TUSB8041ARGCR - 4-Port USB 3.1 Hub Controller | Texas Instruments
MPN: TUSB8041ARGCR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.95 | $89.50 |
| 100 | $7.65 | $765.00 |
| 500 | $6.84 | $3,420.00 |
| 1,000 | $5.95 | $5,950.00 |
TUSB8041ARGCR Overview
A USB hub is a USB class-defined device that expands a single upstream USB port into multiple downstream ports while managing power, enumeration, and transaction translation. The TUSB8041 family sits within the broader hierarchy of USB controllers, peripheral interface ICs, and interface ICs in the semiconductor taxonomy. It supports USB Type-A downstream ports and is commonly used to add four ports to a system with a single USB 3.0 upstream port.
Key features of the TUSB8041ARGCR include support for USB Battery Charging (BC) 1.2 charging downstream ports, integrated 5-V tolerant I/O, per-port power switching with individual enable control, and configuration via GPIO, I2C, or SMBus interfaces. The device also supports USB Type-C port-reversal logic when used with an external Type-C controller, and offers pin-selectable upstream port configuration. Internal spread-spectrum clocking reduces EMI on the SuperSpeed signal paths.
The architecture combines a USB 2.0 hub controller and a USB 3.0 hub controller on a single die, sharing common configuration logic. Per-port SuperSpeed PHY blocks operate independently, and traffic scheduling is managed by a hardware transaction translator. The device enumerates as a compound USB hub and supports standard USB hub class commands plus vendor-specific commands for charger-port behavior and GPIO control.
Typical applications include USB expansion in desktop motherboards, docking stations, automotive infotainment head units, industrial PCs, monitor USB hubs, and embedded computing platforms that require multiple downstream USB 3.0 ports from a single host connection. The wide industrial temperature support enables in-vehicle and factory-floor deployment.
When designing with this part, observe the PCB layout guidelines in the datasheet: keep the SuperSpeed differential pairs matched to 85 ohm differential impedance, decouple each VBUS supply pin with a 0.1 uF ceramic capacitor, and place the upstream port common-mode chokes close to the connector. Daisy-chained hubs are supported up to 5 tiers per USB specification.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical PCB layout notes not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for TUSB8041ARGCR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with TUSB8041ARGCR (same form factor and footprint) — differing in Configuration Interface, Package, Battery Charging Support, Function, USB Standard.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TUSB8041ARGCT
✅ Drop-In✓ In Stock
$5.95 / Unit
View Datasheet →TUSB8041RGCR
✅ Drop-In✓ In Stock
$4.05 / Unit
View Datasheet →TUSB8042RGCR
✅ Drop-In📋 Reference alternative (not in catalog)
TUSB8041IRGCR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TUSB4041IPAPR
✅ Drop-In✓ In Stock
$2.33 / Unit
View Datasheet →TUSB8041ARGCR Specifications
| Manufacturer | Texas Instruments |
| Product Type | USB Hub Controller |
| USB Standard | USB 3.1 Gen 1 (USB 3.0 SuperSpeed) |
| Number of Downstream Ports | 4 |
| Maximum Data Rate | 5 Gbps (SuperSpeed) |
| Upstream Interface | USB 3.0 |
| Downstream Signaling | SS (5 Gbps), HS (480 Mbps), FS (12 Mbps), LS (1.5 Mbps) |
| Configuration Interface | USB, GPIO, I2C, SMBus |
| Package | 64-VQFN (RGC) 9x9 mm with exposed pad |
| Mounting Type | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Operating Temperature (Commercial) | 0 C to +70 C |
| Battery Charging Support | USB Battery Charging 1.2 charging downstream ports |
| RoHS Status | Compliant |
| Lead-Free | Yes |
TUSB8041ARGCR 64-vqfn (rgc) 9x9 mm with exposed pad Pin Configuration Guide
Pin configuration for TUSB8041ARGCR (64-vqfn (rgc) 9x9 mm with exposed pad package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for TUSB8041ARGCR.
Refer to the datasheet for full pin configuration.
Typical Applications
TUSB8041ARGCR is suitable for 6 applications: Desktop Motherboard USB Expansion, USB Type-C Docking Station Hub, Automotive Infotainment Hub, Industrial PC USB Expansion, USB Monitor and Display Hub, Embedded Computing Platform Hub.
Desktop Motherboard USB Expansion
The TUSB8041ARGCR expands a single motherboard USB 3.0 upstream port into four downstream SuperSpeed ports with 5 Gbps signaling per port. With USB Battery Charging 1.2 support on each downstream port, charging downstream devices meets the Apple 1A / 2.1A charging profiles. The 64-VQFN 9x9 mm package fits behind standard ATX rear I/O brackets and supports the GPIO/I2C/SMBus configuration path used by motherboard BIOS for per-port power enable.
Recommended
USB Type-C Docking Station Hub
When paired with an external Type-C controller such as the TUSB320, the TUSB8041ARGCR forms the four-port SuperSpeed hub inside docking stations. The TUSB8041A port-reversal logic interface enables host-side orientation handling. The 5 Gbps per-port bandwidth suits dual-display docking scenarios where the upstream Type-C connection multiplexes DisplayPort Alt-Mode plus four USB 3.0 downstream ports for peripherals.
Recommended
Automotive Infotainment Hub
The TUSB8041ARGCR industrial variant (TUSB8041IRGCR, -40C to +85C) provides in-vehicle head-unit USB expansion for rear-seat entertainment and passenger device charging. The four downstream USB 3.0 ports each support USB Battery Charging 1.2 for fast-charging phones and tablets. The VQFN-64 package withstands automotive thermal cycling and is supported by the TI USB 3.0 hub reference designs for infotainment.
Recommended
Industrial PC USB Expansion
The TUSB8041ARGCR provides rugged USB 3.0 port expansion in industrial PCs, HMI panels, and factory-floor controllers. The wide operating temperature range and per-port over-current protection support factory environments with ESD events and load transients. The SMBus configuration interface lets the embedded host controller dynamically enable/disable ports based on cable presence and device-class authentication.
Recommended
USB Monitor and Display Hub
The TUSB8041ARGCR is widely deployed inside computer monitors to provide USB 3.0 downstream ports for webcam, microphone, and downstream docking connections. The four-port count matches the typical 4-port USB hub embedded in modern QHD/4K monitors. The SuperSpeed signaling supports high-bandwidth webcam and conference-cam streams without compression, and USB Battery Charging 1.2 enables monitor-side device charging.
Recommended
Embedded Computing Platform Hub
Single-board computers and embedded modules often need to expose four USB 3.0 ports from a single onboard USB 3.0 host connection. The TUSB8041ARGCR in VQFN-64 9x9 mm package fits within standard 2.5-inch SBC outlines and provides industrial temperature variants for outdoor/edge deployments. The hub supports USB-stick boot and recovery media at SuperSpeed rates, accelerating firmware update workflows.
Recommended
Recommended Products Summary
Engineering reference data for TUSB8041ARGCR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TUSB8041ARGCT | TUSB8041RGCR | TUSB8042RGCR | TUSB4041IPAPR |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | VQFN-64 (RGC) 9x9 mm | VQFN-64 (RGC) 9x9 mm - same | VQFN-64 (RGC) 9x9 mm - same | VQFN-64 (RGC) 9x9 mm - same | HTQFP-64 (PAP) - same pin count, different package |
| Number of Downstream Ports | 4 | 4 | 4 | 4 (TUSB8042 family) | 4 |
| Maximum Data Rate | 5 Gbps (USB 3.1 Gen 1) | 5 Gbps | 5 Gbps | 5 Gbps | 5 Gbps |
| Operating Temperature | 0 C to +70 C (commercial) | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | -40 C to +85 C (industrial) |
| USB Battery Charging 1.2 | Yes (per-port) | Yes | Yes | Yes | Yes |
| Configuration Interface | GPIO, I2C, SMBus | GPIO, I2C, SMBus | GPIO, I2C, SMBus | GPIO, I2C, SMBus | GPIO, I2C |
| Reel Quantity | 2,500 (large reel) | 250 (small reel) | 2,500 | 2,500 | 1,000 |
Key Differentiators
- Integrated spread-spectrum clocking on SuperSpeed PHY reduces EMI vs competing hubs (vs TUSB8041RGCR (pre-A silicon))
- Battery Charging 1.2 charging downstream port support on every downstream port (vs TUSB4041IPAPR)
- Industry-standard VQFN-64 footprint with the broadest ecosystem of reference designs (vs TUSB8042RGCR)
Design Notes
Maintain 85 ohm differential impedance for SuperSpeed differential pairs (TX/RX on each downstream port). Reference the TI TUSB8041A datasheet High-Speed Routing Recommendations: keep intra-pair skew below 4 ps, inter-pair length matching within 150 mils, and place the common-mode choke within 200 mils of the USB connector. Use a continuous reference ground plane on layer 2 beneath all SuperSpeed pairs to control impedance discontinuities at vias.
Decouple each VBUS and 3.3V supply pin with a 0.1 uF ceramic capacitor placed within 50 mils of the pin, plus a 10 uF bulk capacitor per the datasheet reference schematic. Per-port VBUS current can reach 900 mA (USB 3.0 inrush); size upstream power path with at least 4 A capacity and add a TVS diode (e.g. SMBJ5.0CA) on each downstream VBUS to absorb ESD and hot-plug transients.
Do not confuse TUSB8041A with the older TUSB8041: the TUSB8041A silicon removes the requirement for a 4.7 kohm pull-down on pin 49 test pad, simplifying BOM but breaking direct compatibility with legacy PCBs that relied on that pin. Also verify the operating-temperature grade: TUSB8041ARGCR is commercial (0 C to +70 C), while the industrial equivalent is TUSB8041IRGCR (-40 C to +85 C). Both share the same 64-VQFN footprint.
The 64-VQFN (RGC) package with exposed pad has a theta_JA of approximately 28 C/W on a standard 4-layer JEDEC test PCB. With the hub drawing 500-800 mW typical, junction temperature rise is roughly 14-22 C above ambient. For enclosed designs without airflow, solder the exposed pad to a thermal copper pour of at least 1 square inch to keep junction temperature below 100 C across the full commercial operating range.
Compliance Information
RoHS and lead-free per TI product page and distributor listings. AEC-Q100 qualification not available for the commercial TUSB8041ARGCR; choose TUSB8041IRGCR industrial variant for AEC-Q100 applications.
