RTAX2000D-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
Teilenummer: RTAX2000D-1CQ352V ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4850 | $4.850,00 |
| 10 | $4650 | $46.500,00 |
| 100 | $4400 | $440.000,00 |
| 500 | $4150 | $2.075.000,00 |
| 1.000 | $3950 | $3.950.000,00 |
RTAX2000D-1CQ352V Übersicht
A radiation-tolerant FPGA is a field-programmable gate array qualified for spaceflight environments, where total ionizing dose (TID) and latch-up immunity determine survivability. Within the power-management hierarchy of a spacecraft avionics system, this FPGA sits between the onboard computer and mission-specific interface electronics, implementing glue logic, bus controllers, and signal processing. The RTAX-D family belongs to the broader RTAX-S/SL and RTAX-DSP radiation-tolerant FPGA portfolio from Microchip (formerly Actel and Microsemi).
Key features include highly reliable nonvolatile antifuse technology that is live at power-up with no configuration device required, up to 120 DSP mathblocks supporting 18-bit x 18-bit multiply-accumulate operations at 125 MHz, and up to 540 kbits of embedded SRAM memory with optional EDAC protection. The D suffix denotes enhanced screening: RTAX-D and RTAX-DL devices share the same silicon as RTAX-S/SL but are distinguished by tighter ICCA current limits at 125 degrees C final electrical test (Condition A applies to RTAX2000D/DL).
Architecturally, the device uses a 0.15-micron CMOS process with antifuse interconnect, which is inherently immune to configuration upsets because programming is permanent. Total dose tolerance is 300 krad (Si) functional and 200 krad (Si) per the family datasheet, supporting LEO, MEO, and GEO missions.
Typical applications include satellite payload data processing, spacecraft bus controllers, telemetry and telecommand interfaces, and rad-hard signal processing chains needing on-chip DSP mathblocks.
Design consideration: because antifuse programming is one-time, prototype using footprint-compatible adaptor boards (such as the Aldec ACT-H3Ki-CQ352) and migrate via the EDIF netlist and pinout conversion flow described in the manufacturer datasheet.
This page synthesizes distributor availability, screening-variant cross-references, and design guidance not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für RTAX2000D-1CQ352V – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit RTAX2000D-1CQ352V (gleiche Bauform und Footprint) – abweichend in Package, Technology, Equivalent System Gates, Family, Configuration.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
RTAX2000S-1CQ352V
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX2000DL-1CQ352V
✅ Drop-In✓ Auf Lager
$2950 / Stück
Datenblatt ansehen →RTAX2000D-1CQ352E
✅ Drop-In✓ Auf Lager
$3650 / Stück
Datenblatt ansehen →RTAX4000D-CQ352V
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX1000SL-CQ352V
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX2000D-1CQ352V Grenzwerte & elektrische Eigenschaften
| Equivalent Gates | 2,000,000 |
| Logic Cells | 29,568 |
| CLBs | 19,712 |
| Core Supply Voltage | 1.425 V to 1.575 V (nominal 1.5 V) |
| DSP Mathblocks | Up to 120 |
| DSP MAC Performance | 125 MHz, 18-bit x 18-bit multiply-accumulate |
| Embedded Memory | Up to 540 kbits with optional EDAC protection |
| Technology | Digital CMOS, antifuse (nonvolatile) |
| Total Ionizing Dose (Functional) | 300 krad (Si) |
| Total Ionizing Dose | 200 krad (Si) |
| Configuration | Live at power-up, single-chip, no external configuration device |
| Speed Grade | -1 |
| Gehäuse | CQFP-352 (CQ352), ceramic |
| Montageart | Surface Mount |
| Screening | RTAX-D (Condition A, tighter ICCA limits at 125C final electrical test) |
RTAX2000D-1CQ352V cqfp-352 (cq352), ceramic Pinbelegungsleitfaden
Pinbelegung für RTAX2000D-1CQ352V (cqfp-352 (cq352), ceramic-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für RTAX2000D-1CQ352V.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
RTAX2000D-1CQ352V ist geeignet für 6 Anwendungs: Satellite Payload Data Processing, Spacecraft Bus Controller Logic, Radiation-Tolerant Signal Processing Acceleration, Telemetry and Telecommand Interfaces, LEO/GEO Mission Avionics Glue Logic, Prototyping with Footprint-Compatible Adaptors.
Satellite Payload Data Processing
The RTAX2000D-1CQ352V fits payload data-processing chains because its up to 120 DSP mathblocks deliver 18-bit x 18-bit multiply-accumulate at 125 MHz, enough for FIR filtering, FFTs, and CRC/EDAC pipelines at payload data rates, while 540 kbits of embedded memory with optional EDAC protection buffers downlink frames. Its antifuse fabric is live at power-up with no configuration flash, removing a radiation-sensitive single point of failure from the payload board. Deployed between the ADC/Front-end and the telemetry formatter, the device adds no configuration-upset reconfiguration overhead, though designers must verify 300 krad (Si) functional TID against the mission orbit dose. The Condition A ICCA screening at 125C final electrical test provides extra margin against latent defects during long missions.
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Spacecraft Bus Controller Logic
As a bus controller, the RTAX2000D-1CQ352V implements MIL-STD-1553-style interfaces, telemetry/telecommand decoders, and mode-control state machines using its 19,712 CLBs and 29,568 logic cells. The antifuse technology is nonvolatile and live at power-up, so bus logic is available immediately after switch-on without a boot sequence - a critical property for spacecraft autonomy and safe-mode recovery. Core operation from a 1.425V to 1.575V rail integrates cleanly with standard 1.5V space-grade point-of-load regulators. The D-suffix Condition A screening (tighter ICCA limits at 125C) supports the strict quality flows demanded for bus avionics. Designers should budget the 1.5V rail current with margin and verify I/O standards against the datasheet CQ352 pinout tables before finalizing the board.
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Radiation-Tolerant Signal Processing Acceleration
For onboard signal processing that would otherwise require a radiation-hardened DSP, the RTAX2000D-1CQ352V offers up to 120 mathblocks with 125 MHz 18-bit x 18-bit MAC, yielding roughly 30 GMAC/s of parallel multiply-accumulate capability when fully exploited. Unlike SRAM FPGAs, the antifuse fabric cannot experience configuration upsets, so the array does not require scrubbing hardware, and the 540 kbit embedded memory with optional EDAC protects data storage. Typical roles include channelized filtering, correlation, and adaptive beamforming front-ends feeding a downlink. The trade-off versus an SRAM FPGA is fixed one-time programming and no post-launch reconfiguration, so the design must be flight-frozen and validated on a footprint-compatible adaptor (e.g., Aldec ACT-H3Ki-CQ352) before committing flight silicon.
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Telemetry and Telecommand Interfaces
The RTAX2000D-1CQ352V serves as the interface fabric for TM/TC chains, formatting CCSDS-style frames, decoding command words, and gluing UART/SPI/LVDS-style links between the OBC and transponders. With 2 million equivalent gates, it holds the framing logic, FIFOs built from the 540 kbit embedded memory, and CRC/EDAC engines concurrently. Live-at-power-up antifuse configuration ensures the command path is functional from the first power cycle, which matters for launch-vehicle and early-orbit operations. The CQ352 ceramic package supports the solder-column attachment flow described in the family datasheet, easing integration onto standard high-reliability boards. Engineers should route command-critical signals per the datasheet pin tables and confirm I/O bank voltage compatibility with the transponder front-end.
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LEO/GEO Mission Avionics Glue Logic
General avionics consolidation - address decoding, bus bridging, arbitration, and monitoring - fits comfortably within the RTAX2000D-1CQ352V's 19,712 CLBs, allowing a single radiation-tolerant FPGA to replace dozens of discrete rad-hard SSI/MSI parts. The 300 krad (Si) functional total-dose rating covers typical LEO missions of many years and moderate GEO applications; mission planners should compare the orbit's shielded dose against the 300 krad functional and 200 krad limits from the family datasheet. The narrow 1.425V to 1.575V core window simplifies the power tree to a single accurate 1.5V rail. Consolidation also reduces board area, component count, and assembly screening cost, which are dominant drivers in spaceflight electronics budgets, while the Condition A ICCA screening adds lot-level quality assurance.
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Prototyping with Footprint-Compatible Adaptors
Because antifuse FPGAs are one-time programmable, the manufacturer defines a prototyping methodology using a footprint-compatible adaptor board and an EDIF netlist and pinout converter for easy migration to flight silicon. The Aldec ACT-H3Ki-CQ352 adaptor, for example, matches the RTAX CQ352 power supply and footprint, can be powered via the CQ352 leads or an onboard power connector, and is programmed through an onboard JTAG connector. Teams develop and iterate the design on the adaptor, then convert the netlist and pinout for RTAX2000D-1CQ352V flight devices. This workflow catches timing and pinout errors before irreversible programming, and the datasheet documents the conversion flow. Budget schedule time for final electrical test and Condition A ICCA screening verification when ordering flight lots.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für RTAX2000D-1CQ352V – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | RTAX2000S-1CQ352V | RTAX2000DL-1CQ352V | RTAX2000D-1CQ352E | RTAX4000D-CQ352V | RTAX1000SL-CQ352V |
|---|---|---|---|---|---|---|
| Package | CQFP-352 (CQ352) | CQFP-352 (CQ352) - same | CQFP-352 (CQ352) - same | CQFP-352 (CQ352) - same | CQFP-352 (CQ352) - same | CQFP-352 (CQ352) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Screening / Suffix | D (Condition A ICCA at 125C), V suffix | Standard S screening, V suffix | DL (low-leakage L process, D-style screening) | D screening, E suffix | D (Condition A), V suffix | SL (low-power), V suffix |
| Radiation Tolerance (Functional TID) | 300 krad (Si) | 300 krad (Si) | 300 krad (Si) | 300 krad (Si) | 300 krad (Si) | 300 krad (Si) |
Wichtigste Unterscheidungsmerkmale
- Condition A enhanced screening (D suffix) (vs. RTAX2000S-1CQ352V)
- Lower static leakage option (vs. RTAX2000DL-1CQ352V)
- Optimal capacity for 2M-gate designs (vs. RTAX4000D-CQ352V)
- On-chip DSP mathblocks (vs. RTAX1000SL-CQ352V)
Designhinweise
Regulate the 1.5V core rail to stay within the 1.425V to 1.575V window across all load, temperature, and radiation conditions. Use a space-grade point-of-load regulator with +/-5% or better accuracy and verify with worst-case analysis including regulator drift and PCB IR drop. RTAX-D devices are distinguished by tighter ICCA current limits at 125C final electrical test, so measure supply current at temperature during board-level screening to catch anomalous units early.
Antifuse programming is irreversible. Never program a flight device directly from an unproven design. Follow the manufacturer prototyping methodology: validate on a footprint-compatible adaptor board (e.g., Aldec ACT-H3Ki-CQ352), run the EDIF netlist and pinout converter for migration, and only then commit the RTAX2000D-1CQ352V. Budget schedule margin for final electrical test and Condition A screening paperwork when ordering flight lots.
The CQ352 ceramic package typically mates to the PCB through solder-column attachment; per the family datasheet, only QA electrical and mechanical visual inspections are performed after solder column attachment, so plan board-level inspection accordingly. Place core-supply decoupling close to the power pins and follow the datasheet CQ352 pin tables exactly, since the EDIF pinout converter output must match the physical board netlist.
Estimated: verify junction temperature for your worst-case core current using the package thermal resistance from the manufacturer datasheet (value not reproduced here). Ceramic CQFP packages in space applications are usually bolted or wedged to a thermal sink; ensure the lid attachment path is specified and the die junction stays within the datasheet maximum under worst-case 125C test conditions.
Compliance-Informationen
Space-grade ceramic CQFP packages are typically exempt from RoHS lead-free requirements for high-reliability applications, but this must be confirmed from the official Microchip product page - not stated in the provided data.
