NXP Semiconductors

S912XDG128F2MALR - 16-bit S12X MCU 128KB Flash 80MHz | NXP

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112-LQFP (20 x 20 mm) Package 80 MHz Speed 128 KB (128K x 8) Memory
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Preis aktualisiert: 2026-10-19
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S912XDG128F2MALR Übersicht

The NXP S912XDG128F2MALR is a 16-bit HCS12X microcontroller built around the S12X CPU core, delivering 80 MHz of processing throughput with 128 KB of embedded Flash and integrated peripherals in a 112-pin LQFP package. It is qualified for automotive applications with an operating temperature range of -40 °C to +125 °C, and is designed to replace legacy HCS12 designs while preserving the HCS12 instruction set for upward compatibility.

What is an HCS12X microcontroller? An HCS12X MCU is an enhanced variant of the Freescale/NXP HCS12 family that adds an instruction queue, enhanced indexed addressing, interrupt stacking identical to the HCS12, and an extended instruction set. Positioned in the broader taxonomy, S12X sits between the simpler HCS12 and the higher-end S12XE family, eventually giving way to the S32K ARM Cortex-M automotive line. As a 16-bit MCU, it is widely used in body controllers, instrument clusters, and industrial node controllers where deterministic interrupt response and a stable, long-lived tool chain matter more than raw MHz.

Key features of the S912XDG128F2MALR include 128 KB of Flash, 8 KB of RAM (typical for the family), an integrated XGATE co-processor for peripheral offload, a 10-bit ADC, multiple SCI/SPI/I2C channels, and a CAN 2.0 module for in-vehicle networking. The 80 MHz core delivers roughly 2× the throughput of a stock HCS12 while keeping the same memory map, easing migration of existing HCS12 firmware.

The 112-pin LQFP (20 × 20 mm) package exposes ample I/O for body and chassis applications and provides good thermal performance for the on-chip analog and CAN peripherals. Compared with smaller QFP variants in the same family, the 112-pin device typically unlocks the full set of timer/PWM channels, the XGATE signals, and the extended address/data bus.

Typical applications include automotive body control modules, HVAC controllers, instrument clusters, door/seat/lighting modules, industrial CAN nodes, and LIN master/slave gateways. The combination of CAN 2.0, SCI/SPI and the XGATE engine is well-suited to multi-node vehicle networks. When designing with this device, allocate the XGATE vector table in non-paged Flash so that interrupts are serviced deterministically, and verify the 112-pin pinout against the family reference manual because smaller pin-count variants in the same family omit several peripheral pins.

Drop-in-Alternativen für S912XDG128F2MALR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit S912XDG128F2MALR (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Core, Core Processor, EEPROM.

NXP Semiconductors
Core Processor: HCS12
Vergleichen mit S912XDG128F2MALR →
NXP Semiconductors
Package: 80-QFP (14x14 mm), LQFP-80
Core Processor: HCS12 (16-bit CISC)
Vergleichen mit S912XDG128F2MALR →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40C to +125C
Core: HCS12
Vergleichen mit S912XDG128F2MALR →
NXP Semiconductors
Package: 144-pin LQFP (20x20 mm)
Operating Temperature: -40C to +85C
Core: HCS12X (16-bit CISC with XGATE co-processor)
Vergleichen mit S912XDG128F2MALR →
NXP Semiconductors
Package: 80-QFP (14x14 mm), Square, Gull Wing
Operating Temperature: -40C to +125C (TA)
Core Processor: HCS12X
Vergleichen mit S912XDG128F2MALR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
Core Processor: HCS12X (16-bit CISC)
Vergleichen mit S912XDG128F2MALR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Operating Temperature: -40C to +125C
Core: HCS12X (S12X), 16-bit
Vergleichen mit S912XDG128F2MALR →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12XDT512MAA

✅ Drop-In
NXP Semiconductors
📦 112-LQFP
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

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Preis auf Anfrage

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MC9S12XEQ384CAG

✅ Drop-In
NXP Semiconductors
📦 112-LQFP
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

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Preis auf Anfrage

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MC9S12XDT256CAG

✅ Drop-In
NXP Semiconductors
📦 112-LQFP
HCS12X (16-bit CISC with XGATE co-processor) · 256 KB Flash · 16 KB · 4 KB · 80 MHz · 2.35 V to 2.75 V · 4.5 V to 5.5 V · 119

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$17.4 / Stück

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MC9S12DG128MPV

✅ Drop-In
NXP Semiconductors
📦 112-LQFP
HCS12 · 16-Bit · CISC · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8

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Preis auf Anfrage

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MC9S12DG128VFUE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP
HCS12 (16-bit CISC) · 16-bit · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8 · CANbus, I2C, SCI, SPI

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Preis auf Anfrage

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MC9S12DT128MPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

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$36.5 / Stück

Datenblatt ansehen →

S912XET512BMAGR

✅ Drop-In
NXP Semiconductors
📦 112-LQFP
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

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$6.6 / Stück

Datenblatt ansehen →

S912XDG128F2MALR Grenzwerte & elektrische Eigenschaften

Core HCS12X (S12X)
CPU Architecture 16-bit
Maximum CPU Frequency 80 MHz
Program Flash 128 KB (128K x 8)
Gehäuse 112-LQFP (20 x 20 mm)
Betriebstemperatur -40 °C to +125 °C
Automotive Qualification Yes (AEC-Q100)
ADC 10-bit (per family)
CAN Modules 1 x CAN 2.0 (per family)
Serial Interfaces SCI / SPI / I2C (per family)
XGATE Co-processor Yes (per family)
Montageart Surface Mount
RoHS-Status Compliant (per NXP product page)
Instruction Set Compatibility Upward compatible with HCS12

S912XDG128F2MALR 112-lqfp (20 x 20 mm) Pinbelegungsleitfaden

Pinbelegung für S912XDG128F2MALR (112-lqfp (20 x 20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für S912XDG128F2MALR im 112-lqfp (20 x 20 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für S912XDG128F2MALR.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

S912XDG128F2MALR ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster Controller, Door/Seat/Lighting Module, Industrial CAN Node, LIN Master/Slave Gateway.

🚗

Automotive Body Control Module (BCM)

The S912XDG128F2MALR's 16-bit S12X core at 80 MHz, integrated CAN 2.0 module, and 128 KB of Flash make it a natural fit for automotive body control modules that supervise lighting, wipers, door locks, and accessory power. The XGATE co-processor offloads pulse-train and timer-driven tasks (PWM for LED dimming, debouncing for switch inputs) so the main CPU can run communication stacks and supervisory logic. AEC-Q100 qualification at -40 °C to +125 °C supports under-dash and behind-cluster mounting. Compared with smaller HCS12 parts, the 128 KB Flash provides headroom for CAN/UDS diagnostics, J1939 stacks, and bootloader code, while the 112-LQFP exposes enough I/O for multi-channel PWM and ADC inputs typical in BCM hardware. The S12X instruction set is upward compatible with HCS12 firmware, easing migration from older BCM designs.

🏭

HVAC Control Module

HVAC modules require reliable CAN networking, precise PWM for blower-speed control, and ADC channels for temperature and pressure sensing - exactly the peripheral set the S912XDG128F2MALR provides. The 10-bit ADC samples cabin and duct thermistors, while multiple PWM channels drive the blower motor, mode doors, and blend actuators. CAN 2.0 links the HVAC module to the BCM and engine ECU for shared sensor data and fault reporting. The 128 KB Flash accommodates PID control loops, calibration tables, and OBD-II diagnostics. AEC-Q100 qualification is essential for cabin or under-hood placement where ambient temperatures can approach 85 °C continuous. Compared with discrete 8-bit MCUs, the S12X core gives the HVAC module deterministic interrupt response from the XGATE co-processor, which is critical for closed-loop blower control without audible motor artefacts.

📺

Instrument Cluster Controller

Instrument clusters demand real-time control of stepper motors (gauges), LCD segments, indicator LEDs, and CAN bus traffic to the BCM and powertrain ECU. The S912XDG128F2MALR's XGATE co-processor handles stepper-drive sequencing in the background while the main S12X core processes CAN messages, runs the cluster diagnostic state machine, and manages warnings. The 112-LQFP exposes ample I/O for the multiple stepper channels and indicator LED drivers, while AEC-Q100 qualification supports behind-cluster thermal loads. The 128 KB Flash fits cluster firmware, gauge calibration curves, and CAN stack code. Compared with the smaller HCS12 DT family, the XGATE engine is essential for jitter-free gauge movement during high-CAN-bus traffic. NXP's S12XE upgrade path lets OEMs reuse the same firmware structure as cluster feature counts grow.

💡

Door/Seat/Lighting Module

Peripheral body modules - door controllers, seat controllers, lighting/ECM units - are typical S12X use cases. The S912XDG128F2MALR's CAN 2.0 module links each module to the BCM, while PWM channels drive LED arrays, mirror adjusters, and small motors. The 16-bit throughput comfortably handles LIN-to-CAN bridging, LED matrix sequencing, and debounced switch inputs. AEC-Q100 -40 °C to +125 °C operation handles door-cavity and trunk temperature excursions. 128 KB Flash holds CAN stack, bootloader, and feature firmware. The S12X instruction queue accelerates interrupt service routines compared with the older HCS12 family, which shortens the worst-case latency for door-lock motor control.

🖥️

Industrial CAN Node

Beyond automotive, the S912XDG128F2MALR serves industrial CAN nodes such as programmable logic controllers, sensor hubs, and motor inverters where 16-bit deterministic control and CANopen/DeviceNet stacks are required. The 80 MHz S12X core, XGATE engine, and 128 KB Flash support multi-protocol industrial stacks with comfortable headroom. AEC-Q100 qualification over-tolerances industrial ambient swings and improves long-term reliability. The 112-LQFP footprint gives designers generous I/O for industrial front ends. Compared with the older HCS12 family, XGATE offloads encoder/counter tasks so the main CPU is free to service the CAN stack and run application logic. PLC and motion-control vendors can reuse proven HCS12 tool chains on the S12X die with minimal effort.

🌐

LIN Master/Slave Gateway

The S912XDG128F2MALR is well suited as a CAN-to-LIN gateway in body and chassis networks, where it terminates the CAN 2.0 backbone and routes messages to LIN sub-buses for low-cost actuators (window lift, mirror, seat). The SCI/SPI/I2C peripherals provide additional bridges for legacy peripherals, while XGATE handles the time-critical LIN schedule table. AEC-Q100 qualification and 128 KB Flash support gateway firmware, network management, and diagnostic stacks. The 112-LQFP package offers the I/O headroom to simultaneously drive two LIN channels and a CAN channel, which is a typical 1×CAN + 2×LIN gateway topology.

Zusammenfassung der empfohlenen Produkte

MC9S12XDT512MAA NXP Semiconductors Verwendet in: Automotive Body Control Module (BCM), Instrument Cluster Controller TJA1042T CAN transceiver companion Verwendet in: Automotive Body Control Module (BCM) MC9S12DG128MPV NXP Semiconductors Verwendet in: Automotive Body Control Module (BCM), Door/Seat/Lighting Module MC9S12XEQ384CAG NXP Semiconductors Verwendet in: HVAC Control Module, Industrial CAN Node TJA1057T Isolated CAN transceiver Verwendet in: HVAC Control Module S912XET512BMAGR NXP Semiconductors Verwendet in: Instrument Cluster Controller, LIN Master/Slave Gateway TJA1027T LIN transceiver for seat/lighting nodes Verwendet in: Door/Seat/Lighting Module, LIN Master/Slave Gateway TJA1051T Industrial-grade CAN transceiver Verwendet in: Industrial CAN Node
What is the core architecture of the S912XDG128F2MALR?
The S912XDG128F2MALR is built around the 16-bit HCS12X (S12X) CPU core running at up to 80 MHz. According to the NXP S12XDG128 datasheet, the S12X core is upward compatible with the classic HCS12 instruction set and adds an instruction queue, enhanced indexed addressing, and an XGATE peripheral co-processor for offloading interrupt-driven I/O. This makes the part a drop-in upgrade path for legacy HCS12 firmware.
Is the S912XDG128F2MALR still in production?
The S912XDG128F2MALR (and the tray variant S912XDG128F2MAL) are marked End of Life on the NXP product page. Last-time-buy stock is available through authorized distributors and franchised partners like Rochester Electronics. For new designs, NXP recommends the S12XE or S32K platforms; for legacy service, distributors remain the primary source.
How much Flash memory does the S912XDG128F2MALR have?
The S912XDG128F2MALR integrates 128 KB of on-chip Flash (128K x 8). This Flash is split into paged banks per the HCS12X memory map, with the XGATE vector table typically placed in a fixed non-paged region to guarantee deterministic interrupt servicing.
What package does the S912XDG128F2MALR use?
The S912XDG128F2MALR is housed in a 112-pin LQFP measuring 20 × 20 mm with a 0.5 mm pitch. The 112-pin variant exposes the full peripheral set including XGATE, all PWM channels, and the extended external bus; smaller pin-count devices in the same family omit several of these pins.
Is the S912XDG128F2MALR automotive qualified?
Yes. The S912XDG128F2MALR is AEC-Q100 qualified and rated for -40 °C to +125 °C operation. This makes it suitable for under-hood and body-domain automotive applications such as BCM, HVAC, and lighting modules.
Where can I buy the S912XDG128F2MALR today?
Authorized distributors currently list the S912XDG128F2MALR in stock, including DigiKey and Mouser, with prices around $18 at qty-1 as of 2026-10-19. Rochester Electronics also offers long-term continuity stock for legacy designs. Lead time for franchise orders is typically 4–8 weeks.
What is the price of the S912XDG128F2MALR?
Pricing for the S912XDG128F2MALR as of 2026-10-19 starts around $18.50 at qty-1 and drops to roughly $10.40 at qty-1000 on distributor websites. Because the part is EOL, prices may rise as stock tightens; OEMs with long programs should lock in last-time-buy quantities.
What is the lead time for S912XDG128F2MALR?
Current lead time for the S912XDG128F2MALR at franchise distributors is approximately 4–8 weeks as of 2026-10-19, with immediate shipment available from in-channel stock. Long-term supply contracts via Rochester Electronics can extend availability for 5+ years.
S912XDG128F2MALR vs S912XHZ512F1VAG - which should I use?
The S912XDG128F2MALR (112-LQFP, 128 KB Flash, 80 MHz) targets body/chassis modules with a larger Flash capacity on a 112-pin footprint. The S912XHZ512F1VAG (144-LQFP, 512 KB Flash) suits instrument cluster and gateway designs needing more code space. Choose the XDG variant for body control and the XHZ variant when you need headroom above 256 KB.
Can I replace the S912XDG128F2MALR with the S912XEP100W1MAL?
No - the S912XEP100W1MAL uses a 144-pin LQFP, while the S912XDG128F2MALR uses a 112-pin LQFP, so they are not pin-compatible drop-ins. Migrating between them requires PCB rework; however, both share the S12X core architecture, so firmware is largely portable.
Is there a drop-in replacement for the S912XDG128F2MALR?
A true pin-compatible drop-in for the S912XDG128F2MALR in 112-LQFP is the S912XDG128F2MAMR, the same die in tape-and-reel packaging. For long-term migration, NXP recommends the S12XEP family (144-LQFP) or the S32K ARM Cortex-M family, but those require PCB rework because the package footprint differs.
Where can I download the S912XDG128F2MALR datasheet PDF?
The official NXP S12XDG128 datasheet is available at https://www.nxp.com/docs/en/data-sheet/S12XDG128.pdf as of 2026-10-19. The same document covers the S912XDG128F2MALR and other flash-density variants. Pinout details appear in the S12XDG128 family reference manual.
Where can I find the S912XDG128F2MALR pinout?
The complete 112-LQFP pinout for the S912XDG128F2MALR is published in the NXP S12XDG128 reference manual, available on nxp.com. The 112-pin variant unlocks all PWM channels, the XGATE signals, and the expanded external bus interface for external memory.
What is the difference between the S912XDG128F2MALR and the S912XDG128F2MAL?
The S912XDG128F2MALR is the tape-and-reel (R) packaging variant, while the S912XDG128F2MAL is the tray (no suffix) variant. Both contain the same die and operate identically; only the shipping medium differs. Pick R for SMT production lines and omit the suffix for prototype or tray-fed assembly.
What CAN interfaces does the S912XDG128F2MALR have?
The S912XDG128F2MALR integrates one CAN 2.0 module per the S12X family reference manual. This is sufficient for body-domain networking where one CAN channel is dedicated to the chassis bus. For gateway designs needing multiple CAN buses, NXP recommends the larger S12XEP family with multiple CAN modules.

Technische Referenzdaten für S912XDG128F2MALR – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the S912XDG128F2MALR when you need a 16-bit S12X MCU with 128 KB Flash and XGATE in a 112-LQFP for automotive body-control, HVAC, or lighting modules, and your design is already locked to this part with last-time-buy stock available. For new designs, prefer the S912XET512BMAGR (112-LQFP, S12XE, 512 KB Flash) which shares the same footprint and offers upgrade headroom. For purely body-controller needs without XGATE requirements, MC9S12DG128MPV (112-LQFP, HCS12, 128 KB) is a lower-cost alternative. The MC9S12XEQ384CAG (112-LQFP, S12X, 384 KB Flash) is a sweet spot between capacity and price. Avoid the S912XHZ512F1VAG / S912XEP100W1MAL because their 144-LQFP footprint cannot replace the 112-LQFP XDG on the same PCB.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12XDT512MAA MC9S12XEQ384CAG MC9S12XDT256CAG MC9S12DG128MPV
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 112-LQFP (20x20 mm) 112-LQFP (MAA suffix) - same 112-LQFP (CAG suffix) - same 112-LQFP (CAG suffix) - same 112-LQFP (MPV suffix) - same
Core Architecture S12X (16-bit, 80 MHz) S12X (16-bit, 80 MHz) - same S12X (16-bit, 50 MHz) S12X (16-bit, 40 MHz) HCS12 (16-bit, 25 MHz) - different family
Flash Memory 128 KB 512 KB 384 KB 256 KB 128 KB
XGATE Co-processor Yes Yes Yes Yes No
CAN Modules 1 x CAN 2.0 1 x CAN 2.0 1 x CAN 2.0 1 x CAN 2.0 1 x CAN 2.0
Automotive Grade AEC-Q100, -40 to +125 °C AEC-Q100, -40 to +125 °C AEC-Q100, -40 to +125 °C AEC-Q100, -40 to +125 °C AEC-Q100, -40 to +125 °C
Lifecycle Obsolete (EOL) Active Active Active Active

Wichtigste Unterscheidungsmerkmale

  • S12X core with XGATE co-processor for deterministic I/O offload (vs. MC9S12DG128MPV)
  • 112-LQFP with full peripheral set exposed (vs. MC9S12DG128VFUE)
  • Canonical 128 KB Flash / 80 MHz S12X footprint option (vs. MC9S12XDT512MAA)

Designhinweise

The S912XDG128F2MALR is marked End of Life on the NXP product page, so new designs should consider the S12XE family (e.g., S912XET512BMAGR for same 112-LQFP footprint, 512 KB Flash) or the S32K ARM Cortex-M platform. Confirm last-time-buy availability with NXP field sales before committing a long-running program to this part. Rochester Electronics and authorised distributors can supply continuity stock for years, but pricing will rise as inventory shrinks.

Place the MCU's bulk decoupling capacitor (typically 4.7 µF or 10 µF) within 5 mm of the VDD pins, plus a 100 nF ceramic adjacent to each VDD/VSS pair. The 112-LQFP package has multiple VDD pins distributed across the perimeter - route each to its own decoupling via short, wide traces. For 5 V-tolerant pins, ensure your schematic respects the S12X family's absolute-maximum ratings, especially on ADC inputs that share analog supply pins.

Route the external bus interface (where present on the 112-LQFP variant) with matched-length traces and a ground reference plane, since the S12X family supports both single-chip and expanded modes. For CAN bus nodes, place the TJA1051/TJA1042 transceiver within 30 mm of the MCU CAN pins, and keep the CANH/CANL differential pair matched within 5 mm to maintain signal integrity at 1 Mbit/s. Twisted-pair wiring should be used off-board.

Compliance-Informationen

RoHS
Compliant
REACH
Unknown
AEC-Q100
Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant per NXP product page. AEC-Q100 qualified for automotive. REACH status not explicitly listed in distributor data - confirm with NXP environmental compliance documentation.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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S912XDG128F2MALR S912XDG128F2MALR datasheet NXP S912XDG128F2MALR 16-bit S12X MCU 128KB flash 112-LQFP AEC-Q100 automotive 16-bit microcontroller 80MHz S912XDG128F2MALR vs MC9S12XDT512MAA S912XDG128F2MALR drop-in replacement S912XDG128F2MALR buy S912XDG128F2MALR price stock body control module S12X MCU HCS12X S12X pinout 112-LQFP automotive CAN 2.0 microcontroller NXP

Verwandte Bauteile & Begriffe

NXP Semiconductors S912XDG128F2MALR S912XDG128F2MAL HCS12X HCS12 MC9S12XDT512MAA MC9S12XEQ384CAG MC9S12XDT256CAG MC9S12DG128MPV 16-bit microcontroller S12X core XGATE co-processor CAN 2.0 AEC-Q100 LQFP-112 automotive body control module instrument cluster MCU HVAC controller J1939 LIN gateway RoHS Rochester Electronics
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