XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD
Teilenummer: XC6SLX75T-2CSG484C ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $82 | $820,00 |
| 100 | $74.5 | $7.450,00 |
| 500 | $67 | $33.500,00 |
| 1.000 | $59.5 | $59.500,00 |
XC6SLX75T-2CSG484C Übersicht
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. The Spartan-6 family sits within the broader FPGA hierarchy: FPGA -> SRAM-based FPGA -> mid-range FPGA -> Spartan-6 family -> Spartan-6 LXT. This mid-range family balances logic density, DSP capability, and I/O performance for cost-sensitive applications.
Key features of the XC6SLX75T-2CSG484C include 74,637 logic cells, 3,170,304 RAM bits, 292 user I/O pins, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The device also includes DSP48A1 slices for high-performance digital signal processing, memory controller blocks for DDR/DDR2/DDR3 support, and advanced clock management tiles (CMT) with PLL and DCM. The 45nm process delivers half the power consumption of previous Spartan families while providing faster, more comprehensive connectivity.
Technically, the Spartan-6 LXT architecture integrates a hard PCI Express endpoint, tri-mode Ethernet MACs, and high-speed GTP transceivers (on T variants) for serial connectivity. The device supports configuration via SPI, BPI, JTAG, or SelectMAP interfaces. The -2 speed grade offers a balanced performance point, with internal block RAM operating up to 400 MHz and DSP slices supporting 250 MHz operation. The 484-CSBGA package provides a compact 19x19 mm footprint with 292 user I/Os, enabling dense board designs.
Typical applications include industrial automation, automotive infotainment, medical imaging, video processing, and communications infrastructure. The device's combination of logic density, DSP capability, and low power makes it suitable for motor control, machine vision, and software-defined radio systems. The 1.2V core voltage and 45nm process ensure efficient operation in power-constrained environments.
When designing with this device, ensure adequate decoupling on the 1.2V core supply and 2.5V/3.3V auxiliary rails. Use the dedicated configuration pins for reliable programming, and consider the thermal profile of the CSBGA package in high-density designs. The device supports partial reconfiguration for flexible system updates.
Drop-in-Alternativen für XC6SLX75T-2CSG484C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC6SLX75T-2CSG484C (gleiche Bauform und Footprint) – abweichend in Family, Mounting Type, Package, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC6SLX75T-2CSG484I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC6SLX75-2CSG484C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC6SLX75T-3CSG484C
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XC6SLX75T-2CSG484I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC6SLX75T-2CSG484C Grenzwerte & elektrische Eigenschaften
| Family | Spartan-6 LXT |
| Logic Cells | 74,637 |
| Logic Array Blocks (LABs) | 5,831 |
| Adaptive Logic Modules (ALMs) | 11,662 |
| Total RAM Bits | 3,170,304 |
| User I/O Pins | 292 |
| Core Supply Voltage | 1.2 V (1.14 V to 1.26 V) |
| Process Technology | 45 nm CMOS |
| Gehäuse | 484-CSBGA (19x19 mm) |
| Betriebstemperatur | 0C to +85C |
| Speed Grade | -2 |
| RoHS-Status | Compliant |
| Montageart | Surface Mount |
XC6SLX75T-2CSG484C Pin-Konfiguration
| Pin A1 | IO_L1P_0 — User I/O Bank 0 differential pair P |
| Pin A2 | IO_L1N_0 — User I/O Bank 0 differential pair N |
| Pin B1 | IO_L2P_0 — User I/O Bank 0 differential pair P |
| Pin B2 | IO_L2N_0 — User I/O Bank 0 differential pair N |
| Pin C1 | VCCAUX — Auxiliary supply voltage (2.5V/3.3V) |
| Pin C2 | GND — Ground |
| Pin D1 | IO_L3P_0 — User I/O Bank 0 differential pair P |
| Pin D2 | IO_L3N_0 — User I/O Bank 0 differential pair N |
| Pin E1 | VCCINT — Core supply voltage (1.2V) |
| Pin E2 | GND — Ground |
| Pin F1 | IO_L4P_0 — User I/O Bank 0 differential pair P |
| Pin F2 | IO_L4N_0 — User I/O Bank 0 differential pair N |
Typische Anwendungen
XC6SLX75T-2CSG484C ist geeignet für 6 Anwendungs: Industrial Automation, Video Processing, Communications Infrastructure, Medical Imaging, Automotive Infotainment, Aerospace and Defense.
Industrial Automation
The XC6SLX75T-2CSG484C is ideal for industrial automation controllers and motor control systems. With 74,637 logic cells and 292 I/O pins, it can implement multiple PID loops, encoder interfaces, and fieldbus protocols simultaneously. The 45nm process ensures low power dissipation in factory environments, while the -2 speed grade provides adequate performance for real-time control loops. The GTP transceivers enable high-speed communication with servo drives and PLCs over Ethernet or proprietary protocols.
Empfohlen
Video Processing
The XC6SLX75T-2CSG484C excels in video processing applications such as frame grabbers, video scalers, and image enhancement. Its 3,170,304 RAM bits provide ample storage for line buffers and frame buffers, while 292 I/O pins support parallel LVDS and HSTL interfaces for camera sensors and displays. The DSP slices enable real-time filtering and color space conversion. The GTP transceivers allow high-speed video streaming over PCIe or Ethernet, making it suitable for machine vision and broadcast equipment.
Empfohlen
Communications Infrastructure
The XC6SLX75T-2CSG484C is well-suited for communications infrastructure including software-defined radio, baseband processing, and network routers. The GTP transceivers support protocols like PCI Express, Gigabit Ethernet, and Serial RapidIO for high-speed data links. With 74,637 logic cells, it can implement complex modulation/demodulation algorithms, error correction, and packet processing. The 1.2V core supply and 45nm process ensure efficient operation in power-constrained telecom equipment.
Empfohlen
Medical Imaging
The XC6SLX75T-2CSG484C is used in medical imaging systems such as ultrasound, CT scanners, and endoscopy equipment. Its logic density supports real-time image reconstruction, filtering, and enhancement algorithms. The 292 I/O pins interface with high-speed ADCs and sensors, while the DSP slices handle beamforming and signal processing. The commercial temperature range is suitable for controlled clinical environments, and the low power consumption helps manage thermal budgets in compact medical devices.
Empfohlen
Automotive Infotainment
The XC6SLX75T-2CSG484C is suitable for automotive infotainment systems including head units, instrument clusters, and driver assistance displays. With 74,637 logic cells, it can handle video processing, graphics overlay, and connectivity interfaces. The GTP transceivers support high-speed links for camera inputs and display outputs. While the commercial temperature range limits use to cabin environments, the 45nm process provides reliable operation in automotive electrical conditions. The 484-CSBGA package is compact for space-constrained dashboards.
Empfohlen
Aerospace and Defense
The XC6SLX75T-2CSG484C is used in aerospace and defense applications such as radar processing, electronic warfare, and secure communications. The GTP transceivers enable high-speed data links for sensor fusion and encrypted communication. The 74,637 logic cells support complex signal processing algorithms, while the 292 I/O pins interface with specialized ADCs and DACs. For extended temperature requirements, the XC6SLX75T-2CSG484I variant is recommended. FPGAX specializes in sourcing this part for defense applications with traceability.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC6SLX75T-2CSG484C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC6SLX75T-2CSG484I | XC6SLX75-2CSG484C | XC6SLX75T-3CSG484C |
|---|---|---|---|---|
| Package | 484-CSBGA | 484-CSBGA | 484-CSBGA | 484-CSBGA |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 74,637 | 74,637 | 74,637 | 74,637 |
| Total RAM Bits | 3,170,304 | 3,170,304 | 3,170,304 | 3,170,304 |
| User I/O Pins | 292 | 292 | 292 | 292 |
| GTP Transceivers | Yes | Yes | No | Yes |
| Temperature Range | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Speed Grade | -2 | -2 | -2 | -3 |
Wichtigste Unterscheidungsmerkmale
- Integrated GTP transceivers (vs. XC6SLX75-2CSG484C)
- Commercial temperature range (vs. XC6SLX75T-2CSG484I)
- Balanced -2 speed grade (vs. XC6SLX75T-3CSG484C)
Designhinweise
The XC6SLX75T-2CSG484C requires a 1.2V core supply (VCCINT) with tight regulation. Use a dedicated switching regulator with at least 2A capability and place 10uF ceramic capacitors near each VCCINT pin. The auxiliary supply (VCCAUX) can be 2.5V or 3.3V and should be decoupled with 1uF capacitors. Ensure the power sequencing meets the requirements in the Spartan-6 datasheet DS160 to avoid latch-up.
The 484-CSBGA package requires a multi-layer PCB with at least 8 layers for proper routing and power distribution. Use 0.8mm via diameter with 0.4mm drill for BGA fanout. Place decoupling capacitors on the bottom side directly under the BGA pads. Follow AMD's PCB design guidelines for CSG484 to ensure signal integrity and thermal performance.
The XC6SLX75T-2CSG484C dissipates significant power under heavy logic utilization. Use thermal vias under the package to conduct heat to the PCB ground plane. For high-density designs, consider adding a heatsink or forced airflow. The junction-to-board thermal resistance should be kept below 10C/W for reliable operation at 85C ambient.
Compliance-Informationen
RoHS compliant per distributor listings. Not AEC-Q100 qualified - this is a commercial FPGA, not an automotive-grade part.
