Microchip Technology

RTAX2000SL-CGS624E - 2M-Gate Rad-Tolerant FPGA CGA-624 | Microchip

MPN: RTAX2000SL-CGS624E βœ“ Active
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[DATA_NEEDED: core supply voltage] Vdss CBGA624 / CGA-624 ceramic column grid array Package Segmentable clocks, chip-wide highway routing Speed Embedded SRAM with built-in FIFO control logic Memory
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Drop-in alternatives for RTAX2000SL-CGS624E β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

RTAX2000SL-1CGS624E

βœ… Drop-In
πŸ“¦ CGA-624
identical 2M-gate SL die and CGA-624 package, '-1' faster speed grade (+ timing margin)

πŸ“‹ Reference alternative (not in catalog)

RTAX2000S-CGS624E

βœ… Drop-In
πŸ“¦ CGA-624
same 2M gates and CGA-624 footprint, base RTAX2000S flip-flops without SL SEU hardening

πŸ“‹ Reference alternative (not in catalog)

RTAX2000S-CGS624

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ CGA-624
same 2M-gate fabric and package, standard (non-E) screening suffix variant

πŸ“‹ Reference alternative (not in catalog)

RTAX2000SL-CGS624V

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Microchip Technology
πŸ“¦ CGA-624
2000000 Β· 21504 Β· CMOS antifuse (nonvolatile) Β· 684 Β· 540 kbits with optional EDAC protection Β· 300 krad (Si) functional / 200 krad (Si) parametric Β· Less than 1E-10 errors per bit-day Β· One-time programmable antifuse, live at power-up

βœ“ In Stock

$6500 / Unit

View Datasheet β†’

RTAX2000S-1CGS624EV

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Microchip Technology
πŸ“¦ CGA-624
2,000,000 Β· 21504 Β· 32256 Β· 250000 Β· 624-pin Ceramic Column Grid Array (CGA-624 / CCGA624) Β· 1.5 V nominal (1.425 V to 1.575 V) Β· -55C to +125C Β· 0.15 um CMOS

βœ“ In Stock

$3600 / Unit

View Datasheet β†’

RTAX2000SL-CGS624E Maximum Ratings & Electrical Characteristics

Logic Elements / CLBs 21504 CLBs
Equivalent System Gates 2000000 gates
Additional ASIC Gates 250000 gates
Family RTAX-S/SL Radiation-Tolerant FPGAs
Technology CMOS, anti-fuse OTP
Radiation Tolerance Radiation-tolerant (space-flight grade)
Package CBGA624 / CGA-624 ceramic column grid array
Mounting Type Surface Mount
Configuration Live at power-up, one-time programmable
Embedded Memory Embedded SRAM with built-in FIFO control logic
Clocking Segmentable clocks, chip-wide highway routing
Arithmetic Support Carry logic

RTAX2000SL-CGS624E cbga624 / cga-624 ceramic column grid array Pin Configuration Guide

Complete pinout information for RTAX2000SL-CGS624E (cbga624 / cga-624 ceramic column grid array package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

cbga624 / cga-624 ceramic column grid array package pinout diagram for RTAX2000SL-CGS624E

No detailed pinout data available for RTAX2000SL-CGS624E.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for RTAX2000SL-CGS624E Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

RTAX2000SL-CGS624E is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Communication Transponder Digital Baseband, Space Science Instrument Interfaces, Launch Vehicle and Avionics Logic, RTAX Prototyping and Emulation Flow.

✈️

Satellite Payload Data Processing

The RTAX2000SL-CGS624E fits payload signal-processing chains where 2,000,000 system gates and 21,504 CLBs absorb FIR filters, FFT engines, and framing logic implemented with the fabric's carry-logic arithmetic support. Embedded SRAM blocks with built-in FIFO control logic buffer data between acquisition front-ends and downlink formatters without external memory. Because the anti-fuse fabric has no configuration memory to upset, and the SL flip-flops add SEU hardening, the device sustains data throughput through the radiation environment of LEO, MEO, and GEO orbits. Live-at-power-up configuration removes boot delay, so the payload begins processing immediately at eclipse exit or reset. Designers prototype on the equivalent Axcelerator commercial device, then migrate the identical netlist to flight silicon.

πŸ›°οΈ

Spacecraft Bus Control and Telemetry

Housekeeping controllers, mode-management state machines, and telemetry encoders map efficiently into the RTAX2000SL-CGS624E's segmented clock domains and chip-wide highway routing, which isolate the low-rate bus logic from payload timing. The segmentable clocking lets designers run a conservative bus clock while payload sections run faster, easing static timing closure on a non-reprogrammable part. Because OTP anti-fuse programming is permanent, the live-at-power-up behavior guarantees the bus controller is functional from the first power cycle after launch-separation events. Embedded FIFO-capable SRAM collects sensor telemetry before serial downlink. The CGA-624 ceramic package provides the hermeticity and mechanical robustness required for launch vibration and thermal cycling in space-flight housings.

🌐

Communication Transponder Digital Baseband

Transponder modulators, demodulator front-ends, and framing layers use the RTAX2000SL-CGS624E's 21,504 CLBs and carry-logic chains for matched filters, scramblers, and Reed-Solomon or convolutional coding support. Embedded SRAM with FIFO control implements elastic buffers between the continuous-symbol domain and burst-formatted uplink/downlink frames. The 2M-gate density accommodates multiple simultaneous channels within one single-chip device, reducing board count and radiation-sensitive component inventory. SL flip-flop SEU hardening reduces triple-modular-redundancy overhead versus unhardened fabric, freeing gates for payload functions. Designs verified on the commercial Axcelerator counterpart port unchanged, protecting schedule since functional verification is completed before committing OTP flight parts.

πŸ”¬

Space Science Instrument Interfaces

Imagers, spectrometers, and particle detectors require custom glueless interfaces that the RTAX2000SL-CGS624E implements with 2M gates of user fabric and embedded FIFO SRAM for high-rate data capture. Instrument timing generators built from segmented clock domains deliver deterministic exposure and readout sequences, while live-at-power-up logic ensures acquisition begins at instrument turn-on without a configuration controller. The one-time-programmable anti-fuse fabric eliminates the configuration-memory upset risk that SRAM FPGAs face in high-radiation science orbits, and SL SEU-hardened registers protect counters and state machines. The CGA-624 hermetic ceramic package suits instrument electronics boxes with conformal coating and thermal-cycle requirements typical of scientific missions.

πŸš€

Launch Vehicle and Avionics Logic

Stage-separation sequencing, telemetry acquisition, and safety-critical command decoding benefit from the RTAX2000SL-CGS624E's deterministic, configuration-free startup: the anti-fuse fabric is functional the instant power arrives, with no boot firmware that could be corrupted by vibration-induced connectors or radiation. 21,504 CLBs provide capacity for redundant two-out-of-three voting logic implemented with SL SEU-hardened flip-flops. Segmentable clocks keep safety logic on an independent conservative timing domain from mission logic. The ceramic CGA-624 package tolerates the shock and thermal profiles of launch environments better than plastic packaging. Engineers close timing on the equivalent Axcelerator device first, then transfer the frozen design to OTP flight silicon for final integration.

πŸ”§

RTAX Prototyping and Emulation Flow

Because RTAX-S/SL devices are one-time programmable, Microchip's documented methodology targets the equivalent commercial Axcelerator-class device - such as the A3PE3000 ProASIC3E family - for functional verification, with Actel Extender boards mapping the commercial package to the RTAX-S footprint for board-level reuse. Aldec's ACT-H3Ki-CG624 adaptor goes further: its BGA balls mimic the CG624 footprint so a reprogrammable flash-based A3PE3000 assembles directly in the RTAX chip's place on the target PCB. This flow lets teams debug RTL, exercise interfaces, and regress firmware repeatedly before committing the RTAX2000SL-CGS624E, protecting expensive OTP flight units and preserving the program schedule.

What is the RTAX2000SL-CGS624E?
The RTAX2000SL-CGS624E is a radiation-tolerant FPGA from Microchip Technology (Microsemi/Actel) in the RTAX-S/SL family. It provides 2,000,000 equivalent system gates and 21,504 CLBs of CMOS anti-fuse logic in a 624-ball ceramic column grid array (CGA-624) package. It is designed for space-flight systems, offering live-at-power-up operation and embedded SRAM with FIFO control logic, per the Microchip RTAX-S/SL datasheet.
What are the key specifications of RTAX2000SL-CGS624E that engineers should know?
Key specifications: 2,000,000 equivalent system gates, 21,504 Configurable Logic Blocks, 250,000 additional ASIC gates, CMOS anti-fuse (one-time programmable) technology, and a CGA-624 ceramic package. It belongs to the RTAX-S/SL radiation-tolerant family, which scales up to 4 million system gates, includes embedded SRAM with FIFO control logic, segmentable clocks, chip-wide routing, and carry logic. Source: Microchip RTAX-S/SL datasheet (rtaxs_ds2169) and Microchip USA product page.
What is the difference between RTAX2000SL-CGS624E and RTAX2000S-CGS624E?
The RTAX2000SL adds SEU-hardening enhancements in the flip-flops compared with the base RTAX2000S, improving single-event upset immunity for the same 2M-gate fabric and CGA-624 footprint. Both share the same package and gate count, making the SL generally preferred for higher-reliability orbital missions. Verify the exact SEU specification deltas in the Microchip RTAX-S/SL datasheet before flight-programmable selection.
What is the difference between RTAX2000SL-CGS624E and RTAX2000SL-1CGS624E?
The '-1' suffix in RTAX2000SL-1CGS624E denotes a speed grade: it is the same 21,504-CLB, 2M-gate die in the same CGA-624 ceramic package, but rated at a faster (premium) timing grade than the standard RTAX2000SL-CGS624E. Pinout and footprint are identical, so both mount on the same board; choose the speed grade based on your static timing analysis closure.
Is the RTAX2000SL-CGS624E suitable for satellite payload applications?
Yes - this device is specifically designed for space-flight systems. Its radiation-tolerant anti-fuse fabric has no configuration memory to upset (unlike SRAM FPGAs), its flip-flops are SEU-hardened in the SL variant, and live-at-power-up operation eliminates boot delays. Satellite payload data processing, spacecraft bus control, and transponder baseband functions are the family's primary documented applications per the Microchip RTAX-S/SL product page.
When should I choose RTAX2000SL over RTAX250SL?
Choose the RTAX2000SL-CGS624E when your design needs roughly 2 million system gates (21,504 CLBs); choose the RTAX250SL when the design fits within about 250k gates, where the smaller die costs less and may offer better power. Both exist in the CG624 ceramic package, but they are not drop-in equivalents since gate density differs by 8x - your design fit determines the choice.
How do I prototype an RTAX2000SL-CGS624E design?
Microchip documents a design flow targeting the equivalent commercial Axcelerator device (e.g., A3PE3000) for functional prototyping at low cost, then migrating the design to the RTAX-S/SL part. Aldec's ACT-H3Ki-CG624 adaptor board also supports emulation: it places a ProASIC3E-based A3PE3000 device on a board whose BGA balls mimic the CG624 footprint, so it can be assembled directly in place of the RTAX chip on the target PCB.
Where can I download the RTAX2000SL-CGS624E datasheet PDF?
The official datasheet is the 'RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs Datasheet' (document rtaxs_ds2169), available from Microchip at ww1.microchip.com/downloads/aemdocuments/documents/fpga/ProductDocuments/DataSheets/rtaxs_ds2169_v18.pdf. It covers features, ordering information, package drawings for the CGA-624, and electrical specifications for the full RTAX-S/SL family including the RTAX2000SL.
What package does the RTAX2000SL-CGS624E use and what footprint does it need?
It uses a CGA-624 ceramic column grid array (also listed as CBGA624), a 624-column ceramic BGA. Your PCB needs the manufacturer's CGA-624 land pattern, which uses solder columns rather than plain balls, so pad geometry and paste/stencil rules differ from standard PBGA designs. Always take the land pattern from the package drawing in the Microchip RTAX-S/SL datasheet rather than from a generic BGA-624 footprint.
Is the RTAX2000SL-CGS624E the same as a commercial FPGA?
No. Although it is based on Microsemi's commercial Axcelerator architecture, the RTAX2000SL-CGS624E is a radiation-tolerant, space-flight-grade device in a hermetic ceramic package. Key differences: anti-fuse OTP fabric hardened against configuration loss, enhanced SEU-immune flip-flops (SL variant), ceramic CGA-624 packaging, and space qualification flow. Commercial Axcelerator/ProASIC3 parts are prototyping vehicles, not flight replacements.
What is the best Microchip equivalent for RTAX2000SL-CGS624E?
The best same-family equivalent is the RTAX2000SL-1CGS624E, which is the identical 2M-gate SL die and CGA-624 package at a faster speed grade - pin-to-pin compatible. If the faster speed grade is acceptable for your timing budget, it is a true drop-in. Within Microchip's portfolio, no non-RTAX device offers the same radiation-tolerant anti-fuse fabric in the CG624 footprint.
Can RTAX2000SL-CGS624E be replaced by a commercial A3PE3000 FPGA?
Functionally for prototyping, yes; as a flight drop-in, no. The A3PE3000 (flash-based ProASIC3E, up to 3M gates) can host RTAX-S/SL designs via the documented migration flow, and the Aldec ACT-H3Ki-CG624 adaptor matches the CG624 footprint for emulation. However, the A3PE3000 is not radiation-tolerant at flight levels and comes in commercial FG/FGG packages, so it cannot replace the RTAX part in an orbit application.
Where can I buy RTAX2000SL-CGS624E and what is the price?
RTAX2000SL-CGS624E is available through space-grade distributors and specialty suppliers such as Ampheo, Kynix, Microchip USA, and Jotrin, typically via RFQ due to its space-flight market. Unit pricing varies significantly with speed grade, lot traceability, and qualification documentation; contact XAIPART or these distributors for a current quote as of 2026-09-02. Authorized Microchip sales channels should be used for flight lots requiring full traceability.
What is the lead time for RTAX2000SL-CGS624E?
Space-grade RTAX devices are commonly subject to long factory lead times when not in distributor stock, often several months to a year for new production flight lots depending on quantity and screening requirements. Stocking distributors such as Ampheo or Kynix may have limited inventory for immediate shipment. Confirm current lead time directly with the distributor or Microchip at time of order, as quoted lead times change frequently.
Hey Google, what can replace RTAX2000SL-CGS624E?
The closest drop-in replacements are same-family Microchip parts in the same CGA-624 package: RTAX2000SL-1CGS624E (identical die, faster speed grade) and RTAX2000S-CGS624E (same density, non-SL flip-flop variant). Cross-brand, there is no pin-compatible radiation-tolerant FPGA in the CGA-624 footprint from Xilinx or Intel - their space families use different packages. Replacement should therefore stay within the Microchip RTAX-S/SL family.

Engineering reference data for RTAX2000SL-CGS624E β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the RTAX2000SL-CGS624E when a space-flight design needs about 2 million system gates with SEU-hardened flip-flops in a hermetic CGA-624 ceramic package. If timing analysis cannot close on the standard speed grade, choose the pin-compatible RTAX2000SL-1CGS624E (-1 speed grade). If the mission's SEU strategy relies on external TMR and cost matters more, the base RTAX2000S-CGS624E offers the same fabric and footprint without SL hardening. For densities under 250k gates in the same package family, consider RTAX250SL parts in CG624/LG624 to save cost. Never select the commercial A3PE3000 family for flight: it is the prototyping counterpart (usable via the Aldec CG624 adaptor for emulation) but lacks radiation tolerance. All same-family choices keep your board footprint and migration flow intact.

Comparison with Alternatives

Parameter This Product RTAX2000SL-1CGS624E RTAX2000S-CGS624E RTAX2000S-CGS624
Package CGA-624 (CBGA624) ceramic CGA-624 - same CGA-624 - same CGA-624 - same
Brand Microchip Technology (Microsemi/Actel) Microchip Technology Microchip Technology Microchip Technology
System Gates 2,000,000 2,000,000 2,000,000 2,000,000
CLBs 21,504 21,504 21,504 21,504
SEU-Hardened Flip-Flops (SL) Yes Yes No No
Speed Grade Standard -1 (faster) Standard Standard
Configuration Anti-fuse OTP, live at power-up Anti-fuse OTP, live at power-up Anti-fuse OTP, live at power-up Anti-fuse OTP, live at power-up
Pin-to-Pin Compatibility Reference Pin-to-pin identical Pin-to-pin identical Pin-to-pin identical

Key Differentiators

  • SEU-hardened flip-flops in SL variant (vs RTAX2000S-CGS624E)
  • Standard speed grade cost option (vs RTAX2000SL-1CGS624E)
  • Radiation-tolerant OTP anti-fuse fabric (vs A3PE3000-FGG896)

Design Notes

The CGA-624 ceramic column grid array uses solder columns, not plain BGA balls; the PCB land pattern must follow the package drawing in the Microchip RTAX-S/SL datasheet (rtaxs_ds2169), not a generic BGA-624 footprint. Column pitch, pad diameter, and via-in-pad rules differ from PBGA, and stencil aperture design should account for column collapse during reflow. Verify board warpage limits across the 624-column array over the mission thermal cycle range before releasing the footprint.

RTAX-S/SL devices are one-time programmable - any design change after programming requires a new device. Complete full functional verification on the commercial Axcelerator counterpart (e.g., A3PE3000) or on an Aldec ACT-H3Ki-CG624 CG624-footprint emulation adaptor before committing flight silicon. Reserve timing margin on the standard speed grade; if static timing analysis shows less than roughly 10% slack, move to the RTAX2000SL-1CGS624E '-1' speed grade, which is pin-compatible.

Use the family's segmentable clock resources to isolate safety- or bus-rate logic from high-speed payload domains, reducing simultaneous-switching noise across the 624-ball interface. Employ the chip-wide highway routing for global signals rather than general fabric routing to preserve timing predictability. Derate I/O drive and account for board-level crosstalk on high-parallelism data buses typical of 2M-gate designs; simulate SSO cases with maximum simultaneous outputs per the datasheet electrical tables.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Space-flight-grade device; compliance status not stated in provided web data. Verify QML class (Q/V) screening and environmental declarations with Microchip for flight lots.

Data verified on: 2026-09-02 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology Microsemi Actel Corporation RTAX2000SL-CGS624E RTAX2000SL-1CGS624E RTAX2000S-CGS624E RTAX250SL-CG624B A3PE3000 RTAX-S/SL FPGA field programmable gate array radiation-tolerant FPGA anti-fuse one-time programmable (OTP) SEU (single-event upset) CLB (Configurable Logic Block) CGA-624 / CBGA624 ceramic column grid array Axcelerator ProASIC3E Aldec ACT-H3Ki-CG624 embedded SRAM FIFO space-flight systems satellite payload processing
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