RTAX1000S-LG624V - 1M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX1000S-LG624V β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 2 | $3050 | $6,100.00 |
| 5 | $2900 | $14,500.00 |
| 10 | $2750 | $27,500.00 |
| 25 | $2600 | $65,000.00 |
Drop-in alternatives for RTAX1000S-LG624V β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX1000S-1LG624V
β Drop-Inπ Reference alternative (not in catalog)
RTAX1000SL-LG624V
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
RTAX2000S-1LG624V
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Contact for price
View Datasheet βRTAX2000SL-1LG624V
β Drop-Inβ In Stock
$9600 / Unit
View Datasheet βRTAX1000S-1LG624PROTO
β Drop-Inπ Reference alternative (not in catalog)
RTAX1000S-LG624V Maximum Ratings & Electrical Characteristics
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 1,000,000 |
| Logic Cells | 18144 |
| Configurable Logic Blocks (CLBs) | 12096 |
| Technology | Digital CMOS, antifuse-based |
| Core Supply Voltage | 1.5 V (nominal) |
| Configuration Type | One-Time Programmable (antifuse), live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Package | CG624 (624-pin ceramic column grid array, LG624) |
| Operating Temperature | -55C to +125C |
| Application Domain | Space-flight systems, radiation-tolerant |
| Maximum Family Density | 4,000,000 equivalent system gates (family) |
| Mounting Type | Surface Mount |
RTAX1000S-LG624V cg624 (624-pin ceramic column grid array, lg624) Pin Configuration Guide
Complete pinout information for RTAX1000S-LG624V (cg624 (624-pin ceramic column grid array, lg624) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX1000S-LG624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX1000S-LG624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Avionics and Bus Control, Telemetry and Telecommand Interfaces, Radiation-Exposed Instrumentation, Launch Vehicle and Reusable Spacecraft Electronics, Deep-Space Mission Computing.
Satellite Payload Data Processing
The RTAX1000S-LG624V fits satellite payload processing because its 1,000,000 gates and 18,144 logic cells absorb high-throughput framing, compression, and channel-encoding functions while its antifuse configuration fabric eliminates configuration upsets in orbit - no scrubbing controller or external PROM is needed. Designers implement CCSDS telemetry encoders, FIFO-based packet buffering using the embedded SRAM with built-in FIFO control, and chip-wide routing for wide data paths across the 624-pin ceramic package, which supplies ample user I/O for LVDS-class payload buses. The trade-off versus an SRAM FPGA is one-time programmability: functional fixes require a new flight unit, so payloads are prototyped on reprogrammable adaptors (e.g., Aldec RTAX-S adaptors on ProASIC3E) before committing antifuse flight hardware.
Recommended
Spacecraft Avionics and Bus Control
In spacecraft avionics, the RTAX1000S-LG624V serves as the bridge between the onboard computer and telemetry, telecommand, and sensor interfaces. Its live-at-power-up behavior means command decoders and health-monitoring logic are functional immediately at power application - critical during launch-sequence events where no configuration loader can be relied upon. The 1.5V nominal CMOS core keeps static power low for power-constrained smallsat and deep-space buses, and the hermetic CG624 ceramic package withstands the thermal cycling of -55C to +125C qualification. Segmentable clock resources let designers implement independent clock domains for the command processor and payload interfaces on a single chip, replacing multiple glue-logic devices and improving single-chip reliability.
Recommended
Telemetry and Telecommand Interfaces
For telemetry/telecommand (TM/TC) chains, the RTAX1000S-LG624V implements convolutional encoders, Reed-Solomon blocks, and serial interface bridges using its 1,000,000-gate fabric and embedded SRAM FIFOs. Radiation-tolerant antifuse logic guarantees that the TM/TC path, which must remain alive through single-event upsets, does not lose its configuration mid-mission - a known failure mode of SRAM FPGAs without scrubbing. The 624-pin LG624 package offers the pin count needed for redundant parallel interfaces, cross-strapping, and majority-voted signal implementation. Designers typically instantiate triple-module-redundant registers on critical state machines; the fabric size comfortably accommodates TMR at this density while leaving margin for the telemetry formatter itself.
Recommended
Radiation-Exposed Instrumentation
Scientific instruments on LEO, MEO, and interplanetary missions use the RTAX1000S-LG624V for detector readout sequencing, ADC interface timing, and on-instrument data reduction. The CMOS antifuse fabric's immunity to configuration upset means the acquisition chain continues operating through radiation events that would corrupt SRAM-based devices, while total-dose tolerance supports multi-year mission profiles. Embedded SRAM buffers detector data streams between acquisition bursts, and chip-wide highway routing supports wide parallel buses from multi-channel front ends into the 624-pin package's generous I/O ring. The one-time-programmable model suits fixed-function instrument electronics whose behavior is frozen before launch after exhaustive ground calibration.
Recommended
Launch Vehicle and Reusable Spacecraft Electronics
Launch vehicles and reusable spacecraft employ the RTAX1000S-LG624V in sequencing, health-monitoring, and separation-event logic where deterministic live-at-power-up startup is mandatory. Unlike SRAM FPGAs that must load configuration after power is applied, the antifuse device is functional the instant supply rails reach threshold, meeting flight-critical timing assumptions. The -55C to +125C ceramic package rating and hermetic construction suit stage-separation environments with severe vibration and thermal shock. Designs exploit the 12,096 CLBs to implement safety-critical interlocks with TMR, and the one-time-programmable nature guarantees that flight software updates cannot inadvertently alter the hardened interlock fabric after integration.
Recommended
Deep-Space Mission Computing
Deep-space probes adopt the RTAX1000S-LG624V where power is scarce and repair is impossible. The 1.5V CMOS core and low static power of the RTAX-S fabric reduce the housekeeping power budget over decade-long missions, and the antifuse configuration survives cumulative radiation doses that would erode SRAM configuration integrity without scrubbing overhead. The family's embedded SRAM with FIFO control supports autonomous science-data buffering during communication blackouts, while chip-wide routing and segmentable clocks implement the fault-tolerant watch-dog architectures typical of deep-space avionics. At 1,000,000 gates, the device balances capability against the power and mass constraints of probe-class platforms.
Recommended
Recommended Products Summary
Engineering reference data for RTAX1000S-LG624V β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX1000S-1LG624V | RTAX1000SL-LG624V | RTAX2000S-1LG624V | RTAX2000SL-1LG624V |
|---|---|---|---|---|---|
| Package | CG624 (LG624) ceramic column grid array | CG624 (LG624) - same | CG624 (LG624) - same | CG624 (LG624) - same | CG624 (LG624) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 2,000,000 | 2,000,000 |
| Logic Cells | 18144 | 18144 | 18144 | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | Standard | -1 (fastest) | Standard (SL low-power) | -1 | -1 (SL low-power) |
| Configuration | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up |
| Core Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Low-Power (SL) Processing | No | No | Yes | No | Yes |
Key Differentiators
- Standard speed grade for cost-optimized flight lots (vs RTAX1000S-1LG624V)
- Full-speed silicon vs low-power SL processing (vs RTAX1000SL-LG624V)
- Half the power budget of a capacity-upgrade part (vs RTAX2000S-1LG624V)
Design Notes
The RTAX1000S is one-time programmable: once antifuses are blown, the configuration is permanent. Never program flight units directly from an unverified design. Prototype on reprogrammable silicon first - Microchip and Aldec jointly offer RTAX-S prototyping adaptors that emulate RTAX devices on flash-based ProASIC3E technology, allowing iterative functional verification. Only after timing closure and board-level validation should the identical netlist be ported to the RTAX1000S with the LG624 timing model in Libero.
The RTAX1000S core operates from a 1.5V nominal supply (per Microchip USA data for the RTAX1000S family in CG624). Verify actual power in Libero's power estimator with your utilization and toggle rates, and ensure the rail can supply inrush during programming. For power-constrained missions where speed is not the binding constraint, the pin-compatible RTAX1000SL-LG624V uses low-power SL processing to reduce static consumption without a footprint change.
The LG624 is a 624-column ceramic column grid array; land-pattern design must follow the manufacturer's CG624 mechanical drawing and account for solder-column coplanarity. Provide a symmetrical thermal relief under the package and avoid mixing reflow profiles intended for plastic BGAs. Decouple each supply pin pair with local ceramics; segment clock domains using the family's segmentable clock resources rather than routing high-speed clocks across the chip-wide highway.
In TMR-heavy space designs, the 1,000,000-gate (18,144 logic cell) capacity of the RTAX1000S can be consumed faster than raw gate count suggests - triple-module redundancy, voting, and scrub-free design techniques can double effective logic usage. If your TMR implementation does not close at this density, the pin-compatible RTAX2000S-1LG624V provides the same CG624 footprint with approximately double the capacity, allowing a PCB redesign-free migration.
Compliance Information
Space-grade ceramic-column packages are commonly exempt from RoHS lead-free requirements; no explicit compliance statement was found in the provided data. Obtain Microchip compliance certificates for flight programs.