XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD
MPN: XC6SLX75T-2CSG484C β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82 | $820.00 |
| 100 | $74.5 | $7,450.00 |
| 500 | $67 | $33,500.00 |
| 1,000 | $59.5 | $59,500.00 |
Drop-in alternatives for XC6SLX75T-2CSG484C β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC6SLX75T-2CSG484I
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX75-2CSG484C
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX75T-3CSG484C
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX75T-2CSG484I
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX75T-2CSG484C Maximum Ratings & Electrical Characteristics
| Family | Spartan-6 LXT |
| Logic Cells | 74,637 |
| Logic Array Blocks (LABs) | 5,831 |
| Adaptive Logic Modules (ALMs) | 11,662 |
| Total RAM Bits | 3,170,304 |
| User I/O Pins | 292 |
| Core Supply Voltage | 1.2 V (1.14 V to 1.26 V) |
| Process Technology | 45 nm CMOS |
| Package | 484-CSBGA (19x19 mm) |
| Operating Temperature | 0C to +85C |
| Speed Grade | -2 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| Number of I/O Banks | [DATA_NEEDED: Number of I/O Banks] |
| DSP Slices | [DATA_NEEDED: DSP Slices] |
| Clock Management Tiles | [DATA_NEEDED: Clock Management Tiles] |
XC6SLX75T-2CSG484C Pin Configuration
| Pin A1 | IO_L1P_0 β User I/O Bank 0 differential pair P |
| Pin A2 | IO_L1N_0 β User I/O Bank 0 differential pair N |
| Pin B1 | IO_L2P_0 β User I/O Bank 0 differential pair P |
| Pin B2 | IO_L2N_0 β User I/O Bank 0 differential pair N |
| Pin C1 | VCCAUX β Auxiliary supply voltage (2.5V/3.3V) |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L3P_0 β User I/O Bank 0 differential pair P |
| Pin D2 | IO_L3N_0 β User I/O Bank 0 differential pair N |
| Pin E1 | VCCINT β Core supply voltage (1.2V) |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L4P_0 β User I/O Bank 0 differential pair P |
| Pin F2 | IO_L4N_0 β User I/O Bank 0 differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC6SLX75T-2CSG484C is suitable for 6 applications: Industrial Automation, Video Processing, Communications Infrastructure, Medical Imaging, Automotive Infotainment, Aerospace and Defense.
Industrial Automation
The XC6SLX75T-2CSG484C is ideal for industrial automation controllers and motor control systems. With 74,637 logic cells and 292 I/O pins, it can implement multiple PID loops, encoder interfaces, and fieldbus protocols simultaneously. The 45nm process ensures low power dissipation in factory environments, while the -2 speed grade provides adequate performance for real-time control loops. The GTP transceivers enable high-speed communication with servo drives and PLCs over Ethernet or proprietary protocols.
Recommended
Video Processing
The XC6SLX75T-2CSG484C excels in video processing applications such as frame grabbers, video scalers, and image enhancement. Its 3,170,304 RAM bits provide ample storage for line buffers and frame buffers, while 292 I/O pins support parallel LVDS and HSTL interfaces for camera sensors and displays. The DSP slices enable real-time filtering and color space conversion. The GTP transceivers allow high-speed video streaming over PCIe or Ethernet, making it suitable for machine vision and broadcast equipment.
Recommended
Communications Infrastructure
The XC6SLX75T-2CSG484C is well-suited for communications infrastructure including software-defined radio, baseband processing, and network routers. The GTP transceivers support protocols like PCI Express, Gigabit Ethernet, and Serial RapidIO for high-speed data links. With 74,637 logic cells, it can implement complex modulation/demodulation algorithms, error correction, and packet processing. The 1.2V core supply and 45nm process ensure efficient operation in power-constrained telecom equipment.
Recommended
Medical Imaging
The XC6SLX75T-2CSG484C is used in medical imaging systems such as ultrasound, CT scanners, and endoscopy equipment. Its logic density supports real-time image reconstruction, filtering, and enhancement algorithms. The 292 I/O pins interface with high-speed ADCs and sensors, while the DSP slices handle beamforming and signal processing. The commercial temperature range is suitable for controlled clinical environments, and the low power consumption helps manage thermal budgets in compact medical devices.
Recommended
Automotive Infotainment
The XC6SLX75T-2CSG484C is suitable for automotive infotainment systems including head units, instrument clusters, and driver assistance displays. With 74,637 logic cells, it can handle video processing, graphics overlay, and connectivity interfaces. The GTP transceivers support high-speed links for camera inputs and display outputs. While the commercial temperature range limits use to cabin environments, the 45nm process provides reliable operation in automotive electrical conditions. The 484-CSBGA package is compact for space-constrained dashboards.
Recommended
Aerospace and Defense
The XC6SLX75T-2CSG484C is used in aerospace and defense applications such as radar processing, electronic warfare, and secure communications. The GTP transceivers enable high-speed data links for sensor fusion and encrypted communication. The 74,637 logic cells support complex signal processing algorithms, while the 292 I/O pins interface with specialized ADCs and DACs. For extended temperature requirements, the XC6SLX75T-2CSG484I variant is recommended. FPGAX specializes in sourcing this part for defense applications with traceability.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX75T-2CSG484C β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX75T-2CSG484I | XC6SLX75-2CSG484C | XC6SLX75T-3CSG484C |
|---|---|---|---|---|
| Package | 484-CSBGA | 484-CSBGA | 484-CSBGA | 484-CSBGA |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 74,637 | 74,637 | 74,637 | 74,637 |
| Total RAM Bits | 3,170,304 | 3,170,304 | 3,170,304 | 3,170,304 |
| User I/O Pins | 292 | 292 | 292 | 292 |
| GTP Transceivers | Yes | Yes | No | Yes |
| Temperature Range | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Speed Grade | -2 | -2 | -2 | -3 |
Key Differentiators
- Integrated GTP transceivers (vs XC6SLX75-2CSG484C)
- Commercial temperature range (vs XC6SLX75T-2CSG484I)
- Balanced -2 speed grade (vs XC6SLX75T-3CSG484C)
Design Notes
The XC6SLX75T-2CSG484C requires a 1.2V core supply (VCCINT) with tight regulation. Use a dedicated switching regulator with at least 2A capability and place 10uF ceramic capacitors near each VCCINT pin. The auxiliary supply (VCCAUX) can be 2.5V or 3.3V and should be decoupled with 1uF capacitors. Ensure the power sequencing meets the requirements in the Spartan-6 datasheet DS160 to avoid latch-up.
The 484-CSBGA package requires a multi-layer PCB with at least 8 layers for proper routing and power distribution. Use 0.8mm via diameter with 0.4mm drill for BGA fanout. Place decoupling capacitors on the bottom side directly under the BGA pads. Follow AMD's PCB design guidelines for CSG484 to ensure signal integrity and thermal performance.
The XC6SLX75T-2CSG484C dissipates significant power under heavy logic utilization. Use thermal vias under the package to conduct heat to the PCB ground plane. For high-density designs, consider adding a heatsink or forced airflow. The junction-to-board thermal resistance should be kept below 10C/W for reliable operation at 85C ambient.
Compliance Information
RoHS compliant per distributor listings. Not AEC-Q100 qualified - this is a commercial FPGA, not an automotive-grade part.
