TUSB8041ARGCR - 4-Port USB 3.1 Hub Controller | Texas Instruments
Teilenummer: TUSB8041ARGCR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.95 | $89,50 |
| 100 | $7.65 | $765,00 |
| 500 | $6.84 | $3.420,00 |
| 1.000 | $5.95 | $5.950,00 |
TUSB8041ARGCR Übersicht
A USB hub is a USB class-defined device that expands a single upstream USB port into multiple downstream ports while managing power, enumeration, and transaction translation. The TUSB8041 family sits within the broader hierarchy of USB controllers, peripheral interface ICs, and interface ICs in the semiconductor taxonomy. It supports USB Type-A downstream ports and is commonly used to add four ports to a system with a single USB 3.0 upstream port.
Key features of the TUSB8041ARGCR include support for USB Battery Charging (BC) 1.2 charging downstream ports, integrated 5-V tolerant I/O, per-port power switching with individual enable control, and configuration via GPIO, I2C, or SMBus interfaces. The device also supports USB Type-C port-reversal logic when used with an external Type-C controller, and offers pin-selectable upstream port configuration. Internal spread-spectrum clocking reduces EMI on the SuperSpeed signal paths.
The architecture combines a USB 2.0 hub controller and a USB 3.0 hub controller on a single die, sharing common configuration logic. Per-port SuperSpeed PHY blocks operate independently, and traffic scheduling is managed by a hardware transaction translator. The device enumerates as a compound USB hub and supports standard USB hub class commands plus vendor-specific commands for charger-port behavior and GPIO control.
Typical applications include USB expansion in desktop motherboards, docking stations, automotive infotainment head units, industrial PCs, monitor USB hubs, and embedded computing platforms that require multiple downstream USB 3.0 ports from a single host connection. The wide industrial temperature support enables in-vehicle and factory-floor deployment.
When designing with this part, observe the PCB layout guidelines in the datasheet: keep the SuperSpeed differential pairs matched to 85 ohm differential impedance, decouple each VBUS supply pin with a 0.1 uF ceramic capacitor, and place the upstream port common-mode chokes close to the connector. Daisy-chained hubs are supported up to 5 tiers per USB specification.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical PCB layout notes not consolidated in the manufacturer datasheet alone.
Drop-in-Alternativen für TUSB8041ARGCR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit TUSB8041ARGCR (gleiche Bauform und Footprint) – abweichend in Configuration Interface, Package, Battery Charging Support, Function, USB Standard.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TUSB8041ARGCT
✅ Drop-In✓ Auf Lager
$5.95 / Stück
Datenblatt ansehen →TUSB8041RGCR
✅ Drop-In✓ Auf Lager
$4.05 / Stück
Datenblatt ansehen →TUSB8042RGCR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TUSB8041IRGCR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TUSB4041IPAPR
✅ Drop-In✓ Auf Lager
$2.33 / Stück
Datenblatt ansehen →TUSB8041ARGCR Technische Daten
| Manufacturer | Texas Instruments |
| Product Type | USB Hub Controller |
| USB Standard | USB 3.1 Gen 1 (USB 3.0 SuperSpeed) |
| Number of Downstream Ports | 4 |
| Maximum Data Rate | 5 Gbps (SuperSpeed) |
| Upstream Interface | USB 3.0 |
| Downstream Signaling | SS (5 Gbps), HS (480 Mbps), FS (12 Mbps), LS (1.5 Mbps) |
| Configuration Interface | USB, GPIO, I2C, SMBus |
| Gehäuse | 64-VQFN (RGC) 9x9 mm with exposed pad |
| Montageart | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| Operating Temperature (Commercial) | 0 C to +70 C |
| Battery Charging Support | USB Battery Charging 1.2 charging downstream ports |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
TUSB8041ARGCR 64-vqfn (rgc) 9x9 mm with exposed pad Pinbelegungsleitfaden
Pinbelegung für TUSB8041ARGCR (64-vqfn (rgc) 9x9 mm with exposed pad-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für TUSB8041ARGCR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
TUSB8041ARGCR ist geeignet für 6 Anwendungs: Desktop Motherboard USB Expansion, USB Type-C Docking Station Hub, Automotive Infotainment Hub, Industrial PC USB Expansion, USB Monitor and Display Hub, Embedded Computing Platform Hub.
Desktop Motherboard USB Expansion
The TUSB8041ARGCR expands a single motherboard USB 3.0 upstream port into four downstream SuperSpeed ports with 5 Gbps signaling per port. With USB Battery Charging 1.2 support on each downstream port, charging downstream devices meets the Apple 1A / 2.1A charging profiles. The 64-VQFN 9x9 mm package fits behind standard ATX rear I/O brackets and supports the GPIO/I2C/SMBus configuration path used by motherboard BIOS for per-port power enable.
Empfohlen
USB Type-C Docking Station Hub
When paired with an external Type-C controller such as the TUSB320, the TUSB8041ARGCR forms the four-port SuperSpeed hub inside docking stations. The TUSB8041A port-reversal logic interface enables host-side orientation handling. The 5 Gbps per-port bandwidth suits dual-display docking scenarios where the upstream Type-C connection multiplexes DisplayPort Alt-Mode plus four USB 3.0 downstream ports for peripherals.
Empfohlen
Automotive Infotainment Hub
The TUSB8041ARGCR industrial variant (TUSB8041IRGCR, -40C to +85C) provides in-vehicle head-unit USB expansion for rear-seat entertainment and passenger device charging. The four downstream USB 3.0 ports each support USB Battery Charging 1.2 for fast-charging phones and tablets. The VQFN-64 package withstands automotive thermal cycling and is supported by the TI USB 3.0 hub reference designs for infotainment.
Empfohlen
Industrial PC USB Expansion
The TUSB8041ARGCR provides rugged USB 3.0 port expansion in industrial PCs, HMI panels, and factory-floor controllers. The wide operating temperature range and per-port over-current protection support factory environments with ESD events and load transients. The SMBus configuration interface lets the embedded host controller dynamically enable/disable ports based on cable presence and device-class authentication.
Empfohlen
USB Monitor and Display Hub
The TUSB8041ARGCR is widely deployed inside computer monitors to provide USB 3.0 downstream ports for webcam, microphone, and downstream docking connections. The four-port count matches the typical 4-port USB hub embedded in modern QHD/4K monitors. The SuperSpeed signaling supports high-bandwidth webcam and conference-cam streams without compression, and USB Battery Charging 1.2 enables monitor-side device charging.
Empfohlen
Embedded Computing Platform Hub
Single-board computers and embedded modules often need to expose four USB 3.0 ports from a single onboard USB 3.0 host connection. The TUSB8041ARGCR in VQFN-64 9x9 mm package fits within standard 2.5-inch SBC outlines and provides industrial temperature variants for outdoor/edge deployments. The hub supports USB-stick boot and recovery media at SuperSpeed rates, accelerating firmware update workflows.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TUSB8041ARGCR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TUSB8041ARGCT | TUSB8041RGCR | TUSB8042RGCR | TUSB4041IPAPR |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | VQFN-64 (RGC) 9x9 mm | VQFN-64 (RGC) 9x9 mm - same | VQFN-64 (RGC) 9x9 mm - same | VQFN-64 (RGC) 9x9 mm - same | HTQFP-64 (PAP) - same pin count, different package |
| Number of Downstream Ports | 4 | 4 | 4 | 4 (TUSB8042 family) | 4 |
| Maximum Data Rate | 5 Gbps (USB 3.1 Gen 1) | 5 Gbps | 5 Gbps | 5 Gbps | 5 Gbps |
| Operating Temperature | 0 C to +70 C (commercial) | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | -40 C to +85 C (industrial) |
| USB Battery Charging 1.2 | Yes (per-port) | Yes | Yes | Yes | Yes |
| Configuration Interface | GPIO, I2C, SMBus | GPIO, I2C, SMBus | GPIO, I2C, SMBus | GPIO, I2C, SMBus | GPIO, I2C |
| Reel Quantity | 2,500 (large reel) | 250 (small reel) | 2,500 | 2,500 | 1,000 |
Wichtigste Unterscheidungsmerkmale
- Integrated spread-spectrum clocking on SuperSpeed PHY reduces EMI vs competing hubs (vs. TUSB8041RGCR (pre-A silicon))
- Battery Charging 1.2 charging downstream port support on every downstream port (vs. TUSB4041IPAPR)
- Industry-standard VQFN-64 footprint with the broadest ecosystem of reference designs (vs. TUSB8042RGCR)
Designhinweise
Maintain 85 ohm differential impedance for SuperSpeed differential pairs (TX/RX on each downstream port). Reference the TI TUSB8041A datasheet High-Speed Routing Recommendations: keep intra-pair skew below 4 ps, inter-pair length matching within 150 mils, and place the common-mode choke within 200 mils of the USB connector. Use a continuous reference ground plane on layer 2 beneath all SuperSpeed pairs to control impedance discontinuities at vias.
Decouple each VBUS and 3.3V supply pin with a 0.1 uF ceramic capacitor placed within 50 mils of the pin, plus a 10 uF bulk capacitor per the datasheet reference schematic. Per-port VBUS current can reach 900 mA (USB 3.0 inrush); size upstream power path with at least 4 A capacity and add a TVS diode (e.g. SMBJ5.0CA) on each downstream VBUS to absorb ESD and hot-plug transients.
Do not confuse TUSB8041A with the older TUSB8041: the TUSB8041A silicon removes the requirement for a 4.7 kohm pull-down on pin 49 test pad, simplifying BOM but breaking direct compatibility with legacy PCBs that relied on that pin. Also verify the operating-temperature grade: TUSB8041ARGCR is commercial (0 C to +70 C), while the industrial equivalent is TUSB8041IRGCR (-40 C to +85 C). Both share the same 64-VQFN footprint.
The 64-VQFN (RGC) package with exposed pad has a theta_JA of approximately 28 C/W on a standard 4-layer JEDEC test PCB. With the hub drawing 500-800 mW typical, junction temperature rise is roughly 14-22 C above ambient. For enclosed designs without airflow, solder the exposed pad to a thermal copper pour of at least 1 square inch to keep junction temperature below 100 C across the full commercial operating range.
Compliance-Informationen
RoHS and lead-free per TI product page and distributor listings. AEC-Q100 qualification not available for the commercial TUSB8041ARGCR; choose TUSB8041IRGCR industrial variant for AEC-Q100 applications.
