical applications include satellite payload data processing, spacecraft command and data handling (C&DH) units, telemetry and telecommand interfaces, bus avionics, and instrument control for low-Earth-orbit and deep-space missions. The 624-ball CCGA package supplies the high I/O count required for wide parallel data buses and memory interfaces.
Designers should note that antifuse FPGAs are one-time programmable: the design must be fully verified via prototyping hardware or simulation before the flight device is programmed. Also confirm that the CG624 column-grid-array board stack-up and reflow profile follow Microchip ceramic-package assembly guidance.
This page synthesizes verified distributor data, same-family drop-in alternatives, datasheet access links, and practical design notes not found together on the manufacturer product page, giving space-systems engineers and procurement teams a single citable reference for the RTAX250S-CG624E.
Drop-in-Alternativen für RTAX250S-CG624E – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit RTAX250S-CG624E (gleiche Bauform und Footprint) – abweichend in Package, Radiation Tolerance, Family, Equivalent System Gates, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
RTAX250SL-CG624B
✅ Drop-In✓ Auf Lager
$3950 / Stück
Datenblatt ansehen →RTAX250S-1CG624E
✅ Drop-In✓ Auf Lager
$960 / Stück
Datenblatt ansehen →RTAX250SL-LG624B
✅ Drop-In✓ Auf Lager
$2380 / Stück
Datenblatt ansehen →RTAX2000SL-CGS624E
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX1000S-LG624V
✅ Drop-In✓ Auf Lager
$2600 / Stück
Datenblatt ansehen →RTAX250S-CG624E Grenzwerte & elektrische Eigenschaften
| System Gates | 250000 gates |
| Logic Cells (CLBs) | 2816 |
| Maximum Toggle Frequency | 649 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Logic Family | CMOS |
| CLB Combinatorial Delay (max) | 0.930 ns |
| Package Type | CCGA-624 (ceramic column grid array, 624 pins) |
| Betriebstemperatur | -55C to +125C |
| Programming Technology | Antifuse (one-time programmable) |
| SEU Hardening | SEU-hardened registers, no external TMR required |
| SEU Immunity | Immune to single-event upsets to specified LET threshold; SEU rate < 10-10 errors/bit-day |
| Power-Up Behavior | Live at power-up (true single-chip) |
| Family | RTAX-S radiation-tolerant FPGA |
| Montageart | Surface Mount |
| Target Application | Space-flight systems |
RTAX250S-CG624E ccga-624 (ceramic column grid array, 624 pins) Pinbelegungsleitfaden
Pinbelegung für RTAX250S-CG624E (ccga-624 (ceramic column grid array, 624 pins)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für RTAX250S-CG624E.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
RTAX250S-CG624E ist geeignet für 6 Anwendungs: Satellite Payload Data Processing, Spacecraft Command and Data Handling (C&DH), Telemetry and Telecommand Interfaces, Instrument Control for Science Missions, Launch Vehicle and Avionics Bus Logic, Deep-Space Mission Data Storage Controllers.
Satellite Payload Data Processing
The RTAX250S-CG624E fits satellite payload processing chains where 250K gates of glue logic, FIFOs, framing, and bus bridging must run reliably in orbit. Its SEU-hardened registers remove the need for TMR in most register paths (SEU rate < 10-10 errors/bit-day), and the antifuse fabric is configuration-upset immune because it is one-time programmed and live at power-up - no configuration memory to corrupt. The 624-ball CCGA supplies the I/O count for wide parallel payload buses, while 1.5 V core operation on 0.15 um CMOS keeps static power inside tight spacecraft power budgets. Designers prototype on Axcelerator or Aldec adaptor hardware, then commit the flight design.
Empfohlen
Spacecraft Command and Data Handling (C&DH)
In C&DH units, the RTAX250S-CG624E implements telecommand decoders, telemetry formatters, watchdog logic, and memory controllers between the onboard computer and spacecraft subsystems. Live-at-power-up operation means the device is functional the instant spacecraft power arrives - important for launch-vehicle sequencing where no configuration load time is acceptable. The -55C to +125C operating range covers unheated equipment-bay thermal excursions, and SEU-hardened flip-flops protect state machines commanding safety-critical functions. The 624-pin ceramic column package withstands vibration and thermal cycling, matching hermetic hybrid and ceramic-module board assemblies typical of C&DH hardware.
Empfohlen
Telemetry and Telecommand Interfaces
For TM/TC interface boards, the RTAX250S-CG624E provides Manchester encoding/decoding, frame synchronization, and CCSDS-adjacent framing glue logic at system clocks in the hundreds of MHz (family toggle rate 649 MHz, CLB combinatorial delay 0.930 ns at the -1 grade). The single-chip antifuse form factor replaces multiple rad-hard MSI devices, cutting board area, solder joints, and screening cost. Because the fabric configuration cannot be upset in flight, link-state machines stay coherent across the mission without configuration scrubbing hardware, and the 1.5 V core plus low static current suit continuous-operation beacon and housekeeping channels in power-limited small satellites.
Empfohlen
Instrument Control for Science Missions
Science instruments on LEO and deep-space probes use the RTAX250S-CG624E for detector sequencing, ADC/DAC interface timing, and autonomous safe-mode logic. The radiation-tolerant fabric tolerates the belt-passage and solar-event environments where SRAM FPGAs require constant configuration scrubbing; SEU-hardened registers let critical sequencer state run without TMR overhead, preserving logic capacity for algorithmic functions within the 2816-cell budget. The wide -55C to +125C range supports instruments without active thermal control, and the hermetic CCGA-624 package meets contamination and outgassing constraints around optical payloads. Design reuse across the RTAX-S family eases instrument derivative programs.
Empfohlen
Launch Vehicle and Avionics Bus Logic
Avionics bus controllers, ARINC-style discrete interfaces, and redundant two-out-of-three voting logic map naturally onto the RTAX250S-CG624E. Launch environments demand immediate functionality at power application, tolerance to vibration via the ceramic column array, and operation across -55C to +125C - all satisfied by this device. The 0.930 ns CLB combinatorial delay (at -1 grade) allows tight, deterministic flight-critical timing paths, and the antifuse one-time programming prevents in-flight configuration corruption, a certification-friendly property. Engineers validate via the AC170 Axcelerator flow before committing flight parts, minimizing risk on expensive screened CCGA units.
Empfohlen
Deep-Space Mission Data Storage Controllers
Solid-state recorder controllers and memory-interface logic on deep-space probes use the RTAX250S-CG624E for ECC generation, address sequencing, and spacecraft-bus bridging to mass memory. The SEU-hardened register file underpins ECC state machines whose corruption would be mission-ending, achieving the family's sub-10-10 errors/bit-day rate. Single-chip antifuse implementation reduces the board complexity around rad-hard SRAM arrays, and 1.5 V operation limits controller power dissipation inside sealed recorder enclosures. The 624-ball package supports wide memory data buses, and family-common footprints (CG624 across densities) let programs scale capacity without PCB respin when recorder depth changes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für RTAX250S-CG624E – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | RTAX250SL-CG624B | RTAX250S-1CG624E | RTAX250SL-LG624B | RTAX2000SL-CGS624E | RTAX1000S-LG624V |
|---|---|---|---|---|---|---|
| Package | CCGA-624 | CCGA-624 - same | CCGA-624 - same | 624-ball ceramic (LG624-compatible footprint) | CCGA-624 - same | 624-ball ceramic (LG624-compatible footprint) |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 2,000,000 (higher density) | 1,000,000 (higher density) |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Radiation Tolerance Grade | RTAX-S standard rad-tolerant, SEU-hardened registers | RTAX-SL enhanced TID/SEL grade | RTAX-S standard, -1 speed grade | RTAX-SL enhanced TID/SEL grade | RTAX-SL enhanced TID/SEL grade | RTAX-S standard |
Wichtigste Unterscheidungsmerkmale
- Enhanced radiation tolerance option on identical footprint (vs. RTAX250SL-CG624B)
- Standard speed grade cost advantage (vs. RTAX250S-1CG624E)
- Right-sized 250K-gate fabric (vs. RTAX2000SL-CGS624E)
Designhinweise
Antifuse FPGAs are one-time programmable - a design error after programming scraps the flight device. Always complete the prototyping loop first: target the RTAX-S design to a commercial Axcelerator device per Microchip application note AC170, or use the Aldec ACT-H3Ki-CG624 adaptor (flash-based ProASIC3E) which mimics the CG624 ball footprint and mounts directly on the target board. Only program the RTAX250S-CG624E after timing closure, simulation, and hardware validation are fully signed off.
The RTAX250S core runs at 1.5 V on 0.15 um CMOS with very low static power, a key advantage over SRAM-based space FPGAs that require configuration scrubbers drawing continuous power. Budget the 1.5 V rail for logic activity plus I/O termination currents, which can dominate at high toggle rates approaching the 649 MHz family maximum. Verify worst-case supply sequencing at cold (-55C) startup, since antifuse devices are live at power-up and I/O states are active immediately.
The CCGA-624 ceramic column grid array absorbs CTE mismatch between the ceramic body and organic PCB through its compliant column interposers, but board design still matters: follow Microchip ceramic-package assembly guidance for pad geometry (nonsolder-mask-defined pads are typical for CCGA), reflow profile, and inspection. Radiation-hardened PCB laminates and controlled-impedance stack-ups are standard for the wide buses this 624-pin device serves; keep column land pattern tolerance tight to avoid bridging during column-array reflow.
Compliance-Informationen
Space-grade ceramic CCGA packaging; compliance declarations for this screened space part are not published in the verified web data. Space-grade devices may carry specific exemptions - obtain Microchip's material declaration sheet for flight programs.
