TLE75080ESHXUMA1 - 8-Ch SPI High-Side Switch 330mA | Infineon
Teilenummer: TLE75080ESHXUMA1 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.62 | $3,62 |
| 10 | $3.18 | $31,80 |
| 100 | $2.71 | $271,00 |
| 500 | $2.34 | $1.170,00 |
| 1.000 | $2.05 | $2.050,00 |
TLE75080ESHXUMA1 Übersicht
Key features of this multichannel high-side switch include per-channel diagnostics (open load, short to battery, short to ground, overtemperature), parallel-input capability for direct MCU PWM control, a 16-bit SPI interface for configuration and status readback, and selectable latching or auto-restart fault behavior. The integrated charge pump drives the N-channel MOSFETs fully on at low battery voltage, achieving low R_DS(on) per channel. The Limp Home function allows a predefined safe output pattern if SPI communication is lost, critical for fail-operational body modules.
Technically, the TLE75080-ESH belongs to the high-side switch category within the broader power distribution IC hierarchy: high-side switch -> smart power switch -> power management IC -> semiconductor. It is designed as an alternative to discrete MOSFET + fuse combinations, replacing many components with one SPI-controlled block. Each channel's integrated protection eliminates the need for external sense resistors, TVS clamps, and PTCs in many 12 V load drive circuits.
Typical applications include automotive body control modules (BCM) driving lamps, LEDs, relays, and small motors; heating systems such as seat heaters and mirror heaters; industrial 24 V (rescaled) load switching; and energy/power distribution nodes in zonal E/E architectures. The PG-TSDSO-24-21 exposed-pad package enables direct PCB thermal dissipation without a heatsink at typical 12 V loads.
When designing with this device, follow Infineon's PCB layout guidance for the exposed thermal pad, keep the SPI bus length short, and add a reverse-polarity protection diode at VBAT. Decouple VBAT and VS pins with a 100 nF ceramic plus a low-ESR electrolytic capacitor as recommended in the TLE75080-ESH datasheet.
This page synthesizes distributor pricing, drop-in alternatives from the Infineon SPIDER family, and practical design notes for 12 V body-control applications that are not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für TLE75080ESHXUMA1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit TLE75080ESHXUMA1 (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature Range, Topology, MSL Level, Number of Channels.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TLE75080ESDXUMA1
✅ Drop-In✓ Auf Lager
$2.55 / Stück
Datenblatt ansehen →TLE75004EPDXUMA1
✅ Drop-In✓ Auf Lager
$0.93 / Stück
Datenblatt ansehen →TLE75008ESDXUMA1
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
BTS70081EPAXUMA1
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$0.96 / Stück
Datenblatt ansehen →BTS70121EPAXUMA1
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.05 / Stück
Datenblatt ansehen →TLE94003EPXUMA1
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.71 / Stück
Datenblatt ansehen →TLE75080ESHXUMA1 Grenzwerte & elektrische Eigenschaften
| Funktion | 8-channel high-side power switch with 16-bit SPI |
| Number of Channels | 8 |
| Channel Current (continuous) | 330 mA per channel |
| Topologie | High-side, N-channel MOSFET with charge pump |
| Schnittstelle | 16-bit SPI, plus parallel input |
| PWM Capability | Integrated PWM generators per channel |
| Nominal Supply Voltage (VBAT) | 12 V (automotive) |
| Limp Home Mode | Yes (predefined safe pattern on SPI loss) |
| Per-channel Diagnostics | Open load, short to GND, short to VBAT, overtemperature |
| Fault Behavior | Selectable latching or auto-restart |
| Gehäuse | PG-TSDSO-24-21 (TSDSO-24, exposed thermal pad) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 C to +150 C (junction, AEC-Q100) |
| Automotive Qualification | AEC-Q100 |
| RoHS-Status | Compliant |
| Technology Family | Infineon SPIDER (Smart Power) |
TLE75080ESHXUMA1 Pin-Konfiguration
| Pin 1 | OUT0 — High-side output channel 0 |
| Pin 2 | OUT1 — High-side output channel 1 |
| Pin 3 | OUT2 — High-side output channel 2 |
| Pin 4 | OUT3 — High-side output channel 3 |
| Pin 5 | GND — Ground reference |
| Pin 6 | OUT4 — High-side output channel 4 |
| Pin 7 | OUT5 — High-side output channel 5 |
| Pin 8 | OUT6 — High-side output channel 6 |
| Pin 9 | OUT7 — High-side output channel 7 |
| Pin 10 | VS — Supply voltage (12 V) |
| Pin 11 | VBAT — Battery supply (with reverse protection) |
| Pin 12 | CSN — SPI chip select (active low) |
| Pin 13 | SCLK — SPI clock input |
| Pin 14 | SDI — SPI data input |
| Pin 15 | SDO — SPI data output |
| Pin 16 | IN0 — Parallel input channel 0 (PWM/direct) |
| Pin 17 | IN1 — Parallel input channel 1 (PWM/direct) |
| Pin 18 | IN2 — Parallel input channel 2 (PWM/direct) |
| Pin 19 | IN3 — Parallel input channel 3 (PWM/direct) |
| Pin 20 | IN4 — Parallel input channel 4 (PWM/direct) |
| Pin 21 | IN5 — Parallel input channel 5 (PWM/direct) |
| Pin 22 | IN6 — Parallel input channel 6 (PWM/direct) |
| Pin 23 | IN7 — Parallel input channel 7 (PWM/direct) |
| Pin 24 | VCC — 5 V logic supply (for SPI interface) |
Typische Anwendungen
TLE75080ESHXUMA1 ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), Automotive LED Lighting Modules, Seat Heater and HVAC Load Switch, Zonal E/E Architecture Power Distribution, Industrial 24V Relay and Solenoid Driver, Automotive Mirror and Window Lifter.
Automotive Body Control Module (BCM)
The TLE75080ESHXUMA1's 8 independently-controlled 330 mA channels fit perfectly into a BCM driving turn signals, parking lamps, mirror heaters, and small relay coils. Each channel's integrated open-load and short-to-GND detection removes the need for external sense resistors, while the 16-bit SPI interface reduces MCU GPIO count versus discrete high-side switches. Limp Home mode ensures a fail-operational default pattern if SPI communication is lost during a transient - a hard requirement for ISO 26262 ASIL-B lighting functions. AEC-Q100 Grade 1 qualification over -40 C to +125 C supports under-hood and cabin mounting.
Empfohlen
Automotive LED Lighting Modules
Driving LED daytime running lights, rear lamp clusters, and interior ambient LEDs from a 12 V bus is a natural fit for the TLE75080ESHXUMA1 because each 330 mA channel can PWM-dim an LED string independently via the integrated PWM generators. The device's high PWM resolution and per-channel short-to-GND protection prevent catastrophic LED-string shorts from latching the whole module off. Compared to a discrete MOSFET + sense-resistor design, the TLE75080-ESH reduces BOM line items by 60-70% and shrinks PCB area, which matters for space-constrained lamp housings.
Empfohlen
Seat Heater and HVAC Load Switch
Seat heaters and HVAC flap motors typically require 4 to 8 PWM-switched 12 V resistive or inductive loads - exactly the use case the TLE75080ESHXUMA1 targets. Each channel's per-channel overtemperature latch-off and the device-wide Limp Home default pattern enable safe operation if a heater element shorts or the SPI master fails. The PG-TSDSO-24-21 exposed thermal pad dissipates the combined 8-channel conduction loss directly into the seat-module PCB copper, eliminating an external heatsink. AEC-Q100 Grade 1 thermal range matches the seat-module cabin environment.
Empfohlen
Zonal E/E Architecture Power Distribution
In emerging zonal architectures (where a zone ECU replaces distributed BCM/ECU functions), the TLE75080ESHXUMA1 acts as the local intelligent power-distribution node driving lamps, sensors, and small actuators from a 12 V bus. The 16-bit SPI interface integrates cleanly with CAN-FD to Ethernet zonal gateways, and the per-channel diagnostics feed back into the zone ECU's fault-management layer. Replacing 8 discrete high-side MOSFETs with one SPIDER switch reduces PCB area by approximately 50% and simplifies functional-safety analysis by consolidating protective functions into one qualified component.
Empfohlen
Industrial 24V Relay and Solenoid Driver
Although designed for 12 V automotive, the TLE75080ESHXUMA1 also serves in industrial 24 V PLC-style distributed I/O blocks where 8 low-current relays or solenoids need PWM or on/off control with diagnostics. The integrated charge pump maintains R_DS(on) at low supply voltages, and per-channel current sense supports open-coil detection - critical for process-control fail-safe requirements. Operating temperature range to +150 C junction supports sealed industrial enclosures. Infineon's SPIDER family is widely accepted in industrial-grade automation as a ruggedized alternative to discrete drivers.
Empfohlen
Automotive Mirror and Window Lifter
Mirror heaters, mirror-fold motors, and small window-lifter motors draw well within 330 mA per winding when segmented across multiple channels - making the TLE75080ESHXUMA1 a compact, diagnostic-rich alternative to discrete half-bridges. Each channel's short-to-VBAT and short-to-GND diagnostics detect pinched cables or motor winding shorts, while Limp Home mode defaults the mirror to a safe retracted position on SPI loss. The PG-TSDSO-24-21 small outline suits the tight door-module PCB, and the SPI bus reduces wiring harness complexity versus point-to-point GPIO control.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TLE75080ESHXUMA1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TLE75080ESDXUMA1 | TLE75004EPDXUMA1 | TLE75008ESDXUMA1 | BTS70081EPAXUMA1 | BTS70121EPAXUMA1 |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | PG-TSDSO-24-21 | PG-DSO-20 | PG-TSDSO-24 family | PG-DSO-20 | PG-TSDSO-24 family | PG-TSDSO-24 family |
| Number of Channels | 8 | 8 | 4 | 8 | 1 | 2 |
| Per-Channel Current | 330 mA | 330 mA | 330 mA | 330 mA | 7 A | 1.5 A |
| Interface | 16-bit SPI + parallel | 16-bit SPI + parallel | 16-bit SPI + parallel | 16-bit SPI + parallel | SPI (PROFET+) | SPI (PROFET+2ch) |
| Integrated PWM | Yes (per channel) | Yes | Yes | Yes | Yes | Yes |
| Automotive Grade (AEC-Q100) | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
Wichtigste Unterscheidungsmerkmale
- 8 channels in PG-TSDSO-24-21 with full SPI diagnostics (vs. TLE75080ESDXUMA1)
- Doubles channel count in same SPI family (vs. TLE75004EPDXUMA1)
- Higher per-channel current capability vs multi-channel SPIDER (vs. BTS70081EPAXUMA1)
Designhinweise
Estimated: At 12 V supply with all 8 channels active at 200 mA each (1.6 A total) and a typical R_DS(on) of 1 ohm per channel, total conduction loss is approximately 1.6 W. The PG-TSDSO-24-21 exposed thermal pad must be soldered to a PCB copper pour of at least 300 mm^2 on top and bottom layers connected by thermal vias (9-12 vias, 0.3 mm drill) to keep junction temperature below +150 C at +85 C ambient. Refer to Infineon application note 'Thermal Management of SPIDER Packages' for layout details.
Decouple VBAT and VS pins with a 100 nF X7R ceramic placed within 5 mm of the pins, plus a low-ESR electrolytic (>= 10 uF) on the battery rail. Keep the SPI bus traces (CSN, SCLK, SDI, SDO) shorter than 50 mm and route them over a continuous ground plane to limit EMI coupling into the high-current output traces. Add a TVS diode (e.g., SMAJ33CA) at VBAT for load-dump protection per ISO 7637-2.
Do not float the CSN pin - it must be pulled high during reset and configured by the MCU before any SPI transaction. The VCC logic supply must be present and within 4.5-5.5 V before VS ramps, otherwise the SPI registers are undefined. Avoid reversing VBAT polarity without an external reverse-polarity P-FET, as the TLE75080-ESH does not include reverse-battery protection on-die. Configure the Limp Home registers at startup so a defined safe output pattern is active immediately.
Route the 8 OUTx traces with adequate copper width for 330 mA continuous (>= 0.3 mm trace on outer layer or 0.2 mm on inner with 1 oz copper). Star-route the ground returns from each load back to a single GND pin via to avoid ground loops that confuse the current-sense diagnostics. Place the exposed thermal pad via array symmetrically under the package center per the land pattern in the Infineon package drawing.
The SPI bus on the TLE75080-ESH supports up to 5 MHz SCLK; above 2 MHz, add a 33 ohm series resistor at the SDO pin near the device to dampen reflections if the bus length exceeds 30 mm. Place a guard ground trace between the SPI bus and the parallel INx inputs to prevent switching transients on OUTx from coupling into the SPI SDI line and corrupting configuration writes.
Compliance-Informationen
AEC-Q100 qualified per Infineon product page. RoHS and REACH compliant. Lead-free (Pb-free) reflow compatible per JEDEC J-STD-020. Halogen-free per IEC 61249-2-21.
