TLE75080ESHXUMA1 - 8-Ch SPI High-Side Switch 330mA | Infineon
MPN: TLE75080ESHXUMA1 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.62 | $3.62 |
| 10 | $3.18 | $31.80 |
| 100 | $2.71 | $271.00 |
| 500 | $2.34 | $1,170.00 |
| 1,000 | $2.05 | $2,050.00 |
Drop-in alternatives for TLE75080ESHXUMA1 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet βTLE75080ESHXUMA1 Maximum Ratings & Electrical Characteristics
| Function | 8-channel high-side power switch with 16-bit SPI |
| Number of Channels | 8 |
| Channel Current (continuous) | 330 mA per channel |
| Topology | High-side, N-channel MOSFET with charge pump |
| Interface | 16-bit SPI, plus parallel input |
| PWM Capability | Integrated PWM generators per channel |
| Nominal Supply Voltage (VBAT) | 12 V (automotive) |
| Limp Home Mode | Yes (predefined safe pattern on SPI loss) |
| Per-channel Diagnostics | Open load, short to GND, short to VBAT, overtemperature |
| Fault Behavior | Selectable latching or auto-restart |
| Package | PG-TSDSO-24-21 (TSDSO-24, exposed thermal pad) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +150 C (junction, AEC-Q100) |
| Automotive Qualification | AEC-Q100 |
| RoHS Status | Compliant |
| Technology Family | Infineon SPIDER (Smart Power) |
TLE75080ESHXUMA1 Pin Configuration
| Pin 1 | OUT0 β High-side output channel 0 |
| Pin 2 | OUT1 β High-side output channel 1 |
| Pin 3 | OUT2 β High-side output channel 2 |
| Pin 4 | OUT3 β High-side output channel 3 |
| Pin 5 | GND β Ground reference |
| Pin 6 | OUT4 β High-side output channel 4 |
| Pin 7 | OUT5 β High-side output channel 5 |
| Pin 8 | OUT6 β High-side output channel 6 |
| Pin 9 | OUT7 β High-side output channel 7 |
| Pin 10 | VS β Supply voltage (12 V) |
| Pin 11 | VBAT β Battery supply (with reverse protection) |
| Pin 12 | CSN β SPI chip select (active low) |
| Pin 13 | SCLK β SPI clock input |
| Pin 14 | SDI β SPI data input |
| Pin 15 | SDO β SPI data output |
| Pin 16 | IN0 β Parallel input channel 0 (PWM/direct) |
| Pin 17 | IN1 β Parallel input channel 1 (PWM/direct) |
| Pin 18 | IN2 β Parallel input channel 2 (PWM/direct) |
| Pin 19 | IN3 β Parallel input channel 3 (PWM/direct) |
| Pin 20 | IN4 β Parallel input channel 4 (PWM/direct) |
| Pin 21 | IN5 β Parallel input channel 5 (PWM/direct) |
| Pin 22 | IN6 β Parallel input channel 6 (PWM/direct) |
| Pin 23 | IN7 β Parallel input channel 7 (PWM/direct) |
| Pin 24 | VCC β 5 V logic supply (for SPI interface) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this component. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TLE75080ESHXUMA1 is suitable for 6 applications: Automotive Body Control Module (BCM), Automotive LED Lighting Modules, Seat Heater and HVAC Load Switch, Zonal E/E Architecture Power Distribution, Industrial 24V Relay and Solenoid Driver, Automotive Mirror and Window Lifter.
Automotive Body Control Module (BCM)
The TLE75080ESHXUMA1's 8 independently-controlled 330 mA channels fit perfectly into a BCM driving turn signals, parking lamps, mirror heaters, and small relay coils. Each channel's integrated open-load and short-to-GND detection removes the need for external sense resistors, while the 16-bit SPI interface reduces MCU GPIO count versus discrete high-side switches. Limp Home mode ensures a fail-operational default pattern if SPI communication is lost during a transient - a hard requirement for ISO 26262 ASIL-B lighting functions. AEC-Q100 Grade 1 qualification over -40 C to +125 C supports under-hood and cabin mounting.
Recommended
Automotive LED Lighting Modules
Driving LED daytime running lights, rear lamp clusters, and interior ambient LEDs from a 12 V bus is a natural fit for the TLE75080ESHXUMA1 because each 330 mA channel can PWM-dim an LED string independently via the integrated PWM generators. The device's high PWM resolution and per-channel short-to-GND protection prevent catastrophic LED-string shorts from latching the whole module off. Compared to a discrete MOSFET + sense-resistor design, the TLE75080-ESH reduces BOM line items by 60-70% and shrinks PCB area, which matters for space-constrained lamp housings.
Recommended
Seat Heater and HVAC Load Switch
Seat heaters and HVAC flap motors typically require 4 to 8 PWM-switched 12 V resistive or inductive loads - exactly the use case the TLE75080ESHXUMA1 targets. Each channel's per-channel overtemperature latch-off and the device-wide Limp Home default pattern enable safe operation if a heater element shorts or the SPI master fails. The PG-TSDSO-24-21 exposed thermal pad dissipates the combined 8-channel conduction loss directly into the seat-module PCB copper, eliminating an external heatsink. AEC-Q100 Grade 1 thermal range matches the seat-module cabin environment.
Recommended
Zonal E/E Architecture Power Distribution
In emerging zonal architectures (where a zone ECU replaces distributed BCM/ECU functions), the TLE75080ESHXUMA1 acts as the local intelligent power-distribution node driving lamps, sensors, and small actuators from a 12 V bus. The 16-bit SPI interface integrates cleanly with CAN-FD to Ethernet zonal gateways, and the per-channel diagnostics feed back into the zone ECU's fault-management layer. Replacing 8 discrete high-side MOSFETs with one SPIDER switch reduces PCB area by approximately 50% and simplifies functional-safety analysis by consolidating protective functions into one qualified component.
Recommended
Industrial 24V Relay and Solenoid Driver
Although designed for 12 V automotive, the TLE75080ESHXUMA1 also serves in industrial 24 V PLC-style distributed I/O blocks where 8 low-current relays or solenoids need PWM or on/off control with diagnostics. The integrated charge pump maintains R_DS(on) at low supply voltages, and per-channel current sense supports open-coil detection - critical for process-control fail-safe requirements. Operating temperature range to +150 C junction supports sealed industrial enclosures. Infineon's SPIDER family is widely accepted in industrial-grade automation as a ruggedized alternative to discrete drivers.
Recommended
Automotive Mirror and Window Lifter
Mirror heaters, mirror-fold motors, and small window-lifter motors draw well within 330 mA per winding when segmented across multiple channels - making the TLE75080ESHXUMA1 a compact, diagnostic-rich alternative to discrete half-bridges. Each channel's short-to-VBAT and short-to-GND diagnostics detect pinched cables or motor winding shorts, while Limp Home mode defaults the mirror to a safe retracted position on SPI loss. The PG-TSDSO-24-21 small outline suits the tight door-module PCB, and the SPI bus reduces wiring harness complexity versus point-to-point GPIO control.
Recommended
Recommended Products Summary
Engineering reference data for TLE75080ESHXUMA1 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TLE75080ESDXUMA1 | TLE75004EPDXUMA1 | TLE75008ESDXUMA1 | BTS70081EPAXUMA1 | BTS70121EPAXUMA1 |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | PG-TSDSO-24-21 | PG-DSO-20 | PG-TSDSO-24 family | PG-DSO-20 | PG-TSDSO-24 family | PG-TSDSO-24 family |
| Number of Channels | 8 | 8 | 4 | 8 | 1 | 2 |
| Per-Channel Current | 330 mA | 330 mA | 330 mA | 330 mA | 7 A | 1.5 A |
| Interface | 16-bit SPI + parallel | 16-bit SPI + parallel | 16-bit SPI + parallel | 16-bit SPI + parallel | SPI (PROFET+) | SPI (PROFET+2ch) |
| Integrated PWM | Yes (per channel) | Yes | Yes | Yes | Yes | Yes |
| Limp Home Mode | Yes | Yes | Yes | Yes | [DATA_NEEDED] | [DATA_NEEDED] |
| Automotive Grade (AEC-Q100) | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Approx. Unit Price (qty 1) | $3.62 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- 8 channels in PG-TSDSO-24-21 with full SPI diagnostics (vs TLE75080ESDXUMA1)
- Doubles channel count in same SPI family (vs TLE75004EPDXUMA1)
- Higher per-channel current capability vs multi-channel SPIDER (vs BTS70081EPAXUMA1)
Design Notes
Estimated: At 12 V supply with all 8 channels active at 200 mA each (1.6 A total) and a typical R_DS(on) of 1 ohm per channel, total conduction loss is approximately 1.6 W. The PG-TSDSO-24-21 exposed thermal pad must be soldered to a PCB copper pour of at least 300 mm^2 on top and bottom layers connected by thermal vias (9-12 vias, 0.3 mm drill) to keep junction temperature below +150 C at +85 C ambient. Refer to Infineon application note 'Thermal Management of SPIDER Packages' for layout details.
Decouple VBAT and VS pins with a 100 nF X7R ceramic placed within 5 mm of the pins, plus a low-ESR electrolytic (>= 10 uF) on the battery rail. Keep the SPI bus traces (CSN, SCLK, SDI, SDO) shorter than 50 mm and route them over a continuous ground plane to limit EMI coupling into the high-current output traces. Add a TVS diode (e.g., SMAJ33CA) at VBAT for load-dump protection per ISO 7637-2.
Do not float the CSN pin - it must be pulled high during reset and configured by the MCU before any SPI transaction. The VCC logic supply must be present and within 4.5-5.5 V before VS ramps, otherwise the SPI registers are undefined. Avoid reversing VBAT polarity without an external reverse-polarity P-FET, as the TLE75080-ESH does not include reverse-battery protection on-die. Configure the Limp Home registers at startup so a defined safe output pattern is active immediately.
Route the 8 OUTx traces with adequate copper width for 330 mA continuous (>= 0.3 mm trace on outer layer or 0.2 mm on inner with 1 oz copper). Star-route the ground returns from each load back to a single GND pin via to avoid ground loops that confuse the current-sense diagnostics. Place the exposed thermal pad via array symmetrically under the package center per the land pattern in the Infineon package drawing.
The SPI bus on the TLE75080-ESH supports up to 5 MHz SCLK; above 2 MHz, add a 33 ohm series resistor at the SDO pin near the device to dampen reflections if the bus length exceeds 30 mm. Place a guard ground trace between the SPI bus and the parallel INx inputs to prevent switching transients on OUTx from coupling into the SPI SDI line and corrupting configuration writes.
Compliance Information
AEC-Q100 qualified per Infineon product page. RoHS and REACH compliant. Lead-free (Pb-free) reflow compatible per JEDEC J-STD-020. Halogen-free per IEC 61249-2-21.
