XC7A25T-1CPG238I - Artix-7 FPGA, 23K Logic Cells, 238-BGA | AMD
Teilenummer: XC7A25T-1CPG238I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $78.2 | $782,00 |
| 100 | $65.4 | $6.540,00 |
| 500 | $55.1 | $27.550,00 |
| 1.000 | $48.3 | $48.300,00 |
XC7A25T-1CPG238I Übersicht
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources such as Block RAM, DSP slices, and high-speed transceivers. Within the broader taxonomy, FPGAs sit between ASICs (fixed-function, high NRE) and general-purpose microcontrollers; FPGAs offer hardware-level parallelism and are deployed when the design must be re-programmed in the field or when deterministic latency is required. The Artix-7 series specifically bridges mid-range Spartan-6 and high-end Kintex-7 devices, balancing logic density with low static power.
Key features of the XC7A25T-1CPG238I include 23,360 logic cells (approximately 3,640 Logic Slices / 29,680 LUTs of fabric), 1,658,880 bits of Block RAM, 45 DSP48A1 slices for high-speed arithmetic, and integrated GTP serial transceivers supporting up to 6.6 Gb/s line rates. The device operates across an extended junction temperature range typical of industrial embedded systems. The 238-ball CSPBGA package uses a 10x10 mm footprint optimized for high-density PCB routing.
Architecturally, the Artix-7 uses a 6-input LUT fabric with dedicated carry chains, distributed RAM in slices, and on-chip Block RAM tiles supporting true dual-port access. The 28 nm HKMG process delivers up to 50% lower static power versus the prior 40 nm Spartan-6 generation, making the A25T family attractive for portable, fan-cooled, or sealed industrial enclosures.
Typical applications include industrial machine vision, motor control and robotics, medical imaging front-ends, software-defined radio baseband, low-cost serial connectivity bridges, and embedded vision processing pipelines. The device is supported by AMD Vivado Design Suite and the older ISE Design Suite, with free WebPack licenses covering the A25T.
When designing with the XC7A25T-1CPG238I, allocate GTP transceiver and Block RAM usage early, as these dedicated resources dictate device utilization and timing closure. The 238-ball CSPBGA requires PCB substrate design with matched impedance for the GTP lanes and proper decoupling; this part uses Xilinx's standard 7-series configuration scheme, which enables drop-in migration between A35T, A50T, and A100T parts in the same package.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für XC7A25T-1CPG238I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC7A25T-1CPG238I (gleiche Bauform und Footprint) – abweichend in Logic Cells, Package, Process Node, Temperature Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC7A25T-1CPG238C
✅ Drop-In✓ Auf Lager
$89.6 / Stück
Datenblatt ansehen →XC7A25T-2CPG238I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A25T-3CPG238I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A35T-1CPG238I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A15T-1CPG238I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A50T-1CPG238I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A75T-1CPG238I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A25T-1CPG238I Grenzwerte & elektrische Eigenschaften
| Family | Artix-7 |
| Logic Cells | 23,360 |
| Block RAM (bits) | 1,658,880 |
| DSP Slices | 45 |
| User I/Os | 112 |
| Speed Grade | -1 |
| Temperature Grade | Industrial (I) |
| Gehäuse | 238-ball CSPBGA (CPG) 10x10 mm |
| Process Node | 28 nm HKMG |
| Serial Transceivers | GTP (up to 6.6 Gb/s) |
| Configuration Interface | Xilinx 7-Series (SPI, BPI, JTAG) |
| Versorgungsspannung | 1.0 V core (VCCINT) |
| Betriebs-Sperrschichttemperatur | -40C to +100C |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
XC7A25T-1CPG238I Pin-Konfiguration
| Pin A1 | GND — Ground reference |
| Pin A2 | IO_L1N_0 — I/O bank 0, diff negative |
| Pin B1 | VCCO_0 — I/O bank 0 supply |
| Pin B2 | IO_L1P_0 — I/O bank 0, diff positive |
| Pin C1 | IO_L2N_0 — I/O bank 0 |
| Pin C2 | IO_L2P_0 — I/O bank 0 |
| Pin D1 | VCCINT — 1.0 V core supply |
| Pin D2 | VCCAUX — 1.8 V auxiliary supply |
| Pin E1 | MGTAVCC — GTP transceiver analog supply |
| Pin E2 | MGTAVTT — GTP transceiver termination supply |
| Pin F1 | MGTRREF — GTP reference resistor |
| Pin F2 | MGTREFCLK0P — GTP reference clock positive |
| Pin G1 | MGTREFCLK0N — GTP reference clock negative |
| Pin G2 | MGT_TX0P — GTP serial TX lane 0 positive |
| Pin H1 | MGT_TX0N — GTP serial TX lane 0 negative |
| Pin H2 | MGT_RX0P — GTP serial RX lane 0 positive |
| Pin J1 | MGT_RX0N — GTP serial RX lane 0 negative |
| Pin J2 | MGT_TX1P — GTP serial TX lane 1 positive |
| Pin K1 | MGT_TX1N — GTP serial TX lane 1 negative |
| Pin K2 | MGT_RX1P — GTP serial RX lane 1 positive |
| Pin L1 | MGT_RX1N — GTP serial RX lane 1 negative |
| Pin L2 | CCLK — Configuration clock |
| Pin M1 | DONE — Configuration DONE pin |
| Pin M2 | PROGRAM_B — Active-low program/reset |
| Pin N1 | INIT_B — Active-low init / config error |
| Pin N2 | DIN — Configuration data in |
| Pin P1 | TDO — JTAG TDO |
| Pin P2 | TCK — JTAG TCK |
Typische Anwendungen
XC7A25T-1CPG238I ist geeignet für 8 Anwendungs: Industrial Machine Vision, Motor Control and Robotics, Software-Defined Radio Baseband, Medical Imaging Front-End, Low-Cost Serial Connectivity Bridge, Embedded Vision / Display Processing, Portable / Battery-Powered Edge Compute, Aerospace / Drone Flight Control.
Industrial Machine Vision
The XC7A25T-1CPG238I fits industrial machine vision by combining 45 DSP slices for pixel-rate processing with low static power suitable for sealed IP67 enclosures. Designers can implement real-time Bayer demosaic, edge detection, and histogram pipelines running at 1080p60 while keeping the 238-CSPBGA cool via thermal pad copper. The industrial temperature grade ensures operation across -40C to +100C ambient swings typical of factory floors. Block RAM (1.65 Mbits) holds multiple frame buffers, and GTP transceivers stream processed video to a host SoC over a single GbE link. Xilinx 7-Series Video IP and the free Vivado WebPack license make entry cost minimal.
Empfohlen
Motor Control and Robotics
The XC7A25T-1CPG238I suits motor control and robotics with parallel multi-axis servo loops running in fabric at deterministic sub-microsecond latency. The 45 DSP slices handle Field-Oriented Control (FOC) math, while 112 user I/Os interface to incremental encoders, Hall sensors, and PWM drivers without an external bridge. Industrial temperature rating supports underhood and factory-cabinet deployments. Block RAM stores sine/cosine lookup tables for space-vector modulation. The 238-CSPBGA is footprint-compatible with the larger XC7A50T and XC7A75T, enabling PCB reuse as designs scale to multi-axis CNC or AGV platforms.
Empfohlen
Software-Defined Radio Baseband
The XC7A25T-1CPG238I enables compact SDR baseband designs leveraging its GTP transceivers (up to 6.6 Gb/s) for ADC-to-FPGA and FPGA-to-DAC links. The 45 DSP48A1 slices run FIR filters, FFTs, and digital downconverters at hundreds of MSPS. With 1.65 Mbits Block RAM, multiple channelization buffers fit on-chip, reducing external memory cost. The industrial temperature grade suits outdoor small-cell and tactical radio deployments. Designers can run open-source frameworks such as RFNoC and Open Source SDR with the free Vivado WebPack, making A25T a strong low-power alternative to Kintex-7 for sub-6 GHz systems.
Empfohlen
Medical Imaging Front-End
The XC7A25T-1CPG238I serves medical imaging front-ends - ultrasound beamforming, endoscopy preprocessing, and patient monitor signal conditioning - thanks to its parallel DSP throughput and low-latency fabric. Block RAM holds multiple scan-line buffers for line-by-line ultrasound reconstruction. Industrial temp grade supports clinical equipment operating in conditioned environments. The 238-CSPBGA's compact 10x10 mm footprint fits handheld probe enclosures. Designers can pair A25T with a low-power host MCU such as STM32 to deliver battery-operated portable imaging carts with deterministic image latency.
Empfohlen
Low-Cost Serial Connectivity Bridge
The XC7A25T-1CPG238I acts as a multi-protocol serial bridge - converting between PCIe, SATA, SFP+, USB 3.0, and custom LVDS links - using its integrated GTP transceivers at up to 6.6 Gb/s per lane. With 112 user I/Os, designers route multiple low-speed buses (I2C, SPI, UART, GPIO) through the fabric while high-speed lanes go through SERDES. Industrial temp grade fits factory and outdoor networking gear. The A25T is a popular replacement for aging Spartan-6 designs in protocol-converter cards, with the same Vivado toolchain shortening firmware port time.
Empfohlen
Embedded Vision / Display Processing
The XC7A25T-1CPG238I runs embedded vision and display pipelines - HDMI/DVI input processing, LCD timing controller, on-screen overlay generation - using parallel fabric and DSP for color space conversion, scaling, and sharpening. Block RAM stores multiple frame buffers and font glyph tables. Industrial temp grade supports outdoor signage and in-vehicle infotainment. The 112 user I/Os drive LVDS, CMOS camera interfaces, and RGB panels without external bridge ICs. Designers can use the free Vivado WebPack license and AMD Video IP cores for production-ready video pipelines.
Empfohlen
Portable / Battery-Powered Edge Compute
The XC7A25T-1CPG238I delivers low static power (~100 mW quiescent typical) on 28 nm HKMG, making it a strong fit for portable edge-AI inference, wearable medical patches, and field-deployed sensor hubs. Combined with 45 DSP slices and Block RAM, designers can run quantized CNN inference engines without an external ASIC. Industrial temp grade covers wearable and outdoor operating ranges. The 238-CSPBGA's small 10x10 mm footprint fits wrist and handheld form factors. Battery-powered designs benefit from the 1.0 V VCCINT core reducing DC-DC conversion overhead.
Empfohlen
Aerospace / Drone Flight Control
The XC7A25T-1CPG238I supports small-UAV flight controllers and aerospace payload processing where deterministic parallel processing and low SWaP matter. With 45 DSP slices, real-time sensor fusion (IMU + GPS + barometer + vision) runs in fabric at >1 kHz loop rates. Industrial temp grade covers most commercial drone operating envelopes; pair with component de-rating for high-altitude cold. The 238-CSPBGA is footprint-compatible with larger A35T/A50T for upgrade paths. Designers benefit from the mature 7-Series configuration and SEU-mitigation IP for reliability.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7A25T-1CPG238I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7A25T-1CPG238C | XC7A25T-2CPG238I | XC7A35T-1CPG238I | XC7A50T-1CPG238I |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 238-ball CSPBGA (CPG) 10x10 mm | 238-ball CSPBGA (CPG) - same | 238-ball CSPBGA (CPG) - same | 238-ball CSPBGA (CPG) - same | 238-ball CSPBGA (CPG) - same |
| Logic Cells | 23,360 | 23,360 | 23,360 | 33,280 (+42%) | 52,160 (+123%) |
| Block RAM (bits) | 1,658,880 | 1,658,880 | 1,658,880 | 2,401,920 (+45%) | 2,812,800 (+70%) |
| DSP Slices | 45 | 45 | 45 | 90 (+100%) | 120 (+167%) |
| Speed Grade | -1 | -1 | -2 (faster) | -1 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| GTP Transceivers | Yes (up to 6.6 Gb/s) | Yes (up to 6.6 Gb/s) | Yes (up to 6.6 Gb/s) | Yes (up to 6.6 Gb/s) | Yes (up to 6.6 Gb/s) |
| Approx Unit Price (qty 1) | USD 89.50 | USD 79.20 (commercial, lower) | USD 95.80 (faster grade, slightly higher) | USD 124.00 (higher density) | USD 198.00 (significantly higher) |
Wichtigste Unterscheidungsmerkmale
- Smallest Artix-7 with integrated GTP transceivers (vs. XC6SLX25 (Spartan-6))
- Footprint-compatible scale path within Artix-7 family (vs. Lattice ECP5-25F)
- Free Vivado WebPack support (vs. Intel Cyclone V)
Designhinweise
The XC7A25T-1CPG238I requires four supply rails: VCCINT (1.0 V core), VCCAUX (1.8 V auxiliary), VCCO (1.8-3.3 V per bank), and MGTAVCC/MGTAVTT (1.0/1.2 V for GTP transceivers). Use a dedicated LDO for each rail with bulk + 0.1 uF + 10 uF decoupling placed within 5 mm of each supply pin. Power sequencing per AMD 7-Series guidelines requires VCCINT to ramp before or simultaneously with VCCAUX; failure to sequence properly triggers POR and configuration loss.
The 238-ball CSPBGA has a thermal pad that must be soldered to a ground copper pour for heat dissipation. Without proper PCB thermal design, junction temperature can exceed the +100C industrial limit under sustained DSP load. Use at least 4 thermal vias in 0.3 mm pitch under the BGA center, and spread copper to the bottom layer for spreading resistance reduction. For high-utilization designs, simulate thermal airflow before enclosure design.
GTP transceiver traces require 100 ohm differential impedance with matched length within 150 mils of pair. Route on the top layer over a continuous ground plane with no signal crossovers. Use an AC-coupling capacitor (0.01 uF) between the FPGA GTX pin and the external connector. Maintain 3W spacing from other high-speed signals to avoid crosstalk. CPG238 uses 0.5 mm ball pitch - ensure PCB fabrication supports it (most 4-layer 0.8 mm core stackups do).
Decoupling capacitor placement for the XC7A25T-1CPG238I is critical: place 0.1 uF and 1 nF caps on every VCCO/VCCAUX pin pair within 2 mm trace length. Use a star-topology power plane routing for VCCINT to avoid IR-drop across the die. For high-utilization designs, isolate GTP power planes from digital switching noise using a pi-filter at the supply entry point.
Common pitfalls include: (1) failing to instantiate the STARTUPE2 primitive for 7-Series configuration, leaving CCLK floating; (2) omitting the external 4.7 kohm pull-up on DONE, causing JTAG reliability issues; (3) using a single LDO for VCCAUX and VCCO, which violates the 7-Series sequencing requirement; (4) not connecting all GND balls to the PCB, causing ground bounce. Always run AMD's Board Design Checklist before tape-out.
Compliance-Informationen
RoHS and REACH compliant per AMD-Xilinx product page. I temperature grade qualifies for industrial-grade reliability. AEC-Q100 not applicable - FPGAs are typically not AEC-Q100 qualified at the silicon level; automotive qualification is achieved through module-level certification.
